M24C02-RCS6P datasheet, PDF - EEWORLD Datasheet

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M24C02-RCS6P: DescriptionI2C/2-WIRE SERIAL EEPROM; Categorystorage storage; File Size368KB，37 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M24C02-RCS6P Overview

I2C/2-WIRE SERIAL EEPROM

M24C02-RCS6P Parametric

Parameter Name	Attribute value
Objectid	1279028743
package instruction	,
Reach Compliance Code	unknown
ECCN code	EAR99
Memory IC Type	EEPROM
Serial bus type	I2C

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M24C08-W M24C08-R

M24C08-F

8-Kbit serial I²C bus EEPROM

Datasheet

−

production data

Features

■

Compatible with all I

C bus modes:

– 400 kHz

– 100 kHz

Memory array:

– 8 Kbit (1 Kbyte) of EEPROM

– Page size: 16 bytes

Single supply voltage:

– M24C08-W: 2.5 V to 5.5 V

– M24C08-R: 1.8 V to 5.5 V

– M24C08-F: 1.7 V to 5.5 V

Write:

– Byte Write within 5 ms

– Page Write within 5 ms

Operating temperature range: from -40 °C up

to +85 °C

Random and sequential Read modes

Write protect of the whole memory array

Enhanced ESD/Latch-Up protection

More than 1 million Write cycles

More than 40-year data retention

Packages:

– RoHS compliant and halogen-free

(ECOPACK

)

UFDFPN8

(MC)

PDIP8 (BN)

(1)

SO8 (MN)

150 mil width

TSSOP8 (DW)

169 mil width

■

WLCSP (CS)

December 2012

This is information on a product in full production.

Doc ID 023924 Rev 1

1/37

www.st.com

Contents

M24C08-W M24C08-R M24C08-F

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

(ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.6.1

2.6.2

2.6.3

2.6.4

Operating supply voltage V

CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1

4.2

4.3

4.4

4.5

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1.1

5.1.2

5.1.3

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 17

5.2

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.2.1

5.2.2

5.2.3

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2/37

Doc ID 023924 Rev 1

List of tables

M24C08-W M24C08-R M24C08-F

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (voltage range F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC characteristics (M24C08-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DC characteristics (M24C08-R, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24C08-F, device ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

400 kHz AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

100 kHz AC characteristics (I

C Standard mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

TSSOP8 – 8-lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 27

SO8N – 8-lead plastic small outline, 150 mils body width, package data. . . . . . . . . . . . . . 28

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 29

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

5-bump WLCSP package data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

Thin 5-bump WLCSP package data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

4/37

Doc ID 023924 Rev 1

M24C08-W M24C08-R M24C08-F

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

WLCSP connections (top view, marking side, with balls on the underside) . . . . . . . . . . . . 7

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Maximum R

bus

value versus bus parasitic capacitance (C

bus

) for

an I

C bus at maximum frequency f

= 400 kHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

TSSOP8 – 8-lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 27

SO8N – 8-lead plastic small outline, 150 mils body width, package outline . . . . . . . . . . . . 28

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 29

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat no lead, package outline. . . . . . . 30

5-bump WLCSP package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

Thin 5-bump WLCSP package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Doc ID 023924 Rev 1

5/37

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