Thick Film Chip Resistors
Thick Film Chip Resistors
0201, 0402, 0603, 0805, 1206,
1210, 1812, 2012, 2512
Type:
ERJ 1G, 2G, 3G, 6G, 8G, 14,
12, 12Z, 1T
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Features
q
Small size and lightweight
For PCB size reduction and lightweight products
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High reliability
Metal glaze thick film resistive element and three layers of electrodes result in high reliability
q
Matching with placement machine
Taping and bulk case packagings for automatic placement machine
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Solderability
Suitable for both reflow soldering and flow soldering
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Approved under the ISO 9001 system
Approved under the QS-9000 system
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Reference Standards
IEC 60115-8, JIS C 5201-8, EIAJ RC-2134A
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Explanation of Part Numbers
E
R
J
3
G
E
Y
J
1
0
2
V
½
When omitted, all the rest P/N factors shall be moved up respectively.
Thick Film Chip Resistors
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Construction
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Dimensions in mm (not to scale)
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12
(1812)
ERJ12Z
(2010)
ERJ1T
(2512)
Dimensions (mm)
L
W
a
b
t
0.60
±0.03
0.30
±0.03
0.15
±0.05
0.15
±0.05
0.25
±0.05
1.00
±0.05
0.50
±0.05
0.20
±0.10
0.25
±0.05
0.35
±0.05
1.60
±0.15
0.80
+0.15
0.30
±0.20
0.30
±0.15
0.45
±0.10
Ð0.05
2.00
±0.20
1.25
±0.10
0.40
±0.20
0.40
±0.20
0.60
±0.10
3.20
+0.05
1.60
+0.05
0.50
±0.20
0.50
±0.20
0.60
±0.10
Ð0.20
Ð0.15
3.20
±0.20
2.50
±0.20
0.50
±0.20
0.50
±0.20
0.60
±0.10
4.50
±0.20
3.20
±0.20
0.50
±0.20
0.50
±0.20
0.60
±0.10
5.00
±0.20
2.50
±0.20
0.60
±0.20
0.60
±0.20
0.60
±0.10
6.40
±0.20
3.20
±0.20
0.65
±0.20
0.60
±0.20
0.60
±0.10
Weight
(1000 pcs.)
0.15 g
0.8 g
2g
4g
10 g
16 g
27 g
27 g
45 g
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Ratings
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12, 12Z
(1812, 2010)
ERJ1T
(2512)
Power Rating Limiting Element Maximum Overload
Resistance
Voltage (Maximum Voltage
(2)
at 70 ¡C
Tolerance(%)
RCWV)
(1)
(V)
(W)
(V)
0.05
0.063
0.1
0.125
0.25
0.25
0.5
1
15
50
50
150
200
200
200
200
30
100
100
200
400
400
400
400
±5
±5
±5
±5
±5
±5
±5
±5
Resistance Range (Ω)
min.
10
1
1
1
1
1
1
1
max.
1 M
2.2 M
10 M
10 M
10 M
10 M
10 M
1 M
1 MΩ<:
Ð400 to
+150
10
Ω
to
1 MΩ:
±200
T.C.R.
Standard
×10
-6
/¡C
Resistance Values
(ppm/¡C)
<10 Ω:
Ð100 to
+600
E24
E24
E24
E24
E24
E24
E24
E24
Rated Current Maximum Overload Current
Jumper
1G
2G á 3G
6Gá8Gá14á12á12Zá1T
0.5 A
1 A
2 A
1A
2A
4A
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV=
√
Power Rating
×
Resistance Values, or Limiting Element Voltage
(max. RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5
×
Power Rating or max. Overload Voltage listed above
whichever less.
Thick Film Chip Resistors
Power Derating Curve
For resistors operated in ambient temperatures above
70 ¡C, power rating shall be derated in accordance
with the right figure.
