Shock Sensor Signal Processing IC
BD3893FV
1.15
±
0.1 6.4
±
0.3
0.1
4.4
±
0.2
1
8
0.65
Features
1) Available for shock sensor of voltage sensitivity type
and electric charge sensitivity type
2) Built-in 50MΩ of resistance for pre-amplifier
3) Available for applications of flag detection type and
analog signal output type
4) Built-in secondary LPF
5) Cut-off frequency of LPF can be changed to 2k, 4k, 8k and 12k
6) Internal reference voltage selectable
(Resistance split voltage, band gap voltage)
Applications
HDD, CD, DVD drive
Absolute Maximum Ratings (Ta=25˚C)
Parameter
Supply voltage
Terminal voltage
Storage temperature range
Power dissipation
Operating temperature range
Symbol
V
DD
V
IN
Tstg
Pd
T
opr
–0.3
–0.3
–55
–25
Limits
~
~
~
~
+6.0
V
DD
+0.3
+125
+75
Unit
V
V
mW
0.1
0.22
±
0.1
SSOP-B16
400
∗
˚C
˚C
∗Derating
: 4.0mW/˚C for operation above Ta=25˚C
∗This
product is not designed for protection against radioactive rays.
Recommended Operating Conditions (Ta=25˚C)
Parameter
Supply voltage
Symbol
V
DD
Min.
3.0
Typ.
-
Max.
5.5
Unit
V
0.3Min.
0.15
±
0.1
Description
The BD3893FV is a shock sensor signal processing IC
for HDD, CD/DVD drive that detects a shock by signal
from sensor by connecting an external shock sensor.
It is available for shock sensors of voltage sensitivity type
and electric charge sensitivity type. This IC incorporates
high-resistance (50MΩ) to compose a charge amplifier.
Dimension (Unit : mm)
5.0
±
0.2
16
9
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any
means without prior permission of ROHM CO.,LTD.
The contents described herein are subject to change without notice. The specifications for the
product described in this document are for reference only. Upon actual use, therefore, please request
that specifications to be separately delivered.
Application circuit diagrams and circuit constants contained herein are shown as examples of standard
use and operation. Please pay careful attention to the peripheral conditions when designing circuits
and deciding upon circuit constants in the set.
Any data, including, but not limited to application circuit diagrams information, described herein
are intended only as illustrations of such devices and not as the specifications for such devices. ROHM
CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any
third party's intellectual property rights or other proprietary rights, and further, assumes no liability of
whatsoever nature in the event of any such infringement, or arising from or connected with or related
to the use of such devices.
Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or
otherwise dispose of the same, no express or implied right or license to practice or commercially
exploit any intellectual property rights or other proprietary rights owned or controlled by
ROHM CO., LTD. is granted to any such buyer.
Products listed in this document use silicon as a basic material.
Products listed in this document are no antiradiation design.
The products listed in this document are designed to be used with ordinary electronic equipment or devices
(such as audio visual equipment, office-automation equipment, communications devices, electrical
appliances and electronic toys).
Should you intend to use these products with equipment or devices which require an extremely high level of
reliability and the malfunction of with would directly endanger human life (such as medical instruments,
transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other
safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control
Order in Japan.
In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)
on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.0
MEMS sensors
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