512 x 9, 1,024 x 9, 2,048 x 9, 4,096 x 9, 8,192 x 9 and 16,384 x 9
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
PIN CONFIGURATION
D
5
D
3
D
8
ABSOLUTE MAXIMUM RATINGS
Symbol
V
TERM
T
STG
I
OUT
Rating
Terminal Voltage
with Respect to GND
Storage Temperature
DC Output Current
Com'l & Ind'l
–0.5 to +7.0
–55 to +125
–50 to +50
Unit
V
INDEX
W
NC
V
CC
D
4
°
C
mA
4 3 2
D
2
D
1
D
0
XI
FF
Q
0
Q
1
NC
Q
2
5
6
7
8
9
10
11
12
13
1
32 31 30
29
28
27
26
25
24
23
22
21
D
6
D
7
NC
FL/RT
RS
EF
XO/HF
Q
7
Q
6
NOTE:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
RECOMMENDED DC OPERATING
CONDITIONS
Symbol
V
CC
GND
V
IH
(1)
V
IL
(2)
T
A
T
A
Rating
Supply Voltage
Supply Voltage
Input High Voltage
Input Low Voltage
Min.
3.0
0
2.0
—
0
–40
14 15 16 17 18 19 20
Q
8
GND
NC
R
Q
3
Q
4
Q
5
Typ. Max.
3.3
3.6
0
0
— V
CC
+0.5
—
0.8
—
—
70
85
Unit
V
V
V
V
3033 drw 02b
Operating Temperature Commercial
Operating Temperature Industrial
°
C
°
C
PLCC (J32-1, order code: J)
TOP VIEW
NOTES:
1. For
RT/RS/XI
input, V
IH
= 2.6V (commercial).
For
RT/RS/XI
input, V
IH
= 2.8V (military).
2. 1.5V undershoots are allowed for 10ns once per cycle.
DC ELECTRICAL CHARACTERISTICS
(Commercial: V
CC
= 3.3V ± 0.3V, T
A
= 0°C to +70°C; Industrial: V
CC
= 3.3V ± 0.3V, T
A
= –40°C to +85°C)
IDT72V01
IDT72V02
IDT72V03
IDT72V04
Commercial & Industrial
(1)
t
A
= 15, 25, 35 ns
Symbol
I
LI
(2)
I
LO
(3)
V
OH
V
OL
I
CC1
(4,5)
I
CC2
(4,6)
Parameter
Input Leakage Current (Any Input)
Output Leakage Current
Output Logic “1” Voltage I
OH
= –2mA
Output Logic “0” Voltage I
OL
= 8mA
Active Power Supply Current
Standby Current (R=W=RS=FL/RT=V
IH
)
Min.
–1
–10
2.4
—
—
—
Max.
1
10
—
0.4
60
5
IDT72V05
IDT72V06
Commercial & Industrial
(1)
t
A
= 15, 25, 35 ns
Min.
–1
–10
2.4
—
—
—
Max.
1
10
—
0.4
75
5
Unit
µA
µA
V
V
mA
mA
NOTES:
1. Industrial temperature range product for the 25ns speed grade is available as a standard device. All other speed grades are available by special order.
Yesterday the development board was working fine. Today I changed a program and it didn't work when I downloaded it again. I changed to a program that I used to use. The program can be downloaded, but...
An error occurred when cross-compiling busybox 1.1.0 with 4.4.3
/home/bsec/busybox-1.1.0/libbb/procps.c:15:22: error: asm/page.h: No such find.
After searching in many places , it was found that there...
[i=s]This post was last edited by chen468859 on 2017-1-24 16:38[/i] It was my first time drawing a 4-layer board. I was confused at first glance at so many schematic diagrams and components after they...
I downloaded the code from the Internet, and when I opened it, the following error message appeared: There was a failure while initializing the Microsoft Visual SourceSafe source control provider. You...
The experiment of two-machine communication (serial port working in mode 1) was not smooth. I tried to transfer three data directly according to the routine in the textbook, but it was unsuccessful. (...
With the booming electronics industry, vision systems have become a leader in the electronics automation sector. However, the delicate nature of electronic products often affects product yields due...[Details]
On August 23rd, Geely's subsidiary, Jiyao Tongxing, announced it has the industry's largest advanced production capacity for tandao
batteries
, with eight production bases across China. Jiy...[Details]
When you are happily watching NBA or football, your wife asks you to turn off the lights in the bedroom. Would you be depressed? Of course, unless you are not afraid of your wife.
Now you are ...[Details]
On August 24th, media outlets reported, citing sources, that NavInfo, a listed company on the A-share market, is nearing completion in its acquisition of the intelligent driving c...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
Zos Automotive Research Institute released the "2025
Smart Cockpit
Tier 1 Research Report (Domestic Edition)."
This report analyzes the operating conditions of more than a dozen ...[Details]
With the increasing number of new energy vehicles on the road, the deployment of supporting facilities for these vehicles has accelerated, and new energy vehicles have gradually entered the vision ...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
1. Fault phenomenon and cause analysis
1. During the operation of the equipment, the expansion sleeve is subjected to a large torque, and the mating surfaces of the shaft and the sleeve move...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
My career has been closely tied to the semiconductor industry. From product management to content marketing, I've provided countless forecasts and predictions across a variety of roles. Whethe...[Details]
In the field of communications power supplies, AC/DC rectifier power supplies are called primary power supplies or basic power supplies, while DC/DC converters are called secondary power supplies. ...[Details]
From time to time, I see some audiophiles spending a lot of money or a lot of time to DIY speakers, but the results are not what they want. Below I list some of the small experiences I summarized b...[Details]
The fracture mechanism is stress concentration, which typically occurs at the capacitor lead pins or pad connection points, as shown in the figure. Under vibration, the capacitor lead pins and pad ...[Details]
FPGA/CPLD
京公网安备 11010802033920号
EEWORLD
