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Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
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In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
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Recently,
Xpeng Motors and Xinlian Integrated Circuit jointly announced the mass production of China's first hybrid silicon carbide product.
Designed and developed by Xpeng Motors and joint...[Details]
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According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
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Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
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The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
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Electric vehicles' 12V batteries don't rely on a generator to power them. Only gasoline-powered vehicles rely on the engine to drive a generator to generate electricity while driving, which is used...[Details]
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The complexity of the integrated circuits (ICs) used in electronic systems in vehicles is increasing. They aim to execute artificial intelligence (AI) algorithms to control autonomous driving funct...[Details]
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Learned the following information.
Customer product: industrial computer motherboard
Glue application area: CPU/BGA filling
Glue color requirements: black or t...[Details]
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Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
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The 2025 China International Automotive Testing Exhibition will be held at the Shanghai World Expo Exhibition and Convention Center from August 27 to 29, 2025.
Clacton Seafront, UK, ...[Details]
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A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
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On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
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Lightweighting of automobiles is still a relatively unfamiliar term for automobiles. With the continuous improvement of environmental protection requirements, relevant regulations have also put for...[Details]
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Speaking of the problem of vehicle spontaneous combustion, whether it is a pure electric vehicle or a fuel vehicle, there will be incidents of spontaneous combustion. For the same spontaneous combu...[Details]