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74HC1G125GW,125

Description
buffers & line drivers bus buff/drvr 3-ST picogate
Categorylogic    logic   
File Size80KB,17 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74HC1G125GW,125 Overview

buffers & line drivers bus buff/drvr 3-ST picogate

74HC1G125GW,125 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP5/6,.08
Contacts5
Manufacturer packaging codeSOT353-1
Reach Compliance Codecompli
Control typeENABLE LOW
seriesHC/UH
JESD-30 codeR-PDSO-G5
JESD-609 codee3
length2.05 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.006 A
Humidity sensitivity level1
Number of digits1
Number of functions1
Number of ports2
Number of terminals5
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP5/6,.08
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)260
power supply2/6 V
Prop。Delay @ Nom-Su30 ns
propagation delay (tpd)150 ns
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width1.25 mm
74HC1G125; 74HCT1G125
Bus buffer/line driver; 3-state
Rev. 05 — 23 December 2005
Product data sheet
1. General description
The 74HC1G125; 74HCT1G125 is a high-speed, Si-gate CMOS device.
The 74HC1G125; 74HCT1G125 provides one non-inverting buffer/line driver with 3-state
output. The 3-state output is controlled by the output enable input (pin OE). A HIGH level
at pin OE causes the output to assume a high-impedance OFF-state.
The bus driver output currents are equal compared to the 74HC125 and 74HCT125.
2. Features
s
s
s
s
s
s
Wide supply voltage range from 2.0 V to 6.0 V
Symmetrical output impedance
High noise immunity
Low power consumption
Balanced propagation delays
ESD protection:
x
HBM EIA/JESD22-A114-C exceeds 2000 V
x
MM EIA/JESD22-A115-A exceeds 200 V
s
Very small 5 pins packages
s
Specified from
−40 °C
to +85
°C
and
−40 °C
to +125
°C
3. Quick reference data
Table 1:
Quick reference data
GND = 0 V; T
amb
= 25
°
C; t
r
= t
f
6.0 ns.
Symbol
t
PHL
,
t
PLH
C
i
C
PD
Parameter
Conditions
Min
-
-
V
I
= GND to V
CC
[1]
Typ
9
1.5
30
Max
-
-
-
Unit
ns
pF
pF
74HC1G125
propagation delay A to Y V
CC
= 5 V; C
L
= 15 pF
input capacitance
power dissipation
capacitance
-

74HC1G125GW,125 Related Products

74HC1G125GW,125 74HCT1G125GV,125 74HC1G125GV,125
Description buffers & line drivers bus buff/drvr 3-ST picogate buffers & line drivers 3-state buffer buffers & line drivers 3-state buffer
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc
Is it Rohs certified? conform to conform to conform to
Maker NXP NXP NXP
Parts packaging code TSSOP TSOP TSOP
package instruction TSSOP, TSSOP5/6,.08 PLASTIC, SC-74A, SOT-753, 5 PIN PLASTIC, SC-74A, SOT-753, 5 PIN
Contacts 5 5 5
Manufacturer packaging code SOT353-1 SOT753 SOT753
Reach Compliance Code compli compli compli
Control type ENABLE LOW ENABLE LOW ENABLE LOW
series HC/UH HCT HC/UH
JESD-30 code R-PDSO-G5 R-PDSO-G5 R-PDSO-G5
JESD-609 code e3 e3 e3
length 2.05 mm 2.9 mm 2.9 mm
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER
MaximumI(ol) 0.006 A 0.006 A 0.006 A
Humidity sensitivity level 1 1 1
Number of digits 1 1 1
Number of functions 1 1 1
Number of ports 2 2 2
Number of terminals 5 5 5
Maximum operating temperature 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP
Encapsulate equivalent code TSSOP5/6,.08 TSOP5/6,.11,37 TSOP5/6,.11,37
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 260 260
power supply 2/6 V 5 V 2/6 V
Prop。Delay @ Nom-Su 30 ns 36 ns 30 ns
propagation delay (tpd) 150 ns 36 ns 150 ns
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.1 mm 1.1 mm
Maximum supply voltage (Vsup) 6 V 5.5 V 6 V
Minimum supply voltage (Vsup) 2 V 4.5 V 2 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Tin (Sn) Tin (Sn) Tin (Sn)
Terminal form GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 0.95 mm 0.95 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature 30 30 30
width 1.25 mm 1.5 mm 1.5 mm
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