TA-I
1. Scope :
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
(Lead-Free for CN22 Series)
No
page
TCN-220S002E
1/10
This specification applies for the CN22 series of thick film chip resistor arrays made by TA-I.
2. Construction , Dimensions , Schematic :
2.1 Construction :
Over Coat
Conductor:
(Lead-free or with lead)
Resistive Element
Plating
Ni + Sn
Ceramic Substrate
2.1.1 Chip Resistor Arrays :
CN22
2.2 Dimension :
UNIT:mm
Type
CN22
1.0
L
0.1
1.0
±
W
0.1
0.35
±
t
0.1
0.65
±
P
0.1
0.33
±
a
0.1
0.15
±
b
0.1
0.25
±
c
0.1
±
TA-I TECHNOLOGY CO., LTD
TA-I
2.3 Schematic :
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
(Lead-Free for CN22 Series)
No
page
TCN-220S002E
2/10
3. Type Designation:
3.1 Chip Resistor Arrays
CN
Product Code
22
size
J
Tolerance
TN
Packaging
103
Nominal
Resistance
CN : Chip Resistor Array Power Rating
N :
Lead-free
4
digits e.g., :
Ω
(E-96) 1540 = 154
43R2 = 43.2
Note :
TN : Lead-Free products packaged by paper tape
TA-I TECHNOLOGY CO., LTD
Ω
F- 1%
±
5R6 = 5.6
Ω
G- 2%
±
±
22-0402*2
J- 5%
T- Paper Tape
3
digits e.g.,:
(E-24) 103 = 10K
TA-I
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
(Lead-Free for CN22 Series)
No
page
TCN-220S002E
3/10
4. Ratings & Characteristics :
Power
Rating
at 70
Rating
Voltage
Max.
Working
Voltage
Max.
Over Load
Voltage
Operating
Temp.
( )
Resistance
Tolerance
(%)
Resistance
Range
( )
Temp
Co-efficient
PPM/
4.1 Derating Curve :
℃
For resistors operated at ambient temperature over 70
accordance with figure 1.
P max.
100
Power ratio ( % )
50
0
-55
50
70
100
125
Ambient
Figure 1
Temp. (
°
C )
4.2 Rated Voltage:
The rated voltage is calculated by the following formula:
E= P * R
E=
Rated Voltage(V)
P=
Rated Power(W)
R=
Resistance Value
(Ω)
E.G. : What is CN22JTN102 the rated voltage ?
Ω
Ω
CN22JTN102
P:1/16W
;
R:102 = 1K
Ω
E=
0.0625(W) * 1000(
)
=
7.9 (V)
TA-I TECHNOLOGY CO., LTD
℃
+125
, power rating shall be derated in
= 1000
±
Ω
Ω
∫
CN22 1/16W
Refer 4.2
25V
50V
±
±
±
-55
5%
2%
1%
10
~1M
250
℃
Ω
℃
℃
Type
TA-I
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
(Lead-Free for CN22 Series)
No
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TCN-220S002E
4/10
5. Reliability Tests:(As specified in JIS C 5202)
Test Items
Temperature
Resistance
Coefficient
of
Reference
standard
Condition of Test
Test Limits
Refer 4.0
Short Time Overload
JIS-C5202-5.5
2.5 X rated voltage for 5 sec
Intermittent Overload
JIS-C5202-5.8
Load Life
JIS-C5202-7.10
Load Life with Humidity
JIS-C5202-7.9
1000 hours at rated voltage , 40 2 ,
90~95% RH 1.5hours “ON “, 0.5hour “OFF”
1%: (1.0%+0.05 )
5%: (3.0%+0.1 )
Solderability
JIS-C5202-6.11
245 5
solder, 2 0.5 sec dwell.
Solder : Sn96.5 / Ag3.0 / Cu0.5
At least 95% of surface area
of electrode shall be covered
with new solder.
Core body
Without mechanical damage
JIS C-5202-6.1.4 Pressure 1.0 kgf a R0.5 pressure rod for 10 sec such as breaks. Electrical
characteristics shall be satisfied
Dielectric
Withstanding
JIS-C5202-5.7
Voltage (Voltage Proof)
Applying voltage 100V for 1 minute.
No abnormalities such as
flashover,
burning
dielectric
breakdown shall appear.
TA-I TECHNOLOGY CO., LTD
Ω
Ω
±
℃±
Resistance to Solder Heat
JIS-C5202-6.10
270
5
solder , 10
1 sec dwell .
0 :
50m
or less
Ω
0.5%,1%: (1.0%+0.05
2%,5%: (2.0%+0.1 )
Ω
Ω
±
±
Ω
℃
±
℃±
℃
Rapid Change of Temperature
JIS-C5202-7.4
-55
(30 min. ) / +155
(30 min. ) 5 cycles
0
:50 m
or less
Ω
Ω
1%: (0.5%+0.05
5%: (1.0%+0.05
Ω
±
±
Ω
0
:100 m
or less
Ω
Ω
Ω
±
±
Ω
℃±
℃
1000 hours at rated voltage , 70
“ON “, 0.5hour “OFF”
, 1.5hours
1%: (1.0%+0.05 )
5%: (3.0%+0.1 )
0
:100 m
or less
Ω
Ω
±
±
Ω
2.5X rated voltage or Max Overloading Voltage ,
1 sec “ON” 25 sec “OFF” , 10000 cycles
0
:
50m
Ω
Ω
(5.0%+0.1
Ω
0
: 50 m
Ω
Ω
±
±
℃
〜
JIS-C5202-5.2
-55
+125
(2.0%+0.1
)
or less
)
or less
)
)
)
TA-I
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
(Lead-Free for CN22 Series)
No
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TCN-220S002E
5/10
Component , Lead-Free Soldering part 8 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Temp. Cycles :
-55 (30 min.) / +155 (30 min. )
Testing duration : 500 4 hours
Temp. Humidity Chambers:
Temperature : 85
Humidity : 85% RH
Testing duration : 500 4 hours
Whisker
SONY
SS-00254-8
Component , Lead-Free Soldering part 5 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Flow Solder :
Pre – heat : 100 to 105
30 5 sec
Temperature : 260 3
10 +1/ -0 sec
The entire sample shall be dipped in solder.
The specimen shall be stored at standard
atmospheric conditions for 1 hour .
Iron Solder :
Bit temperature : 350 10
Application time of soldering iron : 3 +1/- 0sec
Apply the soldering iron to the electrode .
The specimen shall be stored at standard
atmospheric conditions for 1 hour , after
which the measurements shall be made
Resistance to Solder Heat
SONY
SS-00254-5
Note* : RCWV : Rated continuous working voltage
.
6.Marking : No Marking for CN22
7. Taping & Reel :
7.1 Taping Dimensions
7.1.1 2 mm pitch paper
TA-I TECHNOLOGY CO., LTD
± ℃
℃ ±
℃±
±
℃
±
℃
℃
Whisker formation :
50 um or less .
.
Electrical characteristics shall be
Satisfied .
Without distinct deformation in
appearance
UNIT: mm
DSP and ARM Processors
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