RS1A THRU RS1K
SURFACE MOUNT FAST SWITCHING RECTIFIER
Reverse Voltage -
50 to 800 Volts
DO-214AC
MODIFIED J-BEND
Forward Current -
1.0 Ampere
FEATURES
♦
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
♦
For surface mounted applications in order to optimize
board space
♦
Low profile package
♦
Built-in strain relief, ideal for
automated placement
♦
Fast switching for high efficiency
♦
Glass passivated chip junction
♦
High temperature soldering:
250°C/10 seconds at terminals
0.065 (1.65)
0.049 (1.25)
0.110 (2.79)
0.100 (2.54)
0.177 (4.50)
0.157 (3.99)
0.012 (0.305)
0.006 (0.152)
0.090 (2.29)
0.078 (1.98)
MECHANICAL DATA
0.008 (0.203) MAX.
0.208 (5.28)
0.194 (4.93)
0.060 (1.52)
0.030 (0.76)
Dimensions are in inches and (millimeters)
Case:
JEDEC DO-214AC molded plastic over
passivated chip
Terminals:
Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity:
Color band denotes cathode end
Weight:
0.002 ounce, 0.064 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS RS1A
RS1B
RB
RS1D
RD
RS1G
RG
RS1J
RJ
RS1K
RK
UNITS
Device marking code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
L
=90°C
Peak forward surge current
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method) T
L
=90°C
Maximum instantaneous forward voltage at 1.0A
Maximum DC reverse current
at rated DC blocking voltage
Maximum reverse recovery time
Typical junction capacitance
Maximum thermal resistance
T
A
=25°C
T
A
=125°C
(NOTE 1)
(NOTE 2)
(NOTE 3)
RA
V
RRM
V
RMS
V
DC
I
(AV)
50
35
50
100
70
100
200
140
200
1.0
400
280
400
600
420
600
800
500
800
Volts
Volts
Volts
Amp
I
FSM
V
F
I
R
t
rr
C
J
R
ΘJA
R
ΘJL
T
J
, T
STG
30.0
1.30
5.0
50.0
150
10.0
105.0
32.0
-55 to +150
250
7.0
Amps
Volts
µA
ns
pF
°C/W
°C
Operating junction and storage temperature range
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead mounted on
P.C.B. with 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas
4/98
RATINGS AND CHARACTERISTIC CURVES RS1A THRU RS1J
FIG. 1 - FORWARD CURRENT DERATING CURVE
PEAK FORWARD SURGE CURRENT,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
1.2
AVERAGE FORWARD CURRENT,
AMPERES
RESISTIVE OR INDUCTIVE LOAD
50
40
30
20
10
0
1.0
TL = 90°C
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
0.5
0
0
P.C.B. MOUNTED ON 0.2 x 0.2” (5.0 x 5.0mm)
COPPER PAD AREAS
20
40
60
80 100 120 140 160 180
1
10
NUMBER OF CYCLES AT 60 H
Z
100
LEAD TEMPERATURE, °C
FIG. 3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
30
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
30
10
TJ=125°C
INSTANTANEOUS FORWARD CURRENT,
AMPERES
10
T
J
=125°C
1
TJ=100°C
1
T
J
=25°C
0.1
0.1
TJ=25°C
0.01
0
20
40
60
80
100
PULSE WIDTH=300µs
1% DUTY CYCLE
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
0.01
0.4
0.6
0.8
1
1.0
1.2
1.4
1.6
1.8
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
TRANSIENT THERMAL IMPEDANCE (°C/W)
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
30
JUNCTION CAPACITANCE, pF
T
J
=25°C
f=1.0 MH
Z
Vsig=50mVp-p
100
MOUNTED ON 0.2 x 0.2” (5x5mm)
COPPER PAD AREA
10
10
1
1
10
REVERSE VOLTAGE, VOLTS
100
1
0.01
0.1
1
10
t, PULSE DURATION, SEC
Microcontroller MCU
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