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74HC365DB,112

Description
buffers & line drivers hex buffer W/common
Categorylogic    logic   
File Size44KB,8 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
Download Datasheet Parametric Compare View All

74HC365DB,112 Overview

buffers & line drivers hex buffer W/common

74HC365DB,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP1
package instructionSSOP, SSOP16,.3
Contacts16
Manufacturer packaging codeSOT338-1
Reach Compliance Codecompli
Other featuresWITH DUAL OUTPUT ENABLE
Control typeENABLE LOW
seriesHC/UH
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length6.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.006 A
Humidity sensitivity level1
Number of digits6
Number of functions1
Number of ports2
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
method of packingTUBE
Peak Reflow Temperature (Celsius)260
power supply2/6 V
Prop。Delay @ Nom-Su29 ns
propagation delay (tpd)29 ns
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT365
Hex buffer/line driver; 3-state
Product specification
File under Integrated Circuits, IC06
December 1990

74HC365DB,112 Related Products

74HC365DB,112 74HC365PW,118 74HC365PW,112 74HCT365DB,112
Description buffers & line drivers hex buffer W/common buffers & line drivers hex buffer W/common buffers & line drivers hex buffer W/common buffers & line drivers hex buff/drvr 3st
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to conform to
Maker NXP NXP NXP NXP
Parts packaging code SSOP1 TSSOP TSSOP SSOP1
package instruction SSOP, SSOP16,.3 TSSOP, TSSOP16,.25 TSSOP, TSSOP16,.25 SSOP, SSOP16,.3
Contacts 16 16 16 16
Manufacturer packaging code SOT338-1 SOT403-1 SOT403-1 SOT338-1
Reach Compliance Code compli compli compli compli
Other features WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE WITH DUAL OUTPUT ENABLE
Control type ENABLE LOW ENABLE LOW ENABLE LOW ENABLE LOW
series HC/UH HC/UH HC/UH HCT
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609 code e4 e4 e4 e4
length 6.2 mm 5 mm 5 mm 6.2 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.006 A 0.006 A 0.006 A 0.006 A
Humidity sensitivity level 1 1 1 1
Number of digits 6 6 6 6
Number of functions 1 1 1 1
Number of ports 2 2 2 2
Number of terminals 16 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP TSSOP TSSOP SSOP
Encapsulate equivalent code SSOP16,.3 TSSOP16,.25 TSSOP16,.25 SSOP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
method of packing TUBE TAPE AND REEL TUBE TUBE
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 2/6 V 2/6 V 2/6 V 5 V
Prop。Delay @ Nom-Su 29 ns 29 ns 29 ns 38 ns
propagation delay (tpd) 29 ns 29 ns 29 ns 38 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2 mm 1.1 mm 1.1 mm 2 mm
Maximum supply voltage (Vsup) 6 V 6 V 6 V 5.5 V
Minimum supply voltage (Vsup) 2 V 2 V 2 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30 30
width 5.3 mm 4.4 mm 4.4 mm 5.3 mm
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