ESD Protection Devices
ESD Protection Devices
TE’s ESD line of devices help protect I/O ports on HDMI
1.3, portable video players, LCD & plasma TVs, USB 2.0,
digital visual interface (DVI), and antenna switches. ESD
devices shunt electrostatic discharge away from
sensitive circuitry in HDTV equipment, printers, laptops,
cellular phones, and other portable devices.
ESD devices offer many advantages over traditional
protection devices, such as multi layer varistors (MLVs),
which may degrade or distort the signal in high data rate
circuits. Compared to transient voltage suppression
(TVS) diodes and miniature gas discharge tubes (GDTs),
ESD devices provide a more compact form factor and
an economical solution for the shrinking profiles of
today’s compact information appliances.
Available in a range of form factors, our ESD protection
devices provide low capacitance, and meet transmission
line pulse (TLP) testing, as well as IEC61000-4-2 testing.
Benefits
• ESD protection for high frequency applications
(HDMI 1.3)
• Smaller form factor for board space savings
• Helps protect sensitive electronic circuits against
damage caused by electrostatic discharge (ESD)
events
• Assists equipment to pass IEC 61000-4-2,
level 4 testing
Features
• RoHS compliant
• Halogen free
(refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm)
9
• 0.25 pF (typical) capacitance
• Low-leakage current
• Low-clamping voltage
• Fast response time (< 1ns)
• Capable of withstanding numerous ESD strikes
• Compatible with standard reflow installation
procedures
• Thick film technology
• Bi-directional protection
Applications
• HDMI 1.3 interfaces
• LCD & plasma TV
• Cellular phones
• Antennas
• Portable video players
• Portable devices (PDA, DSC, BlueTooth)
• Printer ports
OBSOLETE
• USB 2.0 and IEEE 1394 interfaces
• DVI
• GPS systems
• Satellite radios
NOT the LATEST
REVISION
57
Table E1 Electrical Characteristics for ESD Devices
Continuous Max
Operating Voltage
Symbol
Unit
PESD0402-140
PESD0603-240
PESD1206Q-240
V
DC
V
14
24
24
Typical
Trigger Voltage*
V
T(TLP)
V
250
215
250
Typical
Clamping Voltage
†
V
C(TLP)
V
40
45
45
Typical Capacitance
@1 MHz, 1V
RMS
C
P
pF
0.25
0.25
0.25
Typical Leakage
Current
I
L(TYP)
µA
< 0.01
< 0.01
< 0.01
Max Leakage
Current @ Max V
DC
I
L(MAX)
µA
10.0
10.0
10.0
Notes
: * TLP test method at 1kV.
† Measured 30ns after pulse initiation.
Typical capacitance value is at 0V and Max Operating Voltage bias.
Figure E1 Capacitance vs. Frequency for ESD Devices
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
Capacitance (pF)
0
500
1000
1500
2000
2500
3000
Frequency (MHz)
Figure E2 Eye Diagram Performance at 3.4 GHz for ESD Devices
9
Figure E3 Insertion Loss Diagram for ESD Devices
0.1
0
-0.1
Insertion Loss (dB)
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
0.3
1
10
100
-0.1dB at 3.4GHz
1000
6000
Frequency (MHz)
58
RoHS Compliant, ELV Compliant
HF
Halogen Free
ESD Protection Devices
Figure E4-E5 ESD Protection for HDMI
Figure E4
ESD Protection for HDMI (0402 and 0603)
HDMI Port
HDMI
Transmitter or
Receiver
TX0+
TX0-
TX01+
TX01-
TX02+
TX02-
TC+
TC-
HDMI Port
Figure E5
ESD Protection for HDMI (1206Q)
HDMI
Transmitter or
Receiver
TX0+
TX0-
TX01+
TX01-
TX02+
TX02-
TC+
TC-
Outside World
PESD Devices
Outside World
PESD Devices
2 PESD1206Q Arrays
GND
Chassia
GND
Chassia
Table E2 Dimensions for ESD Devices in Millimeters (Inches)*
A
Part Number
PESD0402-140
Min.
0.90
(0.035)
PESD0603-240
1.50
(0.059)
PESD1206Q-240
3.10
(0.122)
Max.
1.10
(0.043)
1.70
(0.067)
3.30
(0.130)
Min.
0.23
(0.009)
0.45
(0.018)
0.40
(0.016)
B
Max.
0.43
(0.017)
0.55
(0.022)
0.60
(0.024)
Min.
0.10
(0.004)
0.10
(0.004)
0.10
(0.004)
C
Max.
0.30
(0.012)
0.50
(0.020)
0.30
(0.012)
Min.
0.40
(0.016)
0.70
(0.028)
1.50
(0.059)
D
Max.
0.60
(0.024)
1.00
(0.039)
1.70
(0.067)
0.20
(0.008)
0.60
(0.024)
0.20
(0.008)
0.60
(0.024)
E7
—
—
—
—
E6
Min.
—
E
Max.
—
Min.
—
F
Max.
—
Figure
E6
*The dimensions in inches are rounded approximations.
9
Figure E6-E7 Dimension Figures for ESD Devices
Figure E6
Figure E7
D
A
A
A
A
B
F
B
C
(side view)
C
(drawing not to scale)
C
(drawing not to scale)
E
B
F
E
C
(side view)
B
D
Table E3 Environmental Specifications for ESD Devices
Test Conditions
Bias humidity test
Thermal shock
Bias heat test
Bias low temp test
Solderability
Solder heat
Vibration
Solvent resistance
Shock
85°C, 85% RH, V
DC (max)
, 1000 hrs
-55°C to 125°C, 30 min dwell, 1000 cycles
125°C, V
DC (max)
, 1000 hrs
-55°C, V
DC (max)
, 1000 hrs
250°C ± 5°C, 3 ±1s
260°C, 10s
10 to 50Hz, 60s cycle, 2 hrs each in X-Y-Z-direction
IPA ultrasonic 300s
1500G, 0.5ms each, X-Y-Z axis 3 times each axis
Pass / Fail Criteria
I
L
I
L
I
L
I
L
10 µA
10 µA
10 µA
10 µA
95% coverage
90% coverage
No physical damage
No physical damage
No physical damage
RoHS Compliant, ELV Compliant
HF
Halogen Free
59
Table E4 General Characteristics for ESD Devices
Storage temperature
Operating temperature
ESD voltage capability
(tested per IEC 61000-4-2)
ESD pulse withstand
-40°C to +85°C
-55°C to +125°C
Contact discharge mode : 8kV (typical), 15kV (max)
Air discharge mode
: 15kV (typical), 25kV (max) [1 pulse: per customer request]
100 pulses
(tested per IEC 61000-4-2, level 4,contact method)
Table E5 Materials Information for ESD Devices
RoHS compliant
ELV compliant
Halogen free
Directive 2002/95/EC compliant
Directive 2000/53/EC compliant
Halogen free refers to: Br 900ppm, Cl 900ppm, Br+Cl 1500ppm
Table E6 Recommended Pad Layout for ESD Devices in Millimeters (Inches)*
V
Part Number
PESD0402-140
Min.
—
Max.
—
Min.
0.60
(0.024)
PESD0603-240
—
—
0.90
(0.035)
V
Typ.
3.20
(0.126)
*The dimensions in inches are rounded approximations.
W
Max.
0.70
(0.028)
1.00
(0.039)
Min.
0.30
(0.012)
0.50
(0.020)
X
Max.
0.40
(0.016)
0.60
(0.024)
Min.
0.80
(0.031)
1.00
(0.039)
Y
Max.
0.90
(0.035)
1.10
(0.043)
Min.
2.10
(0.083)
2.70
(0.106)
Z
Max.
2.20
(0.087)
2.80
(0.110)
E8
Figure
E8
9
Part Number
PESD1206Q-240
W
Typ.
2.20
(0.087)
X
Typ.
0.50
(0.020)
Y
Typ.
0.80
(0.031)
Z
Typ.
1.00
(0.039)
Figure
E9
Figure E8
X
Figure E9
V
W
Z W
Y
Z
Note:
Solder thickness 0.15 to 0.2 mm
X
Y
Table E7 Solder Reflow Recommendations for ESD Devices
A Temperature ramp up 1
B Preheating
C Temperature ramp up 2
D Main heating
From ambient to preheating
temperature
140°C - 160°C
From preheating to main
heating temperature
at 200°C
at 220°C
at 240°C
at 260°C
From main heating
temperature to 100°C
30s to 60s
60s to 120s
20s to 40s
60s to 70s
50s to 60s
30s to 40s
5s to 10s
4°C/s max
Figure E10
300
Preheating
Soldering
Cooling
Temperature (˚C)
250
200
150
100
50
0
A
B
C
D
E
E
Cooling
Times (s)
60
RoHS Compliant, ELV Compliant
HF
Halogen Free
ESD Protection Devices
Table E8 Tape and Reel Specifications for ESD Devices
Tape Dimension
EIA Mark
W
P
0
P
1
P
2
A
0
B
0
D
0
F
E
1
T
0402
Dimension (mm)
8.00
4.00
2.00
2.00
0.69
1.19
1.50
3.50
1.75
0.48
Tolerance
±0.30
±0.10
±0.05
±0.05
±0.05
±0.05
±0.10
±0.05
±0.10
±0.03
8.00
4.00
4.00
2.00
1.27
2.02
1.50
3.50
1.75
0.60
0603
Dimension (mm)
Tolerance
±0.30
±0.10
±0.05
±0.05
±0.15
±0.20
±0.10
±0.05
±0.10
±0.03
8.00
4.00
4.00
2.00
2.02
3.62
1.50
3.50
1.75
0.75
1206Q
Dimension (mm)
Tolerance
±0.30
±0.10
±0.05
±0.05
±0.20
±0.20
±0.10
±0.05
±0.10
±0.03
Reel Dimensions (0402, 0603 & 1206Q)
EIA Mark
Dimension (mm)
A max.
N min.
W
1
max.
W
2
max.
180.0
60.5
9.5
14.0
Figure E11 EIA Referenced Taped Component Dimensions for ESD Devices
P
0
T
P
2
E
1
9
D
0
A
0
F
W
B
0
P
1
Figure E12 EIA Referenced Reel Dimensions for ESD Devices
W
2
W
1
A
N
RoHS Compliant, ELV Compliant
HF
Halogen Free
61
Discrete Device
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