TCXO & VCTCXO
CERAMIC SMD TYPE
STJ
-
-
-
-
-
-
Temperature Compensated Crystal Oscillator
External Dimensions : 2.5×2.0 mm
Fundamental AT-cut Crystal used
Clipped Sinewave Output
Application for Cellular phone(WIMAX, CDMA, WCDMA)
Application for GPS Available on Tape and Reel
■ ELECTRICAL SPECIFICATIONS
ITEM
Output Logic Type
Frequency Range
Supply Voltage(V
DD
)
Operating Temperature Range
Storage Temperature Range
Frequency Stability
Vs. Temperature
Vs. Supply voltage
Vs. Load
Vs. Aging
Frequency Tolerance
Input Current
Frequency Deviation
Control Voltage(Vc)
Output Level
Output Load Condition
Phase Noise at 1kHz offset
Clipped Sinewave
13.000 MHz to 52.000 MHz
1.8 V
DC
to 3.3 V
DC
-30 to +85 ℃
-40 to +85 ℃
±0.5
±0.2
±0.2
±1.0
ppm/ ±2.0 ppm Max.
ppm Max.
ppm Max.
ppm Max.
Over Operating Temperature range
Supply Voltage ± 5 %
10 ㏀//10 pF± 10 %
25℃, First year
Value
Remarks
±1.0 ppm Max.
2 mA Max.
±5.0 ppm, ±10 ppm Min.
1.4 V ± 1.0 V, 1.5 V ±1.0 V
0.8 Vp-p Min.
10 ㏀//10 pF
-130 dBc/Hz
Typical
Peak to peak
Typical
■ MECHANICAL DIMENSIONS
(mm)
■ LAND PATTERN
(mm)
http://www.sunny.co.kr
SUNNY ELECTRONICS CORP
TCXO & VCTCXO
■ PART NUMBERING GUIDE
STJ 33 20 H S 5
–
10.000M
Temp
SUPPLY VOLTAGE(V
DD
)
33 : 3.3 V, 25 : 2.5 V
18 : 1.8 V
FREQUENCY STABILITY
TABLE 1
OPERATING
TEMPERATURE RANGE
TABLE 1
OUTPUT
S : CLIPPED SINEWAVE
FREQUENCY
DEVIATION
BLANK : TCXO
5 : ± 5 ppm min.
10 : ± 10 ppm min.
FREQUENCY
M : MHz
■ TABLE 1
FREQUENCY STABILITY VS. TEMPERATURE RANGE
Stability
±0.5
05
A
B
C
D
E
F
G
H
I
*
*
*
*
*
*
*
±1.0
10
*
*
*
*
*
*
*
*
*
±1.5
15
*
*
*
*
*
*
*
*
*
±2.0
20
*
*
*
*
*
*
*
*
*
±3.0
30
*
*
*
*
*
*
*
*
*
±5.0
50
*
*
*
*
*
*
*
*
*
0~50℃
-10~60℃
-10~70℃
-20~70℃
-30~60℃
-30~70℃
-30~75℃
-40~80℃
-40~85℃
■
TEST CIRCUIT (Clipped Sinewave)
■
WAVEFORM (Clipped Sinewave)
■
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Temperature Cycling
Fine Leak Test
Gross Leak Test
Mechanical Shock
Vibration
Moisture Resistance
Moisture Sensitivity
Resistance to Soldering Heat
Solderability
http://www.sunny.co.kr
MIL-STD-883, Method 1010, Condition B
MIL-STD-883, Method 1014, Condition A
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
MIL-STD-883, Method 1004
J-STD-020, MSL 1
MIL-STD-202, Method 210, Condition K
MIL-STD-883, Method 2003
SUNNY ELECTRONICS CORP
ARM Technology
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EEWORLD
