BD9354MWV datasheet, PDF - EEWORLD Datasheet

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BD9354MWV: DescriptionSwitching Regulator, 5 X 5 MM, 0.4 MM PITCH, UQFN-36; CategoryPower/power management The power supply circuit; File Size184KB，5 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/

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BD9354MWV Overview

Switching Regulator, 5 X 5 MM, 0.4 MM PITCH, UQFN-36

BD9354MWV Parametric

Parameter Name	Attribute value
Maker	ROHM Semiconductor
Parts packaging code	QFN
package instruction	5 X 5 MM, 0.4 MM PITCH, UQFN-36
Contacts	36
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Analog Integrated Circuits - Other Types	SWITCHING REGULATOR
JESD-30 code	S-XQCC-N36
Number of terminals	36
Package body material	UNSPECIFIED
Package shape	SQUARE
Package form	CHIP CARRIER
Certification status	Not Qualified
surface mount	YES
Terminal form	NO LEAD
Terminal location	QUAD
Base Number Matches	1

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STRUCTURE

PRODUCT SERIES

TYPE

PIN ASSIGNMENT

BLOCK DIAGRAM

PACKAGE

Functions

●

Silicon Monolithic Integrated Circuit

7-Channel Switching Regulator Controller for Digital Camera

ＢＤ９３５４ＭＷＶ

Fig.1

Fig.2

Power supply voltage 2.2½5.5V(at start-up), 2.05½5.5V(after start-up)

CH1step-down converter, CH2cross converter, CH3 step-down converter, CH4 step- down converter

CH5 inverting converter for CCD, CH6 boost converter for CCD, CH7 boost converter for LED

All Internal Power MOSFETs

Built-In MOSFETs for synchronous rectifying action mode on CH1½4

Built-In feedback resistors on CH2

All channels contain internal compensation between inputs outputs of error amps

Contains sequence control circuit for CH1½4

Operating frequency 1.5MHz(CH1,3,4)½750KHz（CH2,5,6,7）

Built-In Short-circuit Protection (SCP)

CH6 have high side switches with soft start function

Built-In Over voltage Protection (OVP)

Thermally enhanced UQFN036V5050 package（5mm×5mm, 0.4mm pitch）

○Absolute maximum ratings（Ta＝25℃）

Parameter

Symbol

VCC,Hx13,Hx2,

Hx4,Hx567,VO2,HS6L

STB1234,56

PWM7

Hx5 - Lx5

Lx6

Lx7,VO7

IomaxLx1

IomaxHx2

IomaxHx3

IomaxHx4,Lx4

IomaxHx5

IomaxHS6L

IomaxLx6½7

Topr

Tstg

Tjmax

Limit

－0.3½7

-0.3½15

－0.3½20

-0.3½21

±0.8

±1.5

±0.8

±1.0

±1.5

±1.2

0.88 *1

－25½+85

－55½+150

+150

Unit

℃

P o w e r

I n p u t

V o l t a g e

O u t p u t

c u r r e n t

o w e r

D i s s i p a t i o

p e r a t i n g T e m p e r a t u r

t o r a g e

T e m p e r a t u r

u n c t i o n T e m p e r a t u r

*1 Should be derated by 7.04mW/℃ at Ta=25℃ or more. When mounted on a glass epoxy PCB of 74.2mm×74.2 mm×1.6 mm

○Recommended operating conditions

Parameter

Power Supply Voltage (at start-up)

Power Supply Voltage (after start-up)

VREF Pin Connecting Catacitor

VREGA Pin Connecting Capacitor

PWM7 