ZSPM4521AA1W datasheet, PDF - EEWORLD Datasheet

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ZSPM4521AA1W: Descriptionbattery management charging IC 7" reel; Categorysemiconductor Other integrated circuit (IC); File Size1MB，31 Pages; ManufacturerZentrum Mikroelektronik Dresden AG (IDT); Environmental Compliance

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ZSPM4521AA1W Overview

battery management charging IC 7" reel

ZSPM4521AA1W Parametric

Parameter Name	Attribute value
Manufacture	ZMDI
Product Category	Battery Manageme
RoHS	Yes
Battery Type	Li-I
Output Voltage	1.22 V
Output Curre	1.5 A
Operating Supply Voltage	5.3 V
Maximum Operating Temperature	+ 85 C
Minimum Operating Temperature	- 40 C
Package / Case	PQFN-16
Packaging	Reel
Charge Safety Timers	No Charge Safety Timers
Mounting Style	SMD/SMT
Operating Supply Curre	3 mA
Temperature Monitoring	No Temperature Monitoring

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Data Sheet

Rev. 1.00 / February 2013

ZSPM4521

High-Efficiency Charger for Li-Ion Batteries with Photovoltaic Sources

Power and Precision

ZSPM4521

High-Efficiency Charger for Li-Ion Batteries with Photovoltaic Sources

Contents

ZSPM4521 Characteristics............................................................................................................................... 6

1.1. Absolute Maximum Ratings ....................................................................................................................... 6

1.2. Thermal Characteristics ............................................................................................................................. 6

1.3. Recommended Operating Conditions ....................................................................................................... 7

1.4. Electrical Characteristics ........................................................................................................................... 7

1.5. I C™ Interface Timing Requirements ...................................................................................................... 11

Functional Description .................................................................................................................................... 12

2.1. Internal Protection ................................................................................................................................... 13

2.1.1. VIN Under-Voltage Lockout .............................................................................................................. 13

2.1.2. Internal Current Limit ........................................................................................................................ 13

2.1.3. Thermal Shutdown ............................................................................................................................ 13

2.1.4. VBAT Over-Voltage Protection ......................................................................................................... 13

2.2. Fault Handling.......................................................................................................................................... 14

2.2.1. NFLT Pin Functionality ...................................................................................................................... 14

2.2.2. Other Faults ...................................................................................................................................... 14

2.3. Serial Interface ........................................................................................................................................ 16

2.3.1. I C™ Subaddress Definition ............................................................................................................. 16

2.3.2. I C™ Bus Operation .......................................................................................................................... 16

2.4. Status and Configuration Registers ......................................................................................................... 18

Application Circuits ......................................................................................................................................... 23

3.1. Typical Application Circuit ....................................................................................................................... 23

3.2. Selection of External Components .......................................................................................................... 23

3.2.1. C

OUT

Output Capacitor ...................................................................................................................... 23

3.2.2. L

OUT

Output Inductor ......................................................................................................................... 23

3.2.3. C

Bypass Capacitor for Input from Photovoltaic Source ................................................................ 23

3.2.4. C

VDD

Bypass Capacitor for VDD Internal Reference Voltage Output ............................................... 24

3.2.5. R

SENSE

Output Sensing Resistor ....................................................................................................... 24

3.2.6. Pull-up Resistors ............................................................................................................................... 24

Pin Configuration and Package ...................................................................................................................... 25

4.1. ZSPM4521 Package Dimensions ............................................................................................................ 25

4.2. Pin-Out Assignments ............................................................................................................................... 26

4.3. Pin Description for 16-Pin PQFN (4 x 4 mm) .......................................................................................... 26

4.4. Package Markings ................................................................................................................................... 27

Layout Recommendations.............................................................................................................................. 28

5.1. Multi-Layer PCB Layout ........................................................................................................................... 28

5.2. Single-Layer PCB Layout ........................................................................................................................ 29

Ordering Information ...................................................................................................................................... 30

Related Documents ........................................................................................................................................ 30

Document Revision History ............................................................................................................................ 31

Data Sheet

February 14, 2013

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

4 of 31

ZSPM4521

High-Efficiency Charger for Li-Ion Batteries with Photovoltaic Sources

List of Figures

Figure 2.1

Figure 2.2

Figure 2.3

Figure 2.4

Figure 2.5

Figure 3.1

Figure 4.1

Figure 4.2

Figure 4.3

Figure 5.1

Figure 5.2

Figure 5.3

Figure 5.4

ZSPM4521 Block Diagram ............................................................................................................... 12

Charging State Diagram ................................................................................................................... 15

Subaddress in I C™ Transmission ................................................................................................... 16

I C™ Start / Stop Protocol ................................................................................................................ 17

I C™ Data Transmission Timing ...................................................................................................... 17

Typical Application Circuit for Charging a Lithium-Ion Battery via Photovoltaic Cells ...................... 23

PQFN-16 Package Dimensions ........................................................................................................ 25

ZSPM4521 Pin Assignments ............................................................................................................ 26

Marking Diagram 16-Pin PQFN (4 x 4 mm) ...................................................................................... 27

Package and PCB Land Configuration for Multi-Layer PCB ........................................................... 28

JEDEC Standard FR4 Multi-Layer Board – Cross-Sectional View ................................................... 28

Conducting Heat Away from the Die using an Exposed Pad Package ............................................ 29

Application Using a Single-Layer PCB ............................................................................................. 30

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 1.5

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 2.6

Table 2.7

Table 2.8

Table 2.9

Table 4.1

Absolute Maximum Ratings ................................................................................................................ 6

Thermal Characteristics ...................................................................................................................... 6

Recommended Operating Conditions ................................................................................................ 7

Electrical Characteristics .................................................................................................................... 7

I C™ Interface Timing Characteristics .............................................................................................. 11

HEX

) .............................................................................. 18

STATUS Register—Address 00

HEX

.................................................................................................. 18

Configuration Register CONFIG1—Address 02

HEX

.......................................................................... 19

Configuration Register CONFIG2—Address 03

HEX

.......................................................................... 19

Configuration Register CONFIG3—Address 04

HEX

.......................................................................... 20

Configuration Register CONFIG4—Address 05

HEX

.......................................................................... 20

Configuration Register CONFIG5—Address 06

HEX

.......................................................................... 21

Enable Configuration Register CONFIG_ENABLE—Address 11

HEX

................................................ 22

EEPROM Control Register EEPROM_CTRL—Address 12

HEX

........................................................ 22

Pin Description .................................................................................................................................. 26

Data Sheet

February 14, 2013

prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

5 of 31

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