Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
)..........41°C/W
Junction-to-Case Thermal Resistance (θ
JC
).................6°C/W
Note 1:
µMAX
Junction-to-Ambient Thermal Resistance (θ
JA
).....206.3°C/W
Junction-to-Case Thermal Resistance (θ
JC
)...............42°C/W
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(V
IN
= 2V for MAX1595_ _ _33, V
IN
= 3V for MAX1595_ _ _50, C
IN
= 1µF, C
X
= 0.22µF, C
OUT
= 1µF, T
A
= -40° to +85°C, unless otherwise
noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER
Input Voltage Range
Input Undervoltage Lockout
Threshold
Input Undervoltage Lockout
Hysteresis
0 < I
LOAD
< 125mA,
V
IN
= +3.0V
Output Voltage
V
OUT
T
A
= 0°C to +85°C
T
A
= -40°C to +85°C
4.85
4.80
3.20
3.16
3.20
3.16
220
240
0.85
1.0
3.33
3.33
SYMBOL
V
IN
CONDITIONS
MIN
1.8
1.40
1.60
40
5.05
5.15
5.20
3.40
3.44
3.40
3.44
320
350
1.15
5
0.6
1.6
0.1
µA
MHz
µA
V
V
µA
V
TYP
MAX
5.5
1.72
UNITS
V
V
mV
0 < I
LOAD
< 75mA, V
IN
T
A
= 0°C to +85°C
= +2.0V
T
A
= -40°C to +85°C
0 < I
LOAD
< 30mA, V
IN
T
A
= 0°C to +85°C
= +1.8V
T
A
= -40°C to +85°C
No-Load Input Current
Switching Frequency
Shutdown Supply Current
SHDN
Input Voltage Low
SHDN
Input Voltage High
SHDN
Input Leakage Current
I
Q
f
OSC
I
SHDN
V
INL
V
INH
V
IN
= +2.0V, MAX1595_ _ _33
V
IN
= +3.0V, MAX1595_ _ _50
I
LOAD
> 20mA, V
OUT
> V
IN
V
SHDN
= 0V, V
IN
= +5.5V, V
OUT
= 0V
V
IN
= 2.0V to 5.5V
V
IN
= 2.0V to 5.5V
Note 2:
Specifications to -40°C are guaranteed by design, not production tested.
I want to write a chat program, but I don't know how sockets work. I would appreciate it if you can introduce the socket programming mechanism to me!...
Precision Constant Temperature Refrigeration System for High-efficiency Laser Diodes Author: Chen Liang Liu Chunxia Reposted from: 501 Teaching and Research Section, Xidian University Hits: 1228Abstra...
Proteus 7.9 Chinese cracked version free download Proteus VSM latest support MCU Proteus VSM for PICCOLO TMS320 - Simulation support for this popular family of DSP's. CPU models for PIC12F1822,PIC16LF...
I want to change the shutdown of Windows to hibernation. I want to install a driver that can intercept IRP_MJ_SHUTDOWN. I want to call setsystempowerstate in dispatch_routine to hibernate. But this AP...
In our common sense, the word technology often has two definitions. The first is the technology sealed in the laboratory. They are like flowers on the mountain top. Only a few people on the mountai...[Details]
1. Problem When developing STM32 with IAR, I found that I could not print floating point numbers by redirecting printf to the serial port. The code is as follows: The output is as follows: It can...[Details]
For STM32, there are two ways to reset the software: 1) Use the official software library The system reset function is directly provided in the stm32f10x_nvic.c file of the official software li...[Details]
In the actual project development process, it is common to encounter modifications to the hardware circuit, and then the modified part requires the modification of the driver. Thinking about the comi...[Details]
The day before yesterday, I learned about STM's Systick and found it quite useful for precise timing. When I used CVAVR before, I found that the delay.h in it was very useful. So, I used STM32's...[Details]
Regarding the PHY construction of LWIP, the PHY chip used is LAN8720A, RMII mode. Regarding the hardware connection part, the Atomic board F407 is used, and the hardware connection is as follows: ...[Details]
Development Background: 1. Main chip - STM32F207VCT6; 2. TCP/IP protocol stack - LWIP, transplanted based on ST routines; 3. Operating system - none (bare metal); Anomalies: 1. Power on the device wi...[Details]
1. Initial understanding of FSMC: FSMC consists of 4 modules: (1) AHB interface (including FSMC configuration register) (2) NOR flash memory and PSRAM controller (when driving LCD, LCD is like a PSRA...[Details]
Overview
Lightning is a strong discharge phenomenon that occurs between thunderstorm clouds and between thunderstorm clouds and the earth due to severe convective weather. Lightning is gen...[Details]
With the implementation of the first version of the NR sub-6GHz draft of 3GPP in December 2017, and the subsequent Phase 2 drafts, semiconductor manufacturers and terminal manufacturers began to ...[Details]
What is SYSTICK: This is a 24-bit system tick timer, SysTick, with automatic reload and overflow interrupt functions. All microcontrollers based on the Cortex_M3 processor can obtain a certain time ...[Details]
1 Introduction Due to the special working environment of coal mine production, the production process is more dangerous and unsafe than the general industry. With the continuous increase in c...[Details]
Every era has anxiety that has nowhere to go. Let's follow the embedded editor to learn about the relevant content.
The anxiety of the post-Internet era is that if you don’t revolutionize ...[Details]
As a leading company in automotive semiconductors, Freescale and Khronos Group have jointly launched an automotive multimedia embedded microprocessor i.MX35 with an integrated OpenVG hardware acceler...[Details]
In recent years, in addition to Huawei Kirin
chips
in the mobile phone industry
, Xiaomi's own processor Pengpai S1, AI
chip
start-ups such as Cambrian, Horizon, and Deephi Technolo...[Details]