A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Dear colleagues:The original Electronic Experts Warm Nest QQ group was maliciously cancelled. Please join the new group: Electronic Engineering World Exchange Group 2 37061424 by bagheera: Since the E...
The TMS320VC5509a chip used before can process in real time at a main frequency of 120M, and it used to be an external flash.Now considering software encryption, I want to use a DSP with built-in flas...
SPI (Serial Peripheral Interface) I2C (INTER IC BUS) UART (Universal Asynchronous Receiver Transmitter)1.SPI
SPI is a protocol that allows a master device to initiate a synchronous communication with ...
Now I am doing HPI communication between DSPs, 5410 to 642 to send data, but the problem is: 642 can receive data, theoretically all data should be stored in the specified address range, and in this r...
How to connect an external crystal oscillator to Timer2/Timer3 in dsPIC33 OC? Although the internal clock can be used for frequency division, what if an external low-speed crystal oscillator is connec...
Hardware designers have begun to adopt FPGA technology in high-performance DSP designs because it can provide 10-100 times faster computing than PC-based or microcontroller-based solutions. Previou...[Details]
As a wireless broadband metropolitan area network standard, WiMAX technology has greater advantages than previous 3.5GHz MMDS products in terms of non-line-of-sight transmission and spectrum utiliz...[Details]
introduction
For the voltage regulator modules (VRMs) that power the latest computer central processing units (CPUs), power supply designers have historically used multiphase interleaved b...[Details]
From the PIC16F946 datasheet, we know that there are two ways to write values to the LCD for display:
1. Directly write the value to LCDDATA1~LCDDATA23
2. Use disconnect t...[Details]
1. Overview
The Virtual CAN Interface (VCI) function library is an application program interface specifically provided for the use of ZLGCAN devices on PCs. The functions in the library ar...[Details]
1. Project Introduction
Shandong Dezhou Xingtai Paper Co., Ltd. is a newly built high-end paperboard production enterprise with domestic leading level established by Shandong Zhaodongfang Pape...[Details]
At very low temperatures, certain metals and alloys lose their resistance to electric
current
and become
superconductors
. Two parameters that are often measured are the transition ...[Details]
1. Proposal of
reconfigurable
measurement and control system
The measurement and control system generally refers to a system based on
computers
to realize data acquisition a...[Details]
With the rapid development of wireless
digital communication
, more challenges have been raised for integrated circuit design and testing. In the product design stage, in order to ensure
t...[Details]
The launch of Shenzhou IX is imminent, and Tiangong is welcoming visitors again. Yesterday, Professor Fu Qiang, Vice President of the Institute of Science and Industrial Technology of Harbin Instit...[Details]
A stepper motor is an electromagnetic mechanical device that converts an electrical pulse signal into an angular displacement or a linear displacement. The stability and reliability of a stepper mo...[Details]
Synchronous buck designs are becoming increasingly difficult, and the selection of suitable ICs is becoming quite narrow. This Design Idea combines a current-mode PWM IC used in a flyback regulator...[Details]
In the 1980s, breakthroughs were made in the design and production of small, low-power quartz metal halide lamps with precise dimensions. At the same time, with the acceleration of people's lives a...[Details]
Today, as information becomes an increasingly important resource, strong market demand and the development of microelectronics technology have led to the rapid development of portable electronic sy...[Details]
1. Introduction
With the continuous development of modern urban construction, infrastructure and real estate are becoming increasingly prosperous, and the quality requirements for construction ...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
