REVISIONS
LTR
C
DESCRIPTION
Redrawn with changes. Added device types 19 through 22. Added
vendor CAGE 65786 for device types 19 and 20.. Added vendor CAGE
61772 for devices 21 and 22. Corrected errors to Table I. Added pin 1
reference to case outline U. Editorial changes throughout.
DATE
(YR-MO-DA)
93-04-28
APPROVED
M. A. Frye
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
C
15
C
16
C
17
C
18
REV
SHEET
PREPARED BY
James E. Jamison
CHECKED BY
Charles Reusing
C
19
C
20
C
21
C
1
C
22
C
2
C
23
C
3
C
24
C
4
C
25
C
5
C
26
C
6
C
27
C
7
C
8
C
9
C
10
C
11
A
12
C
13
C
14
PMIC N/A
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
STANDARDIZED
MILITARY
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
APPROVED BY
Michael A. Frye
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1K X 8
DUAL PORT STATIC RANDOM ACCESS MEMORY
(SRAM), MONOLITHIC SILICON
DRAWING APPROVAL DATE
93-06-03
REVISION LEVEL
SIZE
CAGE CODE
AMSC N/A
A
SHEET
67268
1
OF
27
5962-86875
DESC FORM 193
JUL 91
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E118-93
1. SCOPE
1.1 Scope. This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883,
"Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-86875
01
X
X
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types shall identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
10
11
12
13
14
15
16
17
18
19
20
21
22
Generic number 1/
Circuit function
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Slave)
1K x 8 bit dual port CMOS SRAM (Master)
1K x 8 bit dual port CMOS SRAM (Slave)
Access time
90 ns
70 ns
55 ns
45 ns
90 ns (data retention)
70 ns (data retention)
55 ns (data retention)
45 ns (data retention)
90 ns
70 ns
55 ns
45 ns
90 ns (data retention)
70 ns (data retention)
55 ns (data retention)
45 ns (data retention)
35 ns
35 ns
35 ns
35 ns
35 ns (data retention)
35 ns (data retention)
1.2.2 Case outlines. The case outlines shall be as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
Descriptive designator
GDIP1-T48 or CDIP2-T48
See figure 1
CQCC1-N52
See figure 1
Terminals
48
48
52
48
Package style
dual-in-line
square leadless chip carrier
square leadless chip carrier
flat pack
1.2.3 Lead finish. The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit
or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and
interchangeable without preference.
1.3 Absolute maximum ratings. 2/
Supply voltage range (V
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V dc to +7.0 V dc
Input voltage range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V dc to +7.0 V dc
Output sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Output short circuit duration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 seconds
Power dissipation (P
D
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W
1/
2/
Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and will
also be listed in MIL-BUL-103.
All voltages referenced to GND.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
5962-86875
SHEET
C
2
Thermal resistance, junction-to-case (
JC
):
Case X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
C/W 3/
Case Y and U . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
C/W 3/
Case Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835
Junction temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150
C 4/
Temperature under bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55
C to +125
C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65
C to +150
C
Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300
C
1.4 Recommended operating conditions. 5/
Supply voltage range (V
CC
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.5 V dc to 5.5 V dc
Case operating temperature range (T
C
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55
C to +125
C
Minimum input high voltage level (V
IH
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2 V
Maximum input low voltage level (V
IL
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 V
2. APPLICABLE DOCUMENTS
2.1 Government specification, standard, and bulletin. Unless otherwise specified, the following specification, standard, and
bulletin, of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the
solicitation, form a part of this drawing to the extent specified herein.
SPECIFICATION
MILITARY
MIL-M-38510
STANDARD
MILITARY
MIL-STD-883
MIL-STD-1835
BULLETIN
MILITARY
MIL-BUL-103
- List of Standardized Military Drawing (SMD's).
- Test Methods and Procedures for Microelectronics.
- Microcircuit Case Outlines.
- Microcircuits, General Specification for.
(Copies of the specification, standard, and bulletin required by manufacturers in connection with specific acquisition functions
should be obtained from the contracting activity or as directed by the contracting activity.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing shall take precedence.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the
use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-M-38510 and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth tables. The truth tables shall be as specified on figure 3.
3/
4/
5/
When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated herein.
Maximum junction temperature (T
J
) may be increased to 175
C during the burn-in and steady state life test.
All voltages referenced to GND.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
5962-86875
SHEET
C
3
3.2.4 Block diagram. The block diagram shall be as specified on figure 4.
3.2.5 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.
Each coated microcircuit inspection lot (see inspection lot as defined in MIL-M-38510) shall be subjected to and pass the internal
moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor testing shall not
be decreased unless approved by the preparing activity. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests
for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the part number
listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103 (see 6.6 herein).
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-BUL-103 (see 6.6 herein). The certificate of compliance submitted to DESC-EC prior to listing as
an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-STD-883 (see 3.1 herein)
and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-STD-883 (see 3.1 herein) shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DESC-EC shall be required in accordance with MIL-STD-883 (see 3.1
herein).
3.9 Verification and review. DESC, DESC's agent, and the acquiring activity retain the option to review the manufacturer's facility
and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the
extent specified in MIL-STD-883 (see 3.1 herein).
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level control
and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs,
outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of
MIL-STD-883.
T
A
= +125
C, minimum.
(2)
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883
including groups A, B, C, and D inspections. The following additional criteria shall apply.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
5962-86875
SHEET
C
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
-55
C
T
C
+125
C
4.5 V
V
CC
5.5 V
unless otherwise specified
I
O
= -4.0 mA, V
IH
= 2.2 V,
V
IL
= 0.8 V
I
O
= 4.0 mA, V
IH
= 2.2 V,
V
IL
= 0.8 V
I
O
= 16 mA
Group A
subgroups
Device
type
Min
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
2.4
0.4
0.5
Limits
Max
V
V
V
Unit
High level output voltage
Low level output voltage
(I/O
0
- I/O
7
terminals only)
Low level open drain output
voltage
(B U
L
, B
R
,
L
,
S Y
U S Y I N T
and
R
terminals only)
I NT
High impedance output
leakage current
High level input voltage
Low level input voltage
Input leakage current
V
OH
V
OL1
V
OL2
I
OZ
V
IH
V
IL
I
IH
I
IL
CE = V
IH, VO
= GND to V
CC
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
All
All
01-04,
09-12,
19-20
06-08,
14-16
05, 13,
17, 18
21, 22
-10.0
2.2
10.0
µA
V
0.8
10.0
-10.0
65
V
µA
µA
mA
V
IH
= 5.5 V
V
IL
= GND
1, 2, 3
1, 2, 3
1, 2, 3
Operating supply current
(standby)
I
SB1
C
CE
L
=
E
R
V
IH
, both ports
standby, V
CC
= 5.5 V
55
45
60
135
125
110
100
150
mA
I
SB2
CE
L
or CE
R
V
IH
, one port
standby, active port outputs
open, V
CC
= 5.5 V
1, 2, 3
02- 04,
10-12
01, 09,
19, 20
06-08,
14-16
05, 13,
17, 18
21, 22
See footnotes a end of table.
SIZE
STANDARDIZED
MILITARY DRAWING
DEFENSE ELECTRONICS SUPPLY CENTER
DAYTON, OHIO 45444
DESC FORM 193A
JUL 91
A
REVISION LEVEL
5962-86875
SHEET
C
5
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