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74LV04DB,112

Description
inverters hex inverter 3-volt
Categorylogic    logic   
File Size818KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LV04DB,112 Overview

inverters hex inverter 3-volt

74LV04DB,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconduc
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP1
package instruction5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Contacts14
Manufacturer packaging codeSOT337-1
Reach Compliance Codecompli
seriesLV/LV-A/LVX/H
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length6.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeINVERTER
MaximumI(ol)0.006 A
Humidity sensitivity level1
Number of functions6
Number of entries1
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP14,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
method of packingTUBE
Peak Reflow Temperature (Celsius)260
power supply3.3 V
Prop。Delay @ Nom-Su15 ns
propagation delay (tpd)25 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
74LV04
Hex inverter
Rev. 4 — 8 December 2015
Product data sheet
1. General description
The 74LV04 is a low-voltage Si-gate CMOS device that is pin and function compatible with
74HC04 and 74HCT04.
The 74LV04 provides six inverting buffers.
2. Features and benefits
Wide operating voltage: 1.0 V to 5.5 V
Optimized for low voltage applications: 1.0 V to 3.6 V
Accepts TTL input levels between V
CC
= 2.7 V and V
CC
= 3.6 V
Typical output ground bounce < 0.8 V at V
CC
= 3.3 V and T
amb
= 25
C
Typical HIGH-level output voltage (V
OH
) undershoot: > 2 V at V
CC
= 3.3 V and
T
amb
= 25
C
ESD protection:
HBM JESD22-A114E exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from
40 C
to +85
C
and from
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LV04D
74LV04DB
74LV04PW
74LV04BQ
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
Name
SO14
SSOP14
TSSOP14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

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Description inverters hex inverter 3-volt inverters hex inverter 3-volt inverters hex inverter inverters hex inverter 3-volt
Brand Name NXP Semiconduc NXP Semiconduc - NXP Semiconductor
Is it Rohs certified? conform to conform to - conform to
Maker NXP NXP - NXP
Parts packaging code SSOP1 SSOP1 - SOIC
package instruction 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 - 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Contacts 14 14 - 14
Manufacturer packaging code SOT337-1 SOT337-1 - SOT108-1
Reach Compliance Code compli compli - compliant
series LV/LV-A/LVX/H LV/LV-A/LVX/H - LV/LV-A/LVX/H
JESD-30 code R-PDSO-G14 R-PDSO-G14 - R-PDSO-G14
JESD-609 code e4 e4 - e4
length 6.2 mm 6.2 mm - 8.65 mm
Load capacitance (CL) 50 pF 50 pF - 50 pF
Logic integrated circuit type INVERTER INVERTER - INVERTER
MaximumI(ol) 0.006 A 0.006 A - 0.006 A
Humidity sensitivity level 1 1 - 1
Number of functions 6 6 - 6
Number of entries 1 1 - 1
Number of terminals 14 14 - 14
Maximum operating temperature 125 °C 125 °C - 125 °C
Minimum operating temperature -40 °C -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SSOP SSOP - SOP
Encapsulate equivalent code SSOP14,.3 SSOP14,.3 - SOP14,.25
Package shape RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH - SMALL OUTLINE
method of packing TUBE TAPE AND REEL - TUBE
Peak Reflow Temperature (Celsius) 260 260 - 260
power supply 3.3 V 3.3 V - 3.3 V
propagation delay (tpd) 25 ns 25 ns - 25 ns
Certification status Not Qualified Not Qualified - Not Qualified
Schmitt trigger NO NO - NO
Maximum seat height 2 mm 2 mm - 1.75 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V - 5.5 V
Minimum supply voltage (Vsup) 1 V 1 V - 1 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V - 3.3 V
surface mount YES YES - YES
technology CMOS CMOS - CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD - NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING - GULL WING
Terminal pitch 0.65 mm 0.65 mm - 1.27 mm
Terminal location DUAL DUAL - DUAL
Maximum time at peak reflow temperature 30 30 - 30
width 5.3 mm 5.3 mm - 3.9 mm
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