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74HCT541PW,118

Description
buffers & line drivers octal buf/drivr 3-S
Categorylogic    logic   
File Size49KB,8 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74HCT541PW,118 Overview

buffers & line drivers octal buf/drivr 3-S

74HCT541PW,118 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP2
package instructionPLASTIC, TSSOP-20
Contacts20
Manufacturer packaging codeSOT360-1
Reach Compliance Codecompli
Other featuresWITH DUAL OUTPUT ENABLE
Control typeENABLE LOW
seriesHCT
JESD-30 codeR-PDSO-G20
JESD-609 codee4
length6.5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.006 A
Humidity sensitivity level1
Number of digits8
Number of functions1
Number of ports2
Number of terminals20
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP20,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply5 V
Prop。Delay @ Nom-Su42 ns
propagation delay (tpd)42 ns
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width4.4 mm
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT541
Octal buffer/line driver; 3-state
Product specification
File under Integrated Circuits, IC06
December 1990

74HCT541PW,118 Related Products

74HCT541PW,118 74HC541PW,112 74HCT541PW,112
Description buffers & line drivers octal buf/drivr 3-S buffers & line drivers octal buf/drv 3-S buffers & line drivers octal buf/drivr 3-S
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to
Maker NXP NXP NXP
Parts packaging code TSSOP2 TSSOP2 TSSOP2
package instruction PLASTIC, TSSOP-20 PLASTIC, TSSOP-20 TSSOP, TSSOP20,.25
Contacts 20 20 20
Manufacturer packaging code SOT360-1 SOT360-1 SOT360-1
Reach Compliance Code compli compli compli
Other features WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
Control type ENABLE LOW ENABLE LOW ENABLE LOW
series HCT HC/UH HCT
JESD-30 code R-PDSO-G20 R-PDSO-G20 R-PDSO-G20
JESD-609 code e4 e4 e4
length 6.5 mm 6.5 mm 6.5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.006 A 0.006 A 0.006 A
Humidity sensitivity level 1 1 1
Number of digits 8 8 8
Number of functions 1 1 1
Number of ports 2 2 2
Number of terminals 20 20 20
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP
Encapsulate equivalent code TSSOP20,.25 TSSOP20,.25 TSSOP20,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TUBE TUBE
Peak Reflow Temperature (Celsius) 260 260 260
power supply 5 V 2/6 V 5 V
Prop。Delay @ Nom-Su 42 ns 35 ns 42 ns
propagation delay (tpd) 42 ns 35 ns 42 ns
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 5.5 V 6 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 2 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30
width 4.4 mm 4.4 mm 4.4 mm
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