IC Socket, PGA172, 172 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Advanced Interconnections Corp. |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Other features | 1.0 OZ. AVG. INSERTION FORCE |
| body width | 1.8 inch |
| subject depth | 0.031 inch |
| body length | 1.8 inch |
| Contact structure | 18X18 |
| Contact to complete cooperation | TIN LEAD OVER NICKEL |
| Contact completed and terminated | Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier |
| Contact material | BERYLLIUM COPPER |
| Contact style | RND PIN-SKT |
| Device slot type | IC SOCKET |
| Type of equipment used | PGA172 |
| Shell material | POLYIMIDE |
| JESD-609 code | e0 |
| Plug contact pitch | 0.1 inch |
| Installation method | STRAIGHT |
| Number of contacts | 172 |
| Maximum operating temperature | 400 °C |
| Minimum operating temperature | -269 °C |
| PCB contact pattern | RECTANGULAR |
| PCB contact row spacing | 0.1 mm |
| Terminal pitch | 2.54 mm |
| Termination type | SOLDER |
| Base Number Matches | 1 |
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