Available as “HR” (high reliability) screened per MIL-PRF-19500, JANTX level. Add “HR” suffix to base part number.
Available as non-RoHS
(Sn/Pb plating), standard, and as RoHS by adding “-PBF” suffix.
Available in surface mount by adding suffix
“UR”
Devices with guaranteed limits on all six parameters are indicated by suffix A for ±10% tolerance, suffix B for a ±5% tolerance, suffix C for a 2% tolerance and suffix D for a 1%
tolerance.
MAXIMUM RATINGS
Operating and Storage Temperature
DC Power Dissipation
Power Derating
Forward Voltage @ 200mA
-65°C to + 200°C
500 mW
3.33 mW/C° above 25°C
1.1 Volts
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C unless otherwise specified)
Test
Current
I
ZT
mA
Max Zener Impedance
A&B Suffix Only
(2)
Max Reverse Leakage Current
A, B, & D Suffix
Only
I
R
V
R
µA
@
Volts
A
1N5221B
1N5222B
1N5223B
1N5224B
1N5225B
1N5226B
1N5227B
1N5228B
1N5229B
1N5230B
1N5231B
1N5232B
1N5233B
1N5234B
1N5235B
1N5236B
1N5237B
1N5238B
1N5239B
1N5240B
1N5241B
1N5242B
1N5243B
1N5244B
1N5245B
1N5246B
1N5247B
1N5248B
1N5249B
1N5250B
1N5251B
1N5252B
1N5253B
1N5254B
1N5255B
1N5256B
1N5257B
1N5258B
1N5259B
1N5260B
2.4
2.5
2.7
2.8
3.0
3.3
3.6
3.9
4.3
4.7
5.1
5.6
6.0
6.2
6.8
7.5
8.2
8.7
9.1
10
11
12
13
14
15
16
17
18
19
20
22
24
25
27
28
30
33
36
39
43
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
9.5
9.0
8.5
7.8
7.4
7.0
6.6
6.2
5.6
5.2
5.0
4.6
4.5
4.2
3.8
3.4
3.2
3.0
30
30
30
30
29
28
24
23
22
19
17
11
7.0
7.0
5.0
6.0
8.0
8.0
10
17
22
30
13
15
16
17
19
21
23
25
29
33
35
41
44
49
58
70
80
93
1200
1250
1300
1400
1600
1600
1700
1900
2000
1900
1600
1600
1600
1000
750
500
500
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
600
700
700
800
900
100
100
75
75
50
25
15
10
5.0
5.0
5.0
5.0
5.0
5.0
3.0
3.0
3.0
3.0
3.0
3.0
2.0
1.0
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
0.95
1.9
1.9
2.9
3.3
3.8
4.8
5.7
6.2
6.2
6.7
7.6
8.0
8.7
9.4
9.5
10.5
11.4
12.4
13.3
13.3
14.3
16.2
17.1
18.1
20
20
22
24
26
29
31
B,C &D
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.0
3.0
3.5
4.0
5.0
6.0
6.5
6.5
7.0
8.0
8.4
9.1
9.9
10
11
12
13
14
14
15
17
18
19
21
21
23
25
27
30
33
Non Suffix
I
R
@ V
R
Used For
Suffix A
µA
200
200
150
150
100
100
100
75
50
50
50
50
50
50
30
30
30
30
30
30
30
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
Max Zener Voltage
Temp. Coeff.
(A&B Suffix Only)
α
VZ
(%/°C)
(3)
-0.085
-0.085
-0.080
-0.080
-0.075
-0.070
-0.065
-0.060
±0.055
±0.030
±0.030
+0.038
+0.038
+0.045
+0.050
+0.058
+0.062
+0.065
+0.068
+0.075
+0.076
+0.077
+0.079
+0.082
+0.082
+0.083
+0.084
+0.085
+0.086
+0.086
+0.087
+0.088
+0.089
+0.090
+0.091
+0.091
+0.092
+0.093
+0.094
+0.095
Part Number
(1)
Nominal
Zener Voltage
V
Z
@ I
ZT
Volts
Z
ZT
@ I
ZT
Ohms
Z
ZT
@ I
ZK
=0.25mA
Ohms
Rev. 20190114
1N5221B(UR)-1N5281B(UR)
SILICON ZENER DIODES
High-reliability discrete products
and engineering services since 1977
Part Number
(1)
Nominal
Zener Voltage
V
Z
@ I
ZT
Volts
Test
Current
I
ZT
mA
Max Zener Impedance
A&B Suffix Only
(2)
I
R
µA
Max Reverse Leakage Current
A, B, & D Suffix
Only
V
R
@
Volts
A
B,C&D
36
39
43
46
47
52
56
62
68
69
76
84
91
99
106
114
122
129
137
144
152
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
Non Suffix
I
R
@ V
R
Used For
Suffix A
µA
Max Zener Voltage
Temp. Coeff.
(A&B Suffix Only)
α
VZ
(%/°C)
(3)
Z
ZT
@ I
ZT
Ohms
105
125
150
170
185
230
270
330
370
400
500
750
900
1100
1300
150
170
190
2200
2400
2500
Z
ZT
@ I
ZK
=0.25mA
Ohms
1000
1100
1300
1400
1400
1600
1700
2000
2200
2300
2600
3000
4000
4500
4500
5000
5500
5500
6000
6500
7000
1N5261B
1N5262B
1N5263B
1N5264B
1N5265B
1N5266B
1N5267B
1N5268B
1N5269B
1N5270B
1N5271B
1N5272B
1N5273B
1N5274B
1N5275B
1N5276B
1N5277B
1N5278B
1N5279B
1N5280B
1N5281B
47
51
56
60
62
68
75
82
87
91
100
110
120
130
140
150
160
170
180
190
200
2.7
2.5
2.2
2.1
2.0
1.8
1.7
1.5
1.4
1.4
1.3
1.1
1.0
0.95
0.90
0.85
0.80
0.74
0.68
0.66
0.65
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
34
37
41
44
45
49
53
59
65
66
72
80
86
94
101
108
116
123
130
137
144
+0.095
+0.096
+0.096
+0.097
+0.097
+0.097
+0.098
+0.098
+0.099
+0.099
+0.110
+0.110
+0.110
+0.110
+0.110
+0.110
+0.110
+0.110
+0.110
+0.110
+0.110
NOTE 1: The electrical characteristics are measured after allowing the device to stabilize
for 20 seconds when mounted with a 3/8” minimum lead length from the case.
NOTE 2: The zener impedance is derived from the 60HZ ac voltage, which results when an ac current having an r.m.s. value equal to 10% of the DC zener current
(I
ZT
or I
ZK
) is superimposed on I
ZT
or I
ZK
. Zener impedance is measured at two points to insure a sharp knee on the breakdown curve, thereby eliminating unstable units.
NOTE 3: Temperature
coefficient (α
VZ
). Test conditions for temperature coefficient are a follows:
a.
I
ZT
= 7.5 mA, T
1
= 25°C,
T
2
= 125°C (1N5221A, thru 1N5242A, B.)
b.
I
ZT
= Rated I
ZT
, T
1
= 25°C,
T
2
= 125°C (1N5243A, B thru 1N5281A, B.)
Device to be temperature stabilized with current applied prior to reading breakdown voltage at the specified ambient temperature.
I bought a Z-TEK serial and parallel to USB cable. The serial cable has a driver disk, but the parallel cable does not. As a result, after connecting the two cables to the development board, H-JTAG ca...
.Does the virtual keyboard on wince simulate a keyboard? Because I can't hook any information using the keyboard hook. I don't know what's going on??...
List of instruments, equipment and main components for the 2020 TI Cup Provincial Undergraduate Electronic Design Competition01. Provincial competition components and equipment1. Camera2. 2D PTZ
3. Po...
[i=s] This post was last edited by em78447 on 2015-8-25 16:15 [/i] After the transplantation, the two subtasks run once, and then they are stuck in the idle task OS_TaskIdle. I would like to ask what ...
I am a graduate student majoring in electromechanical engineering. During my master's degree, I mainly worked on MSP430 hardware and software development, drawing circuit diagrams, adjusting boards, a...
With the rapid development of science and technology, especially the widespread application of digital technology and various ultra-large-scale integrated circuits, electronic equipment, especially...[Details]
Today, with the increasing integration of functions, mobile phones can also be used as portable media players (PMP), digital cameras, handheld computers (PDAs), and even global positioning systems ...[Details]
China's new energy vehicles are in a transition period from research and development to real industrial development. In 2012, with the intensive launch of new energy vehicle policy planning, the de...[Details]
introduction
Throughout the history of automotive lighting, power has always played an important role. Initially, cars only needed headlights to see the road in the dark. Later, other light so...[Details]
Power management solutions for today's portable application processors are becoming increasingly integrated. Total power consumption, standby and sleep current consumption affect battery size, bill...[Details]
LED lamps and bulbs are now rapidly replacing incandescent, halogen and CFL (compact fluorescent lamp) light sources in many general lighting applications. Flyback DC/DC converters are the power su...[Details]
I've been studying dot matrix recently. It looks simple, but it takes a while to master it completely! The 8*8 dot matrix hardware circuit I'm making now is like this. The row is driven by 74HC138 + t...[Details]
introduction
MAX6636 is a multi-channel precision temperature monitor that can not only monitor local temperature, but also connect up to 6 diodes externally. Each channel has a programmable...[Details]
LED lighting: Basic circuit design can be completed in as little as one day
Semiconductor manufacturers are also getting involved in the LED lighting business. The power circuit of LED req...[Details]
To understand how and why OLED power supply affects display image quality, you must first understand OLED display technology and power supply requirements. This article will explain the latest OLED...[Details]
introduction
Incandescent bulbs can emit a variety of light, but in specific applications, only green, red, and yellow light are usually needed - such as traffic lights. If an incand...[Details]
At present, how various communication technologies will evolve after 3G is a focus of great concern in the industry. Especially for TD-SCDMA, whether it can achieve smooth evolution to the next gen...[Details]
The ARINC429 bus is one of the most commonly used communication buses between various subsystems of avionics. As the "skeleton" of modern avionics systems, once the bus system or the attached airbo...[Details]
In order to prevent the lithium battery from being damaged by abnormal conditions such as overcharge, over discharge, and overcurrent, a lithium battery protection device is usually used to prevent...[Details]
In recent years, with the increasing maturity of LED technology, LED light sources have been increasingly widely used due to their advantages of using low-voltage power supply, low energy consumpti...[Details]