† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150
_
C and a board trace length of 750 mils,
except for the N package, which has a trace length of zero.
recommended operating conditions
MIN
VCC
VIH
VIL
VI
VO
IOH
IOL
D
t /
D
v
TA
Supply voltage
High-level input voltage
Low-level input voltage
Input voltage
Output voltage
High-level output current
Low-level output current
Input transition rise or fall rate
Operating free-air temperature
0
–40
0
0
4.5
2
0.8
VCC
VCC
– 24
24
10
85
MAX
5.5
UNIT
V
V
V
V
V
mA
mA
ns/ V
°C
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
74ACT11032
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCAS008C – JULY 1987 – REVISED APRIL 1996
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
IOH = –50
m
A
50
VOH
IOH = –24 mA
24
IOH = –75 mA†
IOL = 50
m
A
VOL
IOL = 24 mA
IOL = 75 mA†
VI = VCC or GND
VI = VCC or GND,
IO = 0
One input at 3.4 V,
Other inputs at GND or VCC
VI = VCC or GND
TEST CONDITIONS
VCC
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
4.5 V
5.5 V
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5V
3.5
±0.1
4
0.9
0.1
0.1
0.36
0.36
TA = 25°C
MIN
TYP
MAX
4.4
5.4
3.94
4.94
MIN
4.4
5.4
3.8
4.8
3.85
0.1
0.1
0.44
0.44
1.65
±1
40
1
V
V
MAX
UNIT
II
ICC
m
A
m
A
mA
pF
D
ICC‡
Ci
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡ This is the increase in supply current for each input that is at one of the specified TTL voltage levels rather than 0 V or VCC.
switching characteristics over recommended ranges of supply voltage and free-air temperature
(unless otherwise noted) (see Figure 1)
PARAMETER
tPLH
tPHL
FROM
(INPUT)
A or B
TO
(OUTPUT)
Y
TA = 25°C
MIN
TYP
MAX
1.5
1.5
6.2
4.9
8.1
7.4
MIN
1.5
1.5
MAX
9
8
UNIT
ns
operating characteristics, V
CC
= 5 V, T
A
= 25°C
PARAMETER
Cpd
Power dissipation capacitance per gate
TEST CONDITIONS
CL = 50 pF,
f = 1 MHz
TYP
29
UNIT
pF
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
3
74ACT11032
QUADRUPLE 2-INPUT POSITIVE-OR GATES
SCAS008C – JULY 1987 – REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
500
Ω
Output
50% VCC
Input
(see Note B)
tPLH
3V
1.5 V
1.5 V
0V
tPHL
VOH
50% VCC
VOL
LOAD CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. Input pulses are supplied by generators having the following characteristics: PRR
≤
1 MHz, ZO = 50
Ω,
tr = 3 ns,
tf = 3 ns.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Feb-2020
PACKAGING INFORMATION
Orderable Device
74ACT11032D
74ACT11032DR
74ACT11032DRG4
74ACT11032N
74ACT11032NE4
Status
(1)
Package Type Package Pins Package
Drawing
Qty
SOIC
SOIC
SOIC
PDIP
PDIP
D
D
D
N
N
16
16
16
16
16
40
2500
2500
25
25
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
(4/5)
Samples
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
N / A for Pkg Type
ACT11032
ACT11032
ACT11032
74ACT11032N
74ACT11032N
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
RoHS:
TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt:
TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green:
TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(4)
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
In order to help developers reduce development costs, reduce size, and reduce design difficulty, the C6-integra DSP+ARM series of dual-core processors highly integrates a variety of peripherals and I/...
[font=宋体]【Ask if you don't understand】[/font][font=宋体]I have looked at two TPA series digital power amplifier chips, TPA3221 (Figures 3 and 4) and TPA3255 (Figures 1 and 2)[/font] [font=宋体]The manuals...
i am writing a AGDI Driver for the uVision Debugger base on apntex_173.
my chip is using Cortex-M0, many functions (r/w registers, r/w memory, start/stop debug session, run, run to cursor line, step o...
[i=s]This post was last edited by paulhyde on 2014-9-15 03:23[/i] How much have you written for topic E? No matter how much you have written, please share it!!...
I was in the hospital the past few days. I have some free time today, so I quickly took it out and posted it. The original exchange post is here: [url=https://bbs.eeworld.com.cn/thread-377849-1-1.html...
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
Today's security industry has entered the era of massive networking. Many enterprises, especially financial institutions, have established multi-level video surveillance networking platforms. Lever...[Details]
Logic analyzers are widely used tools in digital design verification and debugging. They can verify the proper functioning of digital circuits and help users identify and troubleshoot faults. They ...[Details]
Robotics
has become
LiDAR
's "second growth curve."
While LiDAR was still battling with its "pure vision" rivals in the automotive field, another field ignited the demand f...[Details]
Common Mode Semiconductor has officially released its latest generation of power management ICs—the GM6506 series. This fully integrated high-frequency synchronous rectification step-down p...[Details]
The automotive industry in 2025 is undergoing a thorough intelligent reshuffle.
Geely wants to make changes in the field of AI cockpits: in the future, there will be no traditional smart...[Details]
The all-new MG4 was recently officially announced on the Ministry of Industry and Information Technology's (MIIT) new vehicle announcement. The all-new MG4's semi-solid-state battery version addres...[Details]
Have you ever heard stories about "crazy appliances"? Think of microwaves that turn on automatically or ovens that preheat without any human input? With radios and electromagnetic interfaces ubiqui...[Details]
With the rapid development of electric vehicles in my country, people are beginning to pay attention to the issue of radiation from electric vehicles. We all know that mobile phones emit radiation,...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
pile
, which is now available for general sale. This charging pile feat...[Details]
introduction
In today's busy society, people experience chronic high stress, which in turn poses a significant threat to our health. Therefore, effectively relieving stress has become a pr...[Details]
Today, the voltage of electronic products continues to rise to 400V, 600V and even 1000V, so there are few electronic load models that can handle such high voltages. Many people consider connecting...[Details]
With rapid economic development, the types of pollution sources are increasing, especially in chemical and industrial zones and their surroundings. The patterns of pollution and the types of ecolog...[Details]
EVTank predicts that all-solid-state batteries will achieve small-scale mass production in 2027 and large-scale shipments by 2030. Global solid-state battery shipments will reach 614.1GWh, of which...[Details]
DSP and ARM Processors
京公网安备 11010802033920号
EEWORLD
