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MB7144EZ

Description
IC,PROM,8KX8,TTL,DIP,24PIN,CERAMIC
Categorystorage    storage   
File Size539KB,15 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
Download Datasheet Parametric View All

MB7144EZ Overview

IC,PROM,8KX8,TTL,DIP,24PIN,CERAMIC

MB7144EZ Parametric

Parameter NameAttribute value
Objectid1164789628
package instructionDIP, DIP24,.6
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time65 ns
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density65536 bit
Memory IC TypeOTP ROM
memory width8
Number of terminals24
word count8192 words
character code8000
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Certification statusNot Qualified
Maximum slew rate0.19 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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