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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH
±15-kV
IEC ESD PROTECTION
SLLS825 – AUGUST 2007
FEATURES
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V V
CC
Supply
Operates up to 1 Mbit/s
Low Supply Current . . . 300
μA
Typ
External Capacitors . . . 4
×
0.1
μF
Accept 5-V Logic Input With 3.3-V Supply
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection for RS-232 Pins
–
±15-kV
Human-Body Model (HBM)
–
±15-kV
IEC 61000-4-2 Air-Gap Discharge
–
±8-kV
IEC 61000-4-2 Contact Discharge
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
C1+
V+
C1−
C2+
C2−
V−
DOUT2
RIN2
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRSF3232E consists of two line drivers, two line receivers, and a dual charge-pump circuit with
±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). This device provides the electrical
interface between an asynchronous communication controller and the serial-port connector. The charge pump
and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The TRSF3232E operates
at data signaling rates up to 1 Mbit/s and a driver output slew rate of 14 V/μs to 150 V/μs.
ORDERING INFORMATION
T
A
SOIC – D
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – D
SOIC – DW
SSOP – DB
TSSOP – PW
(1)
(2)
PACKAGE
(1) (2)
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Reel of 2000
Tube of 90
Reel of 2000
Tube of 40
SOIC – DW
Tube of 40
TSSOP – PW
Reel of 2000
Tube of 90
Reel of 2000
ORDERABLE PART NUMBER
TRSF3232ECD
TRSF3232ECDR
TRSF3232ECDW
TRSF3232ECDWR
TRSF3232ECDBR
TRSF3232ECPW
TRSF3232ECPWR
TRSF3232EID
TRSF3232EIDR
TRSF3232EIDW
TRSF3232EIDWR
TRSF3232EIDBR
TRSF3232EIPW
TRSF3232EIPWR
TOP-SIDE MARKING
TRSF3232EC
TRSF3232EC
RT32EC
RT32EC
TRSF3232EI
TRSF3232EI
RT32EI
RT32EI
0°C to 70°C
–40°C to 85°C
Package drawings, thermal data, and symbolization are available at
www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH
±15-kV
IEC ESD PROTECTION
SLLS825 – AUGUST 2007
www.ti.com
Table 1. 1-Mbit/s RS-232 Parts
TEMPERATURE
RANGE
PART
NO.
TRSF3221E
NO. OF
DRIVERS
1
NO. OF
RECEIVERS
1
ESD
±15-kV
Air-Gap Discharge,
±8-kV
Contact Discharge,
±15-kV
HBM
±15-kV
Air-Gap Discharge,
±8-kV
Contact Discharge,
±15-kV
HBM
±8-kV
Air-Gap Discharge,
±8-kV
Contact Discharge,
±15-kV
HBM
±15-kV
HBM
SUPPLY
V
CC
(V)
3.3 or 5
FEATURE
PIN/
PACKAGE
16-pin
SOIC, SSOP,
TSSOP
16-pin
SOIC, SSOP,
TSSOP
16-pin
SSOP
16-pin
SOIC, SSOP,
TSSOP
20-pin
SOIC, SSOP,
TSSOP
Auto-powerdown
TRSF3232E
2
2
3.3 or 5
Low pin count
Auto-powerdown
plus, ready signal
Auto-powerdown
Enable,
powerdown
signal
TRS3227
1
1
3.3 or 5
TRSF3221
1
1
3.3 or 5
0°C to 70°C
TRSF3222
2
2
±15-kV
HBM
3.3 or 5
TRSF3223
2
2
±15-kV
HBM
3.5 or 5
20-pin
Auto-powerdown,
SOIC, SSOP,
enable signal
TSSOP
Low pin count
Auto-powerdown
plus
Auto-powerdown
16-pin
SOIC, SSOP,
TSSOP
28-pin
SOIC, SSOP,
TSSOP
28-pin
SOIC, SSOP,
TSSOP
16-pin
SOIC, SSOP,
TSSOP
16-pin
SOIC, SSOP,
TSSOP
16-pin
SSOP
16-pin
SOIC, SSOP,
TSSOP
20-pin
SOIC, SSOP,
TSSOP
TRSF3232
2
2
±15-kV
HBM
3.3 or 5
TRSF3238
5
3
±15-kV
HBM
3.3 or 5
TRSF3243
3
5
±15-kV
HBM
±15-kV
Air-Gap Discharge,
±8-kV
Contact Discharge,
±15-kV
HBM
±15-kV
Air-Gap Discharge,
±8-kV
Contact Discharge,
±15-kV
HBM
±8-kV
Air-Gap Discharge,
±8-kV
Contact Discharge,
±15-kV
HBM
±15-kV
HBM
3.3 or 5
TRSF3221E
1
1
3.3 or 5
Auto-powerdown
TRSF3232E
2
2
3.3 or 5
Low pin count
Auto-powerdown
plus, ready signal
Auto-powerdown
Enable,
powerdown
signal
TRS3227
1
1
3.3 or 5
TRSF3221
1
1
3.3 or 5
–40°C to 85°C
TRSF3222
2
2
±15-kV
HBM
3.3 or 5
TRSF3223
2
2
±15-kV
HBM
3.3 or 5
20-pin
Auto-powerdown,
SOIC, SSOP,
enable signal
TSSOP
Low pin count
Auto-powerdown
plus
Auto-powerdown
16-pin
SOIC, SSOP,
TSSOP
28-pin
SOIC, SSOP,
TSSOP
28-pin
SOIC, SSOP,
TSSOP
TRSF3232
2
2
±15-kV
HBM
3.3 or 5
TRSF3238
5
3
±15-kV
HBM
3.3 or 5
TRSF3243
3
5
±15-kV
HBM
3.3 or 5
2
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH
±15-kV
IEC ESD PROTECTION
SLLS825 – AUGUST 2007
FUNCTION TABLES
xxx
Each Driver
(1)
INPUT
DIN
L
H
(1)
OUTPUT
DOUT
H
L
H = high level, L = low level
Each Receiver
(1)
INPUT
RIN
L
H
Open
(1)
OUTPUT
ROUT
H
L
H
H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
DIN1
10
DIN2
12
ROUT1
5 kW
9
ROUT2
5 kW
8
RIN2
13
RIN1
7
DOUT2
14
DOUT1
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH
±15-kV
IEC ESD PROTECTION
SLLS825 – AUGUST 2007
www.ti.com
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V+
V–
V+ – V–
V
I
V
O
Supply voltage range
(2)
MAX
6
7
–7
13
6
25
13.2
V
CC
+ 0.3
82
46
57
108
150
UNIT
V
V
V
V
V
V
–0.3
–0.3
0.3
Drivers
Receivers
Drivers
Receivers
D package
DB package
DW package
PW package
–0.3
–25
–13.2
–0.3
(2)
Positive-output supply voltage range
(2)
Negative-output supply voltage range
Supply voltage difference
Input voltage range
Output voltage range
(2)
θ
JA
Package thermal impedance
(3) (4)
°C/W
T
J
T
stg
(1)
(2)
(3)
(4)
Operating virtual junction temperature
Storage temperature range
–65
°C
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to network GND.
Maximum power dissipation is a function of T
J
(max),
θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambient
temperature is P
D
= (T
J
(max) – T
A
)/θ
JA
. Operating at the absolute maximum T
J
of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
(1)
MIN
Supply voltage
V
IH
V
IL
V
I
T
A
(1)
Driver high-level input voltage
Driver low-level input voltage
Driver input voltage
Receiver input voltage
Operating free-air temperature
TRSF3232EI
TRSF3232EC
DIN
V
CC
= 3.3 V
V
CC
= 5 V
V
CC
= 3.3 V
V
CC
= 5 V
DIN
DIN
0
–25
–40
0
3
4.5
2
2.4
0.8
5.5
25
85
70
NOM
3.3
5
MAX
3.6
5.5
UNIT
V
V
V
V
°C
Test conditions are C1–C4 = 0.1
μF
at V
CC
= 3.3 V
±
0.3 V; C1 = 0.047
μF,
C2–C4 = 0.33
μF
at V
CC
= 5 V
±
0.5 V (see
Figure 4).
Electrical Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
I
CC
(1)
(2)
Supply current
No load,
TEST CONDITIONS
V
CC
= 3.3 V or 5 V
MIN
TYP
(2)
0.3
MAX
1
UNIT
mA
Test conditions are C1–C4 = 0.1
μF
at V
CC
= 3.3 V
±
0.3 V; C1 = 0.047
μF,
C2–C4 = 0.33
μF
at V
CC
= 5 V
±
0.5 V (see
Figure 4).
All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25°C.
4
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TRSF3232E
3-V TO 5.5-V TWO-CHANNEL RS-232 1-Mbit/s LINE DRIVER/RECEIVER
WITH
±15-kV
IEC ESD PROTECTION
SLLS825 – AUGUST 2007
DRIVER SECTION
Electrical Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
V
OH
V
OL
I
IH
I
IL
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
TEST CONDITIONS
DOUT at R
L
= 3 kΩ to GND,
DOUT at R
L
= 3 kΩ to GND,
V
I
= V
CC
V
I
at GND
V
CC
= 3.6 V,
V
CC
= 5.5 V,
V
CC
, V+, and V– = 0 V,
V
O
= 0 V
V
O
= 0 V
V
O
=
±2
V
300
DIN = GND
DIN = V
CC
MIN
5
–5
TYP
(2)
5.5
–5.4
±0.01
±0.01
±35
±35
10M
±1
±1
±60
±90
MAX
UNIT
V
V
μA
μA
mA
Ω
I
OS (3)
Short-circuit output current
r
o
(1)
(2)
(3)
Output resistance
Test conditions are C1–C4 = 0.1
μF
at V
CC
= 3.3 V
±
0.3 V; C1 = 0.047
μF,
C2–C4 = 0.33
μF
at V
CC
= 5 V
±
0.5 V (see
Figure 4).
All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25°C.
Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Maximum data rate
(see
Figure 1)
t
sk(p)
SR(tr)
(1)
(2)
(3)
Pulse skew
(3)
Slew rate,
transition region
(see
Figure 1)
R
L
= 3 kΩ,
One DOUT switching
TEST CONDITIONS
C
L
= 250 pF,
C
L
= 1000 pF,
V
CC
= 3 V to 4.5 V
V
CC
= 3.5 V to 5.5 V
MIN TYP
(2)
MAX UNIT
1000
1000
300
14
kbit/s
ns
150 V/μs
C
L
= 150 pF to 2500 pF, R
L
= 3 kΩ to 7 kΩ, See
Figure 2
R
L
= 3 kΩ to 7 kΩ, C
L
= 150 pF to 1000 pF, V
CC
= 3.3 V
Test conditions are C1–C4 = 0.1
μF
at V
CC
= 3.3 V
±
0.3 V; C1 = 0.047
μF,
C2–C4 = 0.33
μF
at V
CC
= 5 V
±
0.5 V (see
Figure 4).
All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T
A
= 25°C.
Pulse skew is defined as |t
PLH
– t
PHL
| of each channel of the same device.
ESD Protection
TERMINAL
NAME
DOUT
NO.
HBM
7, 14
IEC 61000-4-2 Air-Gap Discharge
IEC 61000-4-2 Contact Discharge
TEST CONDITIONS
TYP
±15
±15
±8
kV
UNIT
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