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Packaging Methods
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Standard Quantity
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12,12Z
(1812, 2010)
ERJ1T
(2512)
Thickness
(mm)
0.25
0.35
0.45
0.6
0.6
0.6
0.6
0.6
Punched (Paper) Taping
(4 mm pitch)
10000 pcs./reel (2 mm pitch)
10000 pcs./reel (2 mm pitch)
10000 pcs./reel (2 mm pitch)
5000,10000 pcs./reel
5000,10000 pcs./reel
5000,10000 pcs./reel
5000 pcs./reel
5000 pcs./reel
4000 pcs./reel
50000 pcs./case
25000 pcs./case
10000 pcs./case
Embossed Taping
(4 mm pitch)
Bulk Case
q
Taping Reel
q
Bulk Case
(mm)
Type
BA
BB
BC
W
T
Dimensions
1G,2G,3G
9.0
±1.0
11.4
±2.0
0
(mm)
6G,8G,14
180.0
Ð3.0
60 min. 13.0
±1.0
12,12Z,1T
13.0
±1.0
15.4
±2.0
Note
BA:
10000 pcs./reel=255
20000 pcs./reel=330
Thick Film Chip Resistors
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Punched (Paper) Taping
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Embossed Taping
Type
1G
Dimensions
2G
3G
(mm)
6G
8G
A
0.40
±0.05
0.70
±0.05
1.10
±0.10
1.65
±0.15
2.00
±0.15
B
0.70
±0.05
1.20
±0.05
1.90
±0.10
2.50
±0.20
3.60
±0.20
P
2
W
F
E
Type
14
Dimensions
12
(mm)
12Z
1T
A
2.80
±0.20
3.50
±0.20
2.80
±0.20
3.60
±0.20
B
W
F
E
P
1
8.00
±0.20
3.50
±0.05
1.75
±0.10
3.50
±0.20
8.00
±0.30
3.50
±0.05
4.80
±0.20
1.75
±0.10
4.00
±0.10
5.30
±0.20
12.00
±0.30
5.50
±0.05
6.90
±0.20
P
0
4.00
±0.10
BD
0
1.50
+0.10
0
t
1.00
±0.10
BD
1
1 min.
1.5 min.
Type
P
1
1G
2.00
±0.10
Dimensions
2G
3G
(mm)
6G
4.00
±0.10
8G
P
0
BD
0
2.00
±0.05
4.00
±0.10
1.50
+0.10
0
T
0.30
±0.05
0.45
±0.05
0.64
±0.05
0.84
±0.05
Type
P
2
14
Dimensions
12
2.00
±0.05
(mm)
12Z
1T
Cautions for Safety
In the case of flow soldering, the land width must be smaller than the Chip Resistor width to control the solder amount
properly. Generally, the land width should be chip resistor width (W) 0.7 to 0.8 times of the width of chip resistor.
In the case of reflow soldering, solder amount can be adjusted, therefor the land width should be set to 1.0 to 1.3
times chip resistor width (W).
Type
(inches)
ERJ1G
(0201)
ERJ2G
(0402)
ERJ3G
(0603)
ERJ6G
(0805)
ERJ8G
(1206)
ERJ14
(1210)
ERJ12
(1812)
ERJ12Z
(2010)
ERJ1T
(2512)
Dimensions (mm)
a
0.3 to 0.4
0.5 to 0.6
0.7 to 0.9
1 to 1.4
2 to 2.4
2 to 2.4
3.3 to 3.7
3.6 to 4
5 to 5.4
b
0.8 to 0.9
1.4 to 1.6
2 to 2.2
3.2 to 3.8
4.4 to 5
4.4 to 5
5.7 to 6.5
6.2 to 7
7.6 to 8.6
c
0.25 to 0.35
0.4 to 0.6
0.8 to 1
0.9 to 1.4
1.2 to 1.8
1.8 to 2.8
2.3 to 3.5
1.8 to 2.8
2.3 to 3.5
1. If transient load (heavy load in a short time) like pulse is expected to be applied, carry out evaluation and
confirmation test with the resistors actually mounted on your own board.
When the load of more than rated power is applied under the load condition at steady state, it may
impair performance and/or reliability of resistor.
Never exceed the rated power.
2. Chlorine type or other high-activity flux is not recommended as the residue may affect performance or reliability of
resistors.
3. When soldering with soldering iron, never touch the body of the chip resistor with a tip of the soldering iron. When
using a soldering iron with a tip at high temperature, solder for a time as short as possible (three seconds or less
up to 350 ¡C).
4. Avoid physical shock to the resistor and nipping of the resistor with hard tool (a pair of pliers or tweezers) as it may
damage protective film or the body of resistor and may affect resistorÕs performance.
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