Chip
Fuses
CC06H Series
High I
2
t 0603
Size
Fuse
Features
•
•
•
•
•
•
•
•
HF
FREE
HALOGEN
Pb
Halogen free
High inrush withstand capability
Fast-acting performance
RoHS compliant
Lead free
Ampacity alpha mark on fuse for easy identification
Standard termination design for easy solderability
Compatible with standard lead-free solder reflow and wave soldering
processes
• Excellent environmental integrity
Applications
For secondary protection in space constrained applications such as:
Surface Mount Device
Electrical Characteristics
Amp Rating
1-5A
1-5A
1-5A
Description
The Chip™ CC06H Series high I
2
t fuse is a very small surface mount fuse
(0603 size) designed to protect low voltage circuits from the harmful effects
of short-circuits. The technology of this series combines the robust Cooper
Bussmann
®
solid matrix fuse construction with advanced fuse element design
to deliver state-of-the-art overcurrent protection on circuits subject to inrush
currents.
% of Amp Rating
100
200
250
Opening Time
4 Hours
1-60 Seconds
5 Seconds Maximum
•
•
•
•
•
LCD backlight inverters
Digital cameras
DVD players
Bluetooth headsets
Battery packs
®
Agency Information
•
C
US
Recognized Card: (1A-5A) Guide JDXY2, File E19180
Part Numbering System: CC06H 1A -TR
Fuse Series
Amp Rating
Packaging Code Suffix
Packaging
• TR - Packaging code suffix for tape-and-reel
(8mm wide tape on 178mm diameter reel - specification EIA 481-1)
• Quantity = 5000 fuses
Specifications
Catalog
Amp
Number
Rating
5
CC06H1A
1
CC06H1.5A
1.5
CC06H2A
2
CC06H2.5A
2.5
CC06H3A
3
CC06H3.5A
3.5
CC06H4A
4
CC06H5A
5
Alpha
Marking
B
H
K
L
O
R
S
T
Voltage
Interrupting
Typical
Rating Vdc Rating (amps)
1, 4
Resistance (Ω)
2
32
50
0.225
32
50
0.122
32
50
0.061
32
50
0.045
32
50
0.027
32
50
0.021
32
50
0.018
32
50
0.013
Typical
Melt I
2
t
3
0.02
0.07
0.20
0.25
0.30
0.60
1
2
Typical
Typical
Voltage Drop (V) Power Loss (W)
0.295
0.30
0.220
0.33
0.160
0.32
0.145
0.36
0.110
0.33
0.100
0.35
0.100
0.40
0.088
0.44
Agency Approvals
cRUus
x
x
x
x
x
x
x
x
1. DC Interrupting Rating (measured at rated voltage, time constant of less than 50 microseconds,
battery source).
2. DC Cold Resistance are measured at <10% of rated current in ambient temperature of 20ºC -
FOR REFERENCE ONLY - CONTROLLED VALUES HELD BY PLANT AND SUBJECT TO CHANGE
WITHOUT NOTICE.
3. Typical Pre-arching I
2
t are measured at 10In current.
4. The insulation resistance after breaking capacity test is higher than 0.1MΩ when measured by
2X rated voltage.
5. Device designed to carry rated current for 4 hours minimum. An operating current 80% or less of
rated current is recommended, with further design derating required at elevated ambient
temperature. See Temperature Derating Curve on next page.
0609
BU-SB09345
Page 1 of 4
Data Sheet 4346
Time-Current Curves
100
1A
1 .5A
10
2A
3A
3 .5 A
4A
2 .5 A
5A
Melting I
2
t Curves
100
10
Average Melting Time (seconds)
1
0 .1
Melting I t
2
1
0 .0 1
0 .1
0 .0 0 1
0 .0 0 0 1
1
10
100
Current (amps)
0 .0 1
0 .0 0 0 0 1
0 .0 0 0 1
0 .0 0 1
0 .0 1
0 .1
1
10
Time (seconds)
Temperature Derating Curve
Construction
Amp Rating Alpha Code
Fused Green Glass Cover
End Termination
White
Ceramic
Substrate
1 = Silver termination pad
2 = Green fused glass cover
3 = Alpha code marking
4 = End termination:
A) Nickel underplate - 200 to 400 microinches
B) 100% Tin plate - 300 to 600 microinches
5 = Metal film fusible element
6 = White ceramic substrate
0609
BU-SB09345
Page 2 of 4
Data Sheet 4363
Dimensions - mm (in)
Recommended Pad Layout - mm (in)
1.25
(0.05)
1.60 ± 0.15
(0.063 ± 0.006)
0.81 ± 0.15
(0.032 ± 0.006)
0.50
(0.02)
0.90
(0.035)
0.35 ± 0.15
(0.014 ± 0.006)
0.47 ± 0.08
(0.0185 ± 0.003)
Product Characteristics
Operating Temperature
Storage Temperature
Load Humidity
Moisture Resistance
Thermal Shock
Vibration Test
Mechanical Shock Resistance
Salt Spray Resistance
Insulation Resistance
Solderability
Resistance to Soldering Heat
High Temperature Life Test
Board Flex Test
Terminal Strength
Resistance to Solvents
-40°C to 85°C , with proper derating factor applied
-40°C to 85°C
MIL-STD-202G, Method 103B (1000 hr @ 85°C / 85% RH & 10% rated current)
MIL-STD-202, Method 106E (50 cycles)
MIL-STD-202, Method 107D (-65°C to +125°C, 100 cycles)
MIL-STD-202, Method 204D, Test Condition D (10-2,000Hz)
MIL-STD-202, Method 213B (3000G / 0.3ms)
MIL-STD-202, Method 101, Test Condition B (48 hr exposure)
The insulation resistance after breaking capacity test is higher than 0.1MΩ when measured by 2X rated voltage
J-STD-002C Method B1 (Dip and Look Test), Method G1 (Wetting Balance Test), Method D (Resistance to
Dissolution / Dewetting of Metalization)
MIL-STD-202, Method 210F (Solder dip - 260°C, 60 seconds / Solder Iron - 350°C, 3-5 seconds)
MIL-STD-202G, Method 108A (1000 Hours @ 70°C & 60% rated current)
AEC-Q200 Method 005 (2mm deflection for 60 seconds)
AEC-Q200 Method 006 (5N force for 60 seconds)
MIL-STD-202, Method 215K
0609
BU-SB09345
Page 3 of 4
Data Sheet 4346
Solder Reflow Profile
T
P
T
C
-5°C
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Volume
Package
mm
3
Thickness
<350
<1.6mm
260°C
1.6 – 2.5mm 260°C
>2.5mm
250°C
Time
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Manual solder (rework only): solder tip 350°C maximum, 5 seconds maximum.
Reference JDEC J-STD-020D
Profile Feature
Preheat
and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free
Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
Table 2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
** Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-
port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
© 2009 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
0609
BU-SB09345
Page 4 of 4
Data Sheet 4346
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