Si8711AC-B-IS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> The signal circuit> Si8711AC-B-IS

Si8711AC-B-IS: Descriptiondigital isolators opto-input isolator; CategoryAnalog mixed-signal IC The signal circuit; File Size2MB，39 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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Si8711AC-B-IS Overview

digital isolators opto-input isolator

Si8711AC-B-IS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Silicon Laboratories Inc
package instruction	SOIC-8
Reach Compliance Code	compli
Samacsys Descripti	SILICON LABS - SI8711AC-B-IS - Digital Isolator, 1 Channel, 60 ns, 3 V, 30 V, NSOIC, 8 Pins
Analog Integrated Circuits - Other Types	ANALOG CIRCUIT
JESD-30 code	R-PDSO-G8
length	4.9 mm
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	260
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	30 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3.9 mm

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Si87xx

V LED E

MULATOR

N PU T

, O

PEN

OLLECTOR

UTPUT

SOLA TORS

Features

Pin-compatible, drop-in upgrades for



popular high-speed digital



optocouplers



Performance and reliability



advantages vs. optocouplers



Resistant to temperature, age and



forward current effects





10x lower FIT rate for longer

service life





Higher common-mode transient



immunity: >50 kV/µs typical



Lower power and forward input



diode current



PCB footprint compatible with

optocoupler packaging



Wide range of product options

1 channel diode emulator input

3 to 30 V open collector output

Propagation delay 30 ns

Data rates dc to 15 Mbps

Up to 5000 V

RMS

isolation and 10 kV

surge protection

AEC-Q100 qualified

Wide operating temperature range



–40 to +125 °C

RoHS-compliant packages



SOIC-8 (Narrow body)



DIP8 (Gull-wing)



SDIP6 (Stretched SO-6)



LGA8

Pin Assignments:

See page 20

SOIC-8, DIP8, LGA8

Open Collector Output

Applications

Industrial automation



Isolated data acquisition



Motor controls and drives



Test and measurement equipment



Isolated switch mode power supplies



SDIP6

Open Collector Output

Safety Regulatory Approvals



UL 1577 recognized





VDE certification conformity



IEC60747-5-2/VDE0884

CSA component notice 5A

approval



IEC

to 5000 Vrms for 1 minute



CQC certification approval



GB4943.1

Part 10

(basic/reinforced insulation)

60950-1, 61010-1, 60601-1

(reinforced insulation)

Description

The Si87xx isolators are pin-compatible, one-channel, drop-in

replacements for popular optocouplers with data rates up to 15 Mbps.

These devices isolate high-speed digital signals and offer performance,

reliability, and flexibility advantages not available with optocoupler

solutions. The Si87xx series is based on Silicon Labs' proprietary CMOS

isolation technology for low-power and high-speed operation and are

resistant to the wear-out effects found in optocouplers that degrade

performance with increasing temperature, forward current, and device

age. As a result, the Si87xx series offer longer service life and

dramatically higher reliability compared to optocouplers. Ordering options

include open collector output with and without integrated pull-up resistor

and output enable options.

SOIC-8, DIP8, LGA8

Open Collector Output

with 20 k Pull-up Resistor

SOIC-8, DIP8, LGA8

Open Collector Output

with Output Enable

Patent pending

Si87xx

Rev. 1.1 4/14

Si87xx

ABLE

Section

ONTENTS

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

2.1. Theory of Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

3. Technical Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.1. Device Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.2. Device Startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

4. Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.1. Input Circuit Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.2. Output Circuit Design and Power Supply Connections . . . . . . . . . . . . . . . . . . . . . . . 17

5. Pin Descriptions (SOIC-8, DIP8, LGA8) Open Collector . . . . . . . . . . . . . . . . . . . . . . . . . 18

6. Pin Descriptions (SOIC-8, DIP8, LGA8) Output Enable . . . . . . . . . . . . . . . . . . . . . . . . . 19

7. Pin Descriptions (SDIP6) Open Collector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

8. Pin Descriptions (SOIC-8, DIP8, LGA8) 20 kW Pull-Up Resistor . . . . . . . . . . . . . . . . . . 21

9. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10. Package Outline: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

11. Land Pattern: 8-Pin Narrow Body SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

12. Package Outline: DIP8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

13. Land Pattern: DIP8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

14. Package Outline: SDIP6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

15. Land Pattern: SDIP6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

16. Package Outline: LGA8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

17. Land Pattern: LGA8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

18. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

18.1. Top Marking (8-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

18.2. Top Marking Explanation (8-Pin Narrow Body SOIC) . . . . . . . . . . . . . . . . . . . . . . . 34

18.3. Top Marking (DIP8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

18.4. Top Marking Explanation (DIP8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

18.5. Top Marking (SDIP6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

18.6. Top Marking Explanation (SDIP6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

18.7. Top Marking (LGA8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

18.8. Top Marking Explanation (LGA8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38

Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Rev. 1.1

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