EEWORLDEEWORLDEEWORLD

Part Number

Search

D55342K07U820HP-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.25W, 820000ohm, 100V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size100KB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

D55342K07U820HP-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 820000ohm, 100V, 2% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

D55342K07U820HP-W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid7024413909
package instructionCHIP
Reach Compliance Codenot_compliant
ECCN codeEAR99
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.46 mm
Package length3.2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.55 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance820000 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfacePlatinum/Gold (Pt/Au)
Terminal shapeWRAPAROUND
Tolerance2%
Operating Voltage100 V
State of the Art, Inc.
Thick Film Chip Resistor
D55342/07 RM1206
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
250 mW
100 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
CURRENT NOISE
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
D55342 K 07 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /07* = RM1206
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
*RM1206 is specified in MIL-PRF-55342 as D55342 /07 rather than M55342 /07.
MECHANICAL
INCHES
MILLIMETERS
.156
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.126 (.118 - .134)
.061 (.058 - .068)
.018 (.015 - .033)
.016 (.010 - .025)
.018 (.010 - .025)
.090 (.086 - .094)
.0084 grams
3.20
1.55
0.46
0.41
0.46
2.29
(3.00 - 3.40)
(1.47 - 1.73)
(0.38 - 0.84)
(0.25 - 0.64)
(0.25 - 0.64)
(2.18 - 2.39)
.067
.084
.036
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
EEWORLD University Hall ---- Shiqun Circuit Video
Shiqun circuit video : https://training.eeworld.com.cn/course/4074...
老白菜 Analog electronics
How to define .TSL_IO_ALCODE in STM8S103K
To use ST's touch library, where should I specifythe address of TSL_IO_ALCODE?Please advise...
chunxilu1979 stm32/stm8
Qorvo will meet you in Beijing
Qorvo is waiting for you at booth 530, National Convention Center, No. 7, Tianchen East Road, Chaoyang District, Beijing.EDI CON China (Electronic Design Innovation Conference) is an industry-driven c...
alan000345 RF/Wirelessly
51 MCU source code
51 MCU source code...
taowenfeng 51mcu
Distributed body control modules will lead the development trend
According to recent research by Allway Consulting, in recent years, body network control technology has begun to be widely used in my country's automotive industry. The automotive body control module ...
1ying Automotive Electronics
The concept of testability in PCB design
The testability of product design (De sign For Testability. OFT) is also the main content of product manufacturability. It is also one of the process characteristics of design from the production pers...
songbo PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2889  1194  2222  25  2555  59  25  45  1  52 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号