I need to implement RTC wake-up to enter LPM3.5 MCU, but I don't know how to write it. After exiting, will it reset and execute from the beginning of the main program? #include "driverlib.h" void main...
[i=s] This post was last edited by 583059823 on 2014-1-12 21:33 [/i] I have several boards in my mobile phone and I want to replace them with AVR32. If you are interested, add QQ99044007...
[i=s]This post was last edited by BinWin on 2021-7-4 19:59[/i]The H7 series of MCUs have peripherals dedicated to display and are equipped with 2D acceleration, namely Chrome-ART, which is a DMA chann...
As the title says! I want to use FPGA to implement a 51 single-chip microcomputer core to practice. If anyone knows about it, please send me a link or some information. I will be very grateful!
Email:...
Latest progress: There are currently 5 preferential places leftNUCLEO-L432KC is a small-size, high-performance development board based on STM32L432 from ST. It is only the size of a thumb.
The STM32L4...
Due to project requirements, the algorithm must be implemented on the multi-core DSP 6678 platform, and it is inevitable to come into contact with CCS. Previously, installing and uninstalling CCS on d...
A vacuum eutectic furnace is a critical piece of equipment used in the manufacturing and processing of various materials, particularly in the fields of microelectronics and nanotechnology. One of t...[Details]
introduction
Bluetooth technology is a short-range wireless communication technology designed to replace wired cables. It is a wireless communication technology standard developed by the SIG, ...[Details]
ISP devices, such as field programmable devices (FPGAs and CPLDs), do not require a programmer. Using programming kits provided by the device manufacturer, they employ a top-down modular design app...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
According to foreign media reports, Nissan Motor has recently reached a cooperation with US battery technology company LiCAP Technologies to jointly promote the research and development of next-gen...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Over the past decade, the narrative surrounding fuel vehicles has been one of decline and replacement. Under the onslaught of new energy vehicles, traditional automakers have been forced to acceler...[Details]
Tools/Materials
Yitong Chuanglian MODBUS to PROFIBUS Gateway YT-PB-03
Siemens s7-300
This article describes how to configure the YT-PB-03 MODBUS to PROFIBUS gat...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
1. Introduction
In 2015, Apple's new MacBook and Apple Watch both featured force-sensing technology, which Apple calls Force Touch. Each time a user presses the touchpad, the device not only p...[Details]
On August 20, Huawei Device announced that the all-new M7 is the first to feature an in-cabin laser vision solution. This solution offers enhanced active safety capabilities compared to primary vis...[Details]
For self-driving cars, LiDAR is the sensory organ that allows them to "see the road." Simply put, its operating principle involves sending out a laser beam, receiving the echo, and ultimately gener...[Details]
Renesas Electronics introduces a new USB-C power solution with an innovative three-level topology.
Improve performance while reducing system size
New solution combines excel...[Details]
Generally not, but there are exceptions. For example, a torque motor controller with three-phase output voltage imbalance can cause current imbalance, similar to a phase loss. However, only two pha...[Details]
Munich, Germany, August 19, 2025 –
Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, announced today that its AIROC™ CYW20829 Bluetooth® low e...[Details]