0577-0-65-80-21-02-10-0 datasheet, PDF

0577-0-65-80-21-02-10-0: DescriptionPCB Terminal; CategoryThe connector terminals; File Size227KB，2 Pages; ManufacturerMill-Max; Websitehttps://www.mill-max.com

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0577-0-65-80-21-02-10-0 Overview

PCB Terminal

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Mill-Max
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Manufacturer's serial number	0577
terminal gender	FEMALE
Terminal and terminal strip types	PCB TERMINAL
Base Number Matches	1

MAXIMUM

solutions

Receptacles on Tape for Automated Assembly

Mill-Max offers receptacles (discrete sockets) on carrier tape per EIA-481 to feed automated ‘pick &

place’ assembly equipment. Our standard reel size has been 13”, but now for 8 & 12mm wide carrier tapes,

we also offer the new 7” ‘mini’ reel. A 7” reel holds about one quarter the parts of a 13” reel. This is more

economic and convenient for smaller volume customers who want the benefit of automated assembly.

• Two types of receptacles are available on carrier tape: surface mount, flat types, which sit on the

surface of the PCB where the pin or component lead plugs-in parallel to the PCB; and thru-hole types

where the lead plugs-in perpendicular to the PCB. Thru-hole receptacles are intrusive reflow soldered*.

Our increasingly popular thru-hole (tubular) receptacles have an Organic Fibre Plug® barrier which

prevents solder, paste or flux from contaminating the spring contact. After soldering, the OFP®

barrier is pushed out of the receptacle when the device is plugged in.

• Also new for Mill-Max is the availability of RoHS “lead free” plating options. Instead of traditional

tin/lead plating on the receptacle’s shell and contact, a pure matte tin with oxide and whisker inhibitors

can be specified.

*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional thru-hole components in a reflow soldering

process. The receptacles are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed

on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-

thru-holes and achieve solder joints as reliable as wave soldering. The OFP® barrier prevents solder paste from being picked-

up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume

of paste required to fill each hole.

(02/06-558)

Mill-Max Mfg. Corp. • 190 Pine Hollow Road, Oyster Bay, NY 11771-0300

516-922-6000 • Fax: 516-922-9253 • www.mill-max.com

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