EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342M08W20H0M

Description
Fixed Resistor, Metal Glaze/thick Film, 0.8W, 20000ohm, 150V, 2% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP
CategoryPassive components    The resistor   
File Size102KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Download Datasheet Parametric View All

M55342M08W20H0M Overview

Fixed Resistor, Metal Glaze/thick Film, 0.8W, 20000ohm, 150V, 2% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP

M55342M08W20H0M Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1950548098
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
YTEOL7.8
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package shapeRECTANGULAR PACKAGE
Rated power dissipation(P)0.8 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance20000 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance2%
Operating Voltage150 V

M55342M08W20H0M Preview

State of the Art, Inc.
Thick Film Chip Resistor
M55342/08 RM 2010
CURRENT NOISE
TEMPERATURE RISE (°C)
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
800 mW
150 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 08 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
G: Gold wraparound
W: Gold wire bondable
SIZE CODE: /08 = RM2010
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.191 - .218)
.094 (.093 - .103)
.025 (.015 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.64
0.51
0.48
4.17
(4.85 - 5.54)
(2.36 - 2.62)
(0.38 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
Please recommend books~~
I am a student and would like to have a deeper understanding of storage devices such as registers, such as the internal structure of registers, their design, power consumption reduction, etc. Does any...
madcow Embedded System
Capacitance acquisition of the level measurement system based on capacitance-to-digital converter AD7746 is completed
At this stage, the capacitance data collected by AD7746 can basically be sent to the PC tool for monitoring! In the next stage, we will try to improve the stability and range of the collected capacita...
蓝雨夜 ADI Reference Circuit
Help, about fat file system - online waiting
I wrote a fat16 file system formatting program, but after writing it to the flash memory, it is always not recognized as a file system. I use K9F2G08X0 flash memory, 256M, 2048 blocks, 64 pages per bl...
wangp6582 Embedded System
TI uses Magma's EDA to develop 65nm wireless chips
Magma Design Automation Inc. of the United States recently announced that Texas Instruments used Magma's automatic layout design EDA tool "Blast Fusion" in the design of wireless communication chips t...
fighting FPGA/CPLD
I would like to share two problems I encountered in the past two days. ^_^
[size=3]It's the last day of 2014, I'm posting to commemorate it~Maybe it's common sense, experts please ignore it~~~[/size] [size=3]:lol[/size] [size=3] [/size] [size=3]Actually, these two problems w...
anqi90 Embedded System
Urgent!!! Win32 Programming (CE)
#include#define IDI_APPLICATIONMAKEINTRESOURCE(32512)#define WS_OVERLAPPEDWINDOW (WS_OVERLAPPED| \WS_CAPTION| \WS_SYSMENU| \WS_THICKFRAME| \WS_MINIMIZEBOX| \WS_MAXIMIZEBOX)LONG WINAPI WndProc(HWND,UIN...
zh19aang84 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1429  1236  1312  2530  984  29  25  27  51  20 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号