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470-1235-100

Description
board to board & mezzanine connectors 100p nexlev recept 190 solder balls
CategoryThe connector   
File Size916KB,31 Pages
ManufacturerAll Sensors
Environmental Compliance
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470-1235-100 Overview

board to board & mezzanine connectors 100p nexlev recept 190 solder balls

470-1235-100 Parametric

Parameter NameAttribute value
ManufactureAmphenol
Product CategoryBoard to Board & Mezzanine Connectors
RoHSYes
Stack Heigh23.5 mm
Mounting AngleVertical
Number of Positions100
Number of Rows10
Termination StyleSMD
Factory Pack Quantity40
AMPHENOL TCS
TB-2082
DFM and SMT Assembly Guideline
Revision “F“
Specification Revision Status
Revision
“-“
“A”
“B”
“C”
SCR No.
33277
36994
39831
42921
Description
Initial Release
Update stencil design, JEDEC tray info, add weight
table & GenRad ref, delete AirVac detail.
Revised in it’s entirety and reformatted.
Clarify board warp req, add stand-off req, change
handling to reflect new packaging, changes to paste
process – add selection matrix, reflow process –
additional thermal probe and plug note, and reflow
verification and de-bug.
Replaced template format
Updated copyright information
Changed reference of solder ball diameter to 28mil
Added Lead-Free information
Modified the solder paste aperture recommendations
for the 28mil solder ball
Added Pin A1 alignment and more reflow profile info.
Initial
J. Marvin
J. Proulx
J. Proulx
J. Proulx
Date
1/16/01
10/19/01
9/17/02
8/13/03
“D“
‘E’
‘F’
S0043
S0802
S1760
M.Lee
C Palmer
J. Proulx
02/07/06
02/26/08
6/09/11
Amphenol TCS
200 Innovative Way, Suite 201
Nashua, NH 03062
603.879.3000
www.amphenol-tcs.com
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