IC,PROM,8KX8,TTL,DIP,24PIN,CERAMIC
| Parameter Name | Attribute value |
| Objectid | 1164789621 |
| package instruction | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 70 ns |
| JESD-30 code | R-XDIP-T24 |
| JESD-609 code | e0 |
| memory density | 65536 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of terminals | 24 |
| word count | 8192 words |
| character code | 8000 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 8KX8 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
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