BACKPANEL CONNECTORS
ZIPLINE
™
HIGH-DENSITY, HIGH-PERFORMANCE
CONNECTOR SYSTEM
DESCRIPTION
The ZipLine
™
connector system addresses customer demand
for maximum signal density – a paramount requirement for
future equipment platforms – at data rates up to 12.5 Gb/s.
The initial ZipLine signal modules with 1.8mm column pitch
support backplane and orthogonal midplane applications.
A module with 72 differential pairs – consisting of 12 insert-
molded leadframe assemblies (IMLAs), each supporting 6
high-speed differential signal pairs - provides the maximum
density available by delivering 84.6 differential pairs per inch
of card edge. Allowing a minimum 1-inch card slot pitch, the
compact module dimensions help system designers address
mechanical and thermal concerns. The 6-pair ZipLine signal
IMLAs can also be configured on 1.5mm column pitch to
provide more than 100 signal pairs per inch of card edge for
even more backplane signal density.
The connector system leverages FCI proven AirMax VS
®
technology, similar signal integrity performance, power and
guide modules and Hard Metric (HM) equipment design
practice. ZipLine connectors use AirMax VS edge-coupling
technology to deliver low insertion loss and crosstalk without
using costly and space-consuming metal shields. Data rates
can scale up to 12.5 Gb/s without requiring the redesign of a
basic platform.
In addition to offering superior signal density and electrical
performance, the versatile ZipLine design allows for mixed
differential (orthogonal or backplane), single-ended or power
pin assignments within a connector. Another unique feature
is a special power wafer, with up to 36A capacity, which can
be integrated in a 6-pair ZipLine module.
FEATURES & BENEFITS
Supports backplane and orthogonal midplane applications
6-pair modules with IMLAs on 1.8mm column pitch deliver
84.6 differential pairs per inch of card edge while allowing
a minimum 1-inch card slot pitch
6-pair modules can also be configured on 1.5mm column
pitch to provide >100 pairs per inch for even more density
3-pair configuration is under development to enable use
on 15mm card slot pitch
Provides maximum signal density available at data rates
up to 12.5 Gb/s
Use AirMax VS
®
edge-coupling technology to deliver low
insertion loss and crosstalk
Allows for mixed differential (orthogonal or backplane),
single-ended or power pin assignments within a connector
A special power wafer, with up to 36A capacity, can be
integrated within a 6-pair module
Compatible with Hard Metric equipment practice
TARGET MARKETS / APPLICATIONS
Communications
• Routers
• Switches
• Networking
• Access
• Transport
Data
• Servers
• Storage Systems
Industrial
• Medical
• Test & Measurement
ZIPLINE
™
HIGH-DENSITY, HIGH-PERFORMANCE CONNECTOR SYSTEM
TECHNICAL INFORMATION
MATERIALS
Contacts: Copper alloy
Plating:
• Performance-based plating at separable interface
(Telcordia GR-1217 CORE Central Office)
• Tin-lead or tin over nickel on press-fit tails
Housings: High-temperature thermoplastic, UL 94V-0
IMLA organizer: Stainless steel
ELECTRICAL PERFORMANCE
Backplane connectors
• Differential impedance: 100 ± 10Ω @ 60 ps (20-80%) risetime
• Differential insertion loss
• < 1.0 dB through 6.25 Gb/s (3.125 GHz)
• < 2.5 dB through 12.5 Gb/s (6.25 GHz)
• NEXT: 3.25% @ 60 ps (20-80%) risetime
• FEXT: 2.5% @ 60 ps (20-80%) risetime
• In-pair skew:
≤
4 ps
Orthogonal midplane connectors
• Differential impedance: 100 ± 15Ω @ 60 ps (20-80%) risetime
• Differential insertion loss
• < 2.0 dB through 6.25 Gb/s (3.125 GHz)
• < 4.0 dB through 12.5 Gb/s (6.25 GHz)
• NEXT
• < -30 dB through 6.25 Gb/s (3.125 GHz)
• < -25 dB through 12.5 Gb/s (6.25 GHz)
• FEXT
• < -30 dB through 6.25 Gb/s (3.125 GHz)
• < -25 dB through 12.5 Gb/s (6.25 GHz)
Contact resistance
• Signal contact:
≤
130 mΩ initial
• Power contact:
≤
4 mΩ initial
Current rating (with
≤30°C
temperature rise above ambient):
• Signal contact: 0.25A/contact with all contacts powered
• 6-contact power wafer: 6A/contact (36A/wafer) with single
wafer powered, 4.5A/contact (27A/wafer) with 2 adjacent
wafers powered, 2.25A/contact (13.5A/wafer) with 12
adjacent wafers powered
MECHANICAL PERFORMANCE
Mating force: 0.45N maximum per contact
Unmating force: 0.15N minimum per contact
Press-fit insertion force: 25N maximum per tail
ENVIRONMENTAL
Telcordia GR-1217-CORE, Central Office qualification pending
SPECIFICATIONS
Product specification: GS-12-452
Application specification: GS-20-094
APPROVALS AND CERTIFICATIONS
UL and CSA approvals pending
PART NUMBERS
Part Number
10076197-101LF
10076209-101LF
10076222-101LF
10084164-101LF
10084164-102LF
10084166-101LF
10084166-103LF
Description
6 pairs/column x 12 columns (72 differential pairs) vertical backplane header
6 pairs/column x 12 columns (72 differential pairs) right-angle receptacle
6 pairs/column x 12 columns (72 differential pairs) orthogonal midplane header
1 power wafer + 6 pairs/column x 11 columns (66 differential pairs) right-angle receptacle
2 power wafers + 6 pairs/column x 10 columns (60 differential pairs) right-angle receptacle
1 power wafer + 6 pairs/column x 11 columns (66 differential pairs) vertical backplane header
2 power wafers + 6 pairs/column x 10 columns (60 differential pairs) vertical backplane header
ELX1ZIPLINE0308ELT
Printed on recyclable paper
Use web link www.fci.com/zipline to obtain product drawings and additional technical information or contact us at zipline@fci.com.
FCI - Americas : 1 (800) 237 2374 - Europe : 33 1 39 49 21 83 - Asia/Pacific : 65 6549 6666
www.fci.com
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