Flip-Top
BGA Sockets
TM
Flip-Top BGA Sockets
1.27mm and 1.00mm Pitch
Table of Models
Description:
Socket (FRG, 1.27mm pitch)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
Socket Size:
3.00mm wider and
10.00mm longer than
BGA device (for
packages larger than
15.00mm square).*
Socket Size:
3.00mm wider and
10.00mm longer than
BGA device (for
packages larger than
15.00mm square).*
TM
Description:
Socket (FRH, 1.00mm pitch)
Mat’l: Thermoset Plastic
Index: Consult Factory
Features:
• Designed to save space on new
and existing PC boards in test,
development, programming and
production applications.
• No external hold-downs or
soldering of BGA device required.
• AIC exclusive solder ball terminals
offer superior processing.
• Uses same footprint as BGA device.
• Available with integral, finned heat
sink or coin screw clamp
assembly.
FRG replaces FTG.
* For device packages smaller than 15.00mm square, the socket size is X = .709/(18.00)
and Y = .984/(25.00).
How It Works
SMT models are shipped un-assembled to ease
solderability. Thru-hole models are shipped fully
assembled.
1. Lower assembly is soldered to PC board with no
external hold-down mechanism. Thru-hole models may
be soldered to PC board or plugged into a mating
socket.
2. Upper assembly inserts easily to lower assembly by
aligning guide posts and installing four (supplied)
screws.
3. Finned heat sink or coin screw is screwed down to flush
position.
Lower
assembly
Chip support plate
(supplied)
BGA or LGA
device
Upper
assembly
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Plating:
G - Gold over Nickel
Terminal Support:
Polyimide Film (FRG only)
Spring Material:
Stainless Steel
Heat Sink/Coin Screw and
Support Plate Material:
Aluminum
Solder Ball:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
4. Lid opens easily by pressing latch.
5. BGA device is inserted by aligning A1 position with
chamfered corner of Flip-Top™ socket. Place support
plate on top of device, close lid, engage heat sink or
coin screw, and socket is ready for use.
See page 15 for Generic
Reflow Profiles.
Detailed Installation and General Usage Instructions are
provided with product.
How To Order
1 FR G XXXX - 821 G G XX
Footprint Dash #
If Applicable*
Clamp Options
HS - Heat Sink (3 Fins Std.)
CS - Coin Screw
Model Type
RoHS Compliant Insulator:
FR - Flip-Top™ BGA Socket
Pitch
G = .050/(1.27mm)
H = .039/(1.00mm)
Number of Positions
*See footprints section or
online database.
Contact Plating
RoHS Compliant:
G - Gold
Terminal Plating
RoHS Compliant:
G - Gold
Terminal Type
See options
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
Flip-Top BGA Sockets
1.27mm and 1.00mm Pitch
Terminals
(for test, development and production applications)
Tin/Lead: Type -690
Lead-free: Type -821
1.27mm pitch
Tin/Lead: Type -752
Lead-free: Type -837
1.00mm pitch
TM
Flip-Top
BGA Sockets
TM
SMT (Surface Mount)
.102
(2.59)
.206
(5.23)
.030 Dia.
(0.76)
.091
(2.31)
.200
(5.08)
.024 Dia.
(0.61)
Type -708
.102
(2.59)
.176
(4.47)
Type -754
.091
(2.31)
.176
(4.47)
Thru-Hole
Footprints:
.125
(3.18)
.018 Dia.
(0.46)
.125
(3.18)
.015 Dia.
(0.38)
360 Pins
Footprint Number 360-2
.906 Sq.
(23.00)
Terminals
(for LGA or de-balled BGA device applications)
SMT (Surface Mount)
Tin/Lead: Type -713
Lead-free: Type -822
1.27mm pitch
.112
(2.84)
Tin/Lead: Type -762
Lead-free: Type -838
1.00mm pitch
.099
(2.51)
.200
(5.08)
.206
(5.23)
.030 Dia.
(0.76)
.039/(1.00) Typ.
.024 Dia.
(0.61)
22 x 22 rows
• Full grid molded insulators
populated to exact device pattern.
• Over 1000 footprints available -
see page 99, search online or
submit your device specs.
• Use our Build-A-Part feature or
search in our online BGA Socket
Finder
TM
at www.bgasockets.com.
Type -712
.112
(2.84)
Type -763
.099
(2.51)
.176
(4.47)
Thru-Hole
.176
(4.47)
.018 Dia.
(0.46)
.125
(3.18)
.015 Dia.
(0.38)
.125
(3.18)
Terminals
(for BGA device test applications)
SMT (Surface Mount)
Tin/Lead: Type -659
Lead-free: Type -820
1.27mm pitch
.102
(2.59)
.206
(5.23)
.030 Dia.
(0.76)
Tin/Lead: Type -TBD
Lead-free: Type -TBD
1.00mm pitch
Available Online:
• RoHS Qualification Test Report
• Technical articles
• Test data
Consult
Factory
• Signal Integrity Performance
• CAD drawings
• BGA Footprints
Type -657
Available with .016/(0.41mm) Diam. tail; Type -709
Type -TBD
Thru-Hole
.102
(2.59)
.176
(4.47)
Consult
Factory
.125
(3.18)
.018 Dia.
(0.46)
inch/(mm)
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
京公网安备 11010802033920号
EEWORLD
