Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
DD
= 3.3V; OV
DD
= 2V; 0.1µF and 1.0µF capacitors from REFP, REFN, and COM to GND, REFOUT connected to REFIN through a
10kΩ resistor; V
REFIN
= 2.048V; V
IN
= 2V
P-P
(differential with respect to COM); C
L
= 10pF at digital outputs; f
CLK
= 120MHz; T
A
=
T
MIN
to T
MAX
, unless otherwise noted;
≥
+25°C guaranteed by production test, < +25°C guaranteed by design and characterization;
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FPGA/CPLD
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