0603ESDA2-TR2 ESD Suppressor
PolySurg
™
Series
Applications
•
•
•
•
•
•
•
•
Computers and peripherals
Blu-Ray/DVD players
Satellite and HD radio
PDAs
Digital camcorders
Set top Boxes
DSL Modems
High speed data ports
- USB 2.0/3.0
- High speed ethernet
- Infiniband
®
•
•
•
•
•
•
•
HF
Pb
FREE
HDTV Equipment
A/V Equipment
Cell phones
Digital still cameras
MP3 / Multimedia players
External storage
GPS
HALOGEN
- IEEE 1394
- DVI
- HDMI
Part Numbering System:
0603
ESDA
2
TR2
Surface Mount Device
Package size
Product family
Second generation designator
Packaging code
Description
The second generation PolySurg™ 0603ESDA2-TR2 ESD Suppressors
protect valuable high-speed data circuits from ESD damage without distorting
data signals as a result of its ultra-low (0.15pF maximum) capacitance.
Packaging
• 5000 pieces in paper tape on 7 inch diameter (178mm) reel per
EIA Standard 481.
Packaging Code
Package Code Suffix Description
-TR2
5000 pieces in paper tape on 7 inch diameter
(178mm) reel per EIA Standard 481
Features
•
•
•
•
•
•
•
•
Lead free, halogen free materials
0603/1608 footprint surface mount device
Ideal ESD protection for high frequency, low voltage applications
Exceeds testing requirements of IEC 61000-4-2
Ultra low capacitance (0.15pF maximum)
Very low leakage current
Fast response time
Bi-directional
Device Marking
PolySurg™ ESD Suppressors are marked on the tape and reel packages, not
individually. Since the product is bi-directional and symmetrical, no orientation
marking is required.
Max
30
60
--
15
0.15
100
45
+105
--
Specifications
Performance Characteristics
Continuous Operating Voltage
Clamping Voltage
1
Trigger Voltage
2
ESD Threat Voltage Capability
Capacitance (@ 1MHz)
Leakage Current (@ 12Vdc)
Peak Current
Operating Temperature
ESD Pulse Withstand
Units
Vdc
V
V
kv
pF
nA
A
°C
# Pulses
Min
--
--
--
--
--
--
--
-55
20
Typ
14
35
350
8
0.10
<0.1
30 Typ.
+25
>500
Design Consideration
The location in the circuit for the 0603ESDA2-TR2 Series has to be carefully
determined. For better performance, the device should be placed as close to
the signal input as possible and ahead of any other component. Due to the
high current associated with an ESD event, it is recommended to use a
“0-stub” pad design (pad directly on the signal/data line and second pad
directly on common ground).
Processing Recommendations
The 0603ESDA2-TR2 Series currently has a convex profile on the top surface
of the part. This profile is a result of the construction of the device. They can
be processed using standard pick-and-place equipment. The placement and
processing techniques for these devices are similar to those used for chip
resistors and chip capacitors.
1. Per IEC 61000-4-2, 30A @ 8kV, Level 4, contact discharge, measurement made 30ns
after initiation of pulse.
2. Trigger measurement made using Transmission Line Pulse (TLP) method.
0612
BU-SB12433
Page 1 of 2
Data Sheet 4419
Environmental Specifications:
• Coating bond strength: ASTM D3359-83, Method A, Section 6.
Note: the device coating is not scored.
• Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H
2
O,
detergent solution, defluxer).
• Humidity(steady state): MIL-STD-883, method 1004.7, 85% RH, 85°C,
240 hrs.
• Thermal shock: MIL-STD-202F, method 107G, -65°C to 125°C, 30
min, 5 cycles.
• Vibration: MIL-STD-202F,method 201A,(10 to 55 to 10Hz, 1 minute
cycle, 2 hrs. each in X-Y-Z axis).
• Solder leach resistance and terminal adhesion per EIA-567.
• Solderability per MIL-STD-202, Method 208 (95% coverage).
• Full load voltage: 14.4Vdc, 1000hrs., 25°C.
• Operating temperature characteristics: Electrical testing at
+105°C and -55°C.
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak temperatures and durations:
- IR Reflow = 260°C max for 30 sec. max. Capable of 3X reflow.
- Wave Solder = 260°C max. for 10 sec. max.
- Hand Soldering = 350°C max. for 5 sec. max.
Recommended IR Reflow Profile
Supplier Tp > Tc
-
User Tp < Tc
Tc
Tc -5°C
-
Supplier tp
User tp
T
p
Te m p e r a t u r e
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
t
p
t
T
c
-5°C
T
L
T
smax
Preheat Area
T
smin
Dimensions - mm (in)
t
s
T
H
25
Time 25°C to Peak
Time
Profile Feature
Preheat & Soak
Temperature min (T
smin
)
Temperature max (T
smax
)
Time (T
smin
to T
sma
x) (t
s
)
Average ramp-up rate (T
smax
to T
p
)
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
Peak package body temperature (T
p
)*
Sn-Pb Eutectic Assembly
100°C
150°C
60-120 seconds
3°C/second max.
183°C
60-150 seconds
See classification temp
in Table 4.1
20** seconds
Pb-Free Assembly
150°C
200°C
60-120 seconds
3°C/second max.
217°C
60-150 seconds
See classification temp
in Table 4.2
30** seconds
L
W
EIA Size
0603ESDA
L
W
H
T
1.60±0.15
0.80±0.10
0.60±0.10
0.31±0.21
(0.063±0.006) (0.031±0.004) (0.024±0.004) (0.012±0.008)
Time (t
p
)** within 5°C of the specified
classification temperature (T
c
)
Average ramp-down rate (T
p
to T
smax
)
6°C/second max.
6°C/second max.
Time 25°C to peak temperature
6 minutes max.
8 minutes max.
* Tolerance for peak profile temperature (T
p
) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
Recommended Pad Layout - in (mm)
(per IPC-SM-782 )
Tape and Reel Specifications - mm (in)
0.60min
(0.023 min)
1.1 ref
(0.043 ref)
1.0 max
(0.039 max)
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-
port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
© 2012 Cooper Bussmann
www.cooperbussmann.com
0612
BU-SB12433
Page 2 of 2
Data Sheet 4419
京公网安备 11010802033920号
EEWORLD
