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24LC04B-I/SNG

Description
eeprom 512x8 - 2.5V lead free package
Categorystorage    storage   
File Size836KB,45 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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24LC04B-I/SNG Overview

eeprom 512x8 - 2.5V lead free package

24LC04B-I/SNG Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeSOIC
package instructionSOP, SOP8,.25
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)0.4 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
I2C control byte1010XXMR
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.9 mm
memory density4096 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals5
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512X8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply3/5 V
Certification statusNot Qualified
reverse pinoutNO
Maximum seat height1.75 mm
Serial bus typeI2C
Maximum standby current0.000005 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3.9 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE
Base Number Matches1
24AA04/24LC04B/24FC04
4K I
2
C Serial EEPROM
Device Selection Table
Part Number
24AA04
24LC04B
24FC04
V
CC
Range
1.7V-5.5V
2.5V-5.5V
1.7V-5.5V
Max. Clock Frequency
400 kHz
(1)
400 kHz
1 MHz
Temp. Ranges
I
I, E
I, E
Available Packages
MC, MNY, P, MS, SN, ST, OT, CSP
MC, MNY, P, MS, SN, ST, OT
MUY, P, MS, SN, ST, OT
Note 1:
100 kHz for V
CC
< 2.5V.
Features
• Single Supply with Operation down to 1.7V for
24AAXX and 24FCXX Devices, 2.5V for 24LCXX
Devices
• Low-Power CMOS Technology:
- Read current 1 mA, maximum
- Standby current 1
μA,
maximum (I-temp.)
• 2-Wire Serial Interface, I
2
C Compatible
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz, 400 kHz and 1 MHz Compatibility
• Page Write Time: 5 ms, Maximum
• Self-Timed Erase/Write Cycle
• 16-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4,000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
• Factory Programming Available
• RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40°C to +85°C
- Extended (E): -40°C to +125°C
• Automotive AEC-Q100 Qualified
Packages
• 8-Lead DFN, 8-Lead MSOP, 8-Lead PDIP,
8-Lead SOIC, 8-Lead TDFN, 8-Lead TSSOP,
8-Lead UDFN, 5-Lead SOT-23 and 4-Ball CSP
Description
The Microchip Technology Inc. 24XX04
(1)
is a 4-Kbit
Electrically Erasable PROM. The device is organized
as two blocks of 256 x 8-bit memory with a 2-wire serial
interface. Its low-voltage design permits operation
down to 1.7V with standby and active currents of only
1
μA
and 1 mA, respectively. The 24XX04 also has a
page write capability for up to 16 bytes of data.
Note 1:
24XX04 is used in this document as a
generic
part
number
for
the
24AA04/24LC04B/24FC04 devices.
Package Types
8-Lead DFN/TDFN/UDFN
(Top View)
A0
(1)
8-Lead PDIP/MSOP
(Top View)
A0
(1)
A1
(1)
8-Lead SOIC/TSSOP
(Top View)
A0
(1)
A1
(1)
5-Lead SOT-23
(Top View)
SCL
V
SS
SDA
1
2
3
4
V
CC
SCL
5
WP
V
CC
4-Ball CSP
(Top View)
1
3
2
4
V
SS
SDA
1
2
8
7
6
5
V
CC
WP
SCL
SDA
1
1
2
2
3
3
4
4
8
8
7
7
6
6
5
5
V
CC
WP
SCL
SDA
1
2
3
4
8
7
6
5
V
CC
WP
SCL
SDA
A1
(1)
A2
(1)
3
V
SS
4
A2
(1)
V
SS
A2
(1)
V
SS
Note 1:
Pins A0, A1 and A2 are not used by the 24XX04 (no internal connections).
2007-2018 Microchip Technology Inc.
DS20001708L-page 1

24LC04B-I/SNG Related Products

24LC04B-I/SNG 24LC04B/ST
Description eeprom 512x8 - 2.5V lead free package eeprom 512x8 - 2.5V
Is it lead-free? Lead free Lead free
Is it Rohs certified? conform to conform to
Parts packaging code SOIC SOIC
package instruction SOP, SOP8,.25 4.40 MM, PLASTIC, TSSOP-8
Contacts 8 8
Reach Compliance Code compli compli
ECCN code EAR99 EAR99
Maximum clock frequency (fCLK) 0.4 MHz 0.4 MHz
JESD-30 code R-PDSO-G8 R-PDSO-G8
JESD-609 code e3 e3
length 4.9 mm 4.4 mm
memory density 4096 bi 4096 bi
Memory IC Type EEPROM EEPROM
memory width 8 8
Humidity sensitivity level 3 1
Number of functions 1 1
Number of terminals 5 8
word count 512 words 512 words
character code 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 70 °C
organize 512X8 512X8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP TSSOP
Package shape RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260
Certification status Not Qualified Not Qualified
Maximum seat height 1.75 mm 1.2 mm
Serial bus type I2C I2C
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 2.5 V 1.8 V
surface mount YES YES
technology CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL
Terminal surface Matte Tin (Sn) Matte Tin (Sn)
Terminal form GULL WING GULL WING
Terminal pitch 1.27 mm 0.65 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature 40 40
width 3.9 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms
Base Number Matches 1 1

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