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K6X1008C2D-DF700

Description
Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, DIP-32
Categorystorage    storage   
File Size123KB,10 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K6X1008C2D-DF700 Overview

Standard SRAM, 128KX8, 70ns, CMOS, PDIP32, 0.600 INCH, DIP-32

K6X1008C2D-DF700 Parametric

Parameter NameAttribute value
Parts packaging codeDIP
package instructionDIP,
Contacts32
Reach Compliance Codeunknow
ECCN codeEAR99
Maximum access time70 ns
JESD-30 codeR-PDIP-T32
length41.91 mm
memory density1048576 bi
Memory IC TypeSTANDARD SRAM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1
K6X1008C2D Family
Document Title
128Kx8 bit Low Power CMOS Static RAM
CMOS SRAM
Revision History
Revision No.
0.0
0.1
History
Initial draft
Revised
- Deleted 32-TSOP1-0820R Package Type.
- Added Commercial product.
Revised
- Added Lead Free 32-SOP-525 Product
Revised
- Added Lead Free 32-TSOP1-0820F Product
Finalized
- Changed I
CC
from 10mA to 5mA
- Changed I
CC
2 from 35mA to 25mA
- Changed I
SB
from 3mA to 0.4mA
- Changed I
DR
(industrial)
from 15µA to 10µA
- Changed I
DR
(Automotive)
from 25µA to 20µA
Revised
- Changed I
SB
1
of Automotive product from 25µA to 30µA
- Deleted 55ns Automotive product
Revised
- Changed I
SB
1
of Automotive product from 30µA to 50µA
- Changed I
DR
of Automotive product from 20µA to 25µA
- Added Lead Free Products
Draft Data
July 15, 2002
December 4, 2002
Remark
Preliminary
Preliminary
0.2
May 13, 2003
Preliminary
0.3
June 21, 2003
Preliminary
1.0
September 16, 2003
Final
2.0
July 15, 2004
Final
3.0
March 27, 2005
Final
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions. If you have any questions, please contact the SAMSUNG branch offices.
1
Revision 3.0
March 2005
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