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108-9063
3.3.
Ratings
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3.4.
Current: 3 amperes maximum per contact, 2.25 amperes continuous per contact at room ambient,
with not more than 2 adjacent or opposing circuits carrying this current.
Operating Temperature: -65° to 125°C for gold contacts
Performance and Test Description
Connectors shall be designed to meet electrical, mechanical and environmental performance
requirements specified in Table 1.
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3.5.
Test Requirements and Procedures Summary
Table 1
Test Description
Requirement
Meets requirements of product drawing.
ELECTRICAL
Procedure
Visual, dimensional and functional
per applicable inspection plan.
Measure potential drop of mated
contacts assembled in housing
using 3 amperes maximum
Calculate resistance.
See Figure 1.
EIA 364-6B and IEC 60512-2-2.
Subject mated contacts assembled
in housing to 50 mv open circuit at
100 ma maximum.
See Figure 1.
EIA 364-23A and IEC 60512-2-1.
Tests between adjacent contacts of
unmated connector and contacts to
hardware.
EIA 364-20B and IEC 60512-4-1.
Test between adjacent contacts of
unmated connector and contacts to
hardware.
EIA 364-21C and IEC 60512-3-1.
Subject wired and mated
connectors to 15 G's 10-2000 Hz
with 100 ma current applied.
EIA 364-28D and IEC 60512-6-4.
Subject wired and mated connector
to 100 G's sawtooth shock pulses of
6 milliseconds duration. 3 mutually
perpendicular planes, total 18
shocks.
EIA 364-27B and IEC 60512-6-3.
Examination of product.
Termination resistance,
specified current.
.015 ohms maximum initial.
.020 ohms maximum final.
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Termination resistance, low
level.
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Dielectric withstanding
voltage.
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Insulation resistance.
Test Voltage Altitude
(rms)
Feet
900
Sea Level
200
70,000
2 milliamperes maximum leakage current.
5000 megohms minimum initial.
.015 ohms maximum initial.
.020 ohms maximum final.
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MECHANICAL
Vibration.
No discontinuities greater than 1
microsecond.
No physical damage.
No discontinuities greater than 1
microsecond.
No physical damage.
Termination resistance, low level.
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Physical shock.
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Test Description
Mating force.
Table 1
Requirement
Procedure
1.9 ounces maximum average per contact. Measure force necessary to mate
connector assembly after 3
unmonitored cycles.
Calculate force per contact.
EIA 364-13B and IEC 60512-13-1.
.4 ounces minimum average per contact.
Measure force necessary to unmate
connector assembly.
Calculate force per contact.
EIA 364-13B and IEC 60512-13-1.
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Unmating force.
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Contact retention.
Contacts shall not dislodge from its normal Apply axial load of 3 pounds to
locking position.
individual contacts.
TE Spec 109-30.
4 ounces maximum per contact.
Measure force to engage using
gage 2.
See Figure 2.
TE Spec 109-35.
Size 3 times using gage 2, insert
gage 1 and measure force to
separate.
See Figure 2.
TE Spec 109-35.
Mate and unmate pin and
receptacle connectors for 250
cycles.
EIA 364-9C and IEC 60512-9-1.
Subject terminal posts mounted on
printed circuit boards to solder bath
at 260° ±5EC for 10 ±2 seconds.
EIA 364-56A, IEC 60512-12-4 and
IEC 60512-12-5.
Fully insert pin into printed wiring
board hole.
Apply an axial load of 10 pounds for
10 seconds.
Contact engaging force.
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Contact separating force.
.1 ounce minimum.
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Durability.
No physical damage.
.020 ohms maximum termination
resistance, low level.
Contact separation force.
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Resistance to soldering heat. No physical damage.
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Insertion force, ACTION PIN. 40 pounds maximum per pin.
Retention force, ACTION
PIN.
Torque, ACTION PIN.
Pin shall not dislodge from printed wiring
board.
Pin shall not move or dislodge from printed Apply 2 inch ounces for 10 seconds
wiring board.
in both directions.
ENVIRONMENTAL
.020 ohms maximum termination
resistance, low level.
Subject mated connectors to 5
cycles between -65° and 125°C.
EIA 364-32C and IEC 60512-11-4.
Thermal shock.
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Humidity-temperature
cycling.
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1000 megohms final insulation resistance. Subject mated connectors to 10
humidity-temperature cycles
between 25° and 65°C at 95% RH.
EIA 364-31B, IEC 60512-11-3 and
IEC 60512-11-12.
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3.6.
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Test or Examination
Examination of product
Termination resistance, specified current
Termination resistance, low level
Dielectric withstanding voltage
Insulation resistance
Vibration
Physical shock
Mating force
Unmating force
Contact retention
Contact engaging force
Contact Separating force (d)
Durability
Resistance to soldering heat (c)
Insertion force, ACTION PIN
Retention force, ACTION PIN
Torque, ACTION PIN
Thermal shock
Humidity-temperature cycling
NOTE
(a)
(b)
(c)
(d)
8
13
9
2
3,10,19
8
2
2
4
3
2
3,12,18
13
14
4,11,17
7,12,18
4,10,16
7,11,17
5
6
12
3
4
Connector Tests and Sequences – Table 2
Table 2
Test Group (a)
1
1,20
6,16
5,9,15
2
1,19
6,15
5,9,14
7,10
8,11
3
1,13
4
1,7
6
Test Sequence (b)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
This test is not applicable to ACTION PIN connectors.
Sizing contacts three times is required only before the initial test.
4.
4.1.
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
Sample Selection
Connector housings and contacts shall be prepared in accordance with applicable Instruction
Sheets and shall be selected at random from current production. Test groups 1, 2 and 3 shall each
consist of 3 connectors of the greatest number of position of each type offered. Two additional
specimens shall be selected from least number of positions offered and tested with group 2. Test
group 4 shall consist of 20 contacts.
B.
Test Sequence
Qualification inspection shall be verified by testing samples as specified in Table 1.
C.
Acceptance
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1.
2.
All samples tested in accordance with this specification shall meet the stated tolerance limit.
Failures attributed to equipment, test setup, or operator deficiencies shall not disqualify the
product. When product failure occurs, corrective action shall be taken and samples
resubmitted for qualification.
4.2.
Quality Conformance Inspection
The applicable inspection plan will specify sampling acceptable quality level to be used. Dimensional
and functional requirements shall be in accordance with applicable product drawing and this
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