A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
[i=s]This post was last edited by tianyingkeji on 2015-11-22 23:48[/i] Communication protocol:Source code:Introduction video: [media=x,500,375]http://v.youku.com/v_show/id_XMTM5MzQ5MDc1Ng==.html[/medi...
Problem description: 1. At the high level of the 4-channel control signal, disconnect S1 and S2, close S3, and charge capacitor C2. 2. At the high level of the 2-channel control signal, disconnect S3 ...
:) First of all, I will introduce the modular division of labor: 1. OST2670 module driver code of OST32F7 2. OST32F7 interface of WIFI module 3. Upper computer software development (I am more familiar...
Hello everyone, I just got to know MicroPython and after reading the post, I don’t know how to get started with this board that everyone is discussing? Please give me some advice, thank you...
introduction
Since the beginning of the 21st century, the world of information has changed rapidly. Maybe a high-tech product will be released today and a better similar product will be releas...[Details]
With the rapid development of science and technology, especially the widespread application of digital technology and various ultra-large-scale integrated circuits, electronic equipment, especially...[Details]
In recent years, the market for mobile/portable devices such as smartphones and laptops has continued to grow rapidly. While these products continue to integrate more new features to enhance the ...[Details]
In this article, the high-performance DSP developed by TI can be used as an effective confidentiality method if it is applied to PC encryption cards.
As an effective network security solution,...[Details]
1. Introduction
Light control circuit plays a vital role in urban street lamps or corridor lighting. With light control circuit, the lights can be automatically turned on and off according to ...[Details]
introduction
For the voltage regulator modules (VRMs) that power the latest computer central processing units (CPUs), power supply designers have historically used multiphase interleaved b...[Details]
1 Introduction
As an emerging microfabrication technology, micro-electromechanical system (MEMS) technology has begun to be applied in various fields. It can integrate functions such as inform...[Details]
introduction
The emergence of high-performance, low-power embedded CPUs and high-reliability network operating systems has made it possible to implement applications with large amounts of comp...[Details]
Contact resistance
is the resistance to current flow through a closed pair of contacts. This type of measurement is performed on devices such as connectors,
relays
, and switches. The...[Details]
1 Introduction
Water resources are the basic conditions for human survival and the lifeline of economic development. The reality shows that due to the global shortage of water resources and th...[Details]
1 Introduction to HART Protocol
HART (Highway Addressable Remote Transducer), an open communication protocol for addressable remote sensor high-speed channels, was launched by Rosemen in the U...[Details]
On the afternoon of July 10, Beijing time, Taiwan's largest chip designer MediaTek expects its smartphone chip shipments to grow by double digits in the third quarter of this year, and the company is ...[Details]
General LED lighting has a current limiting resistor in the driving circuit, and the power consumed by the resistor has nothing to do with the LED light emission. In order to improve efficiency, a...[Details]
Flooded Batteries
This battery developed in Germany can be used to power flashlights, strobe lights and toys as long as it is filled with water. This battery can be stored for 50 years and can...[Details]
Introduction
Liquid crystal, as a display device, is widely used in low-power products such as instruments, meters, and electronic equipment with its unique advantages. In the past, the displ...[Details]
Renesas Electronics MCUs
京公网安备 11010802033920号
EEWORLD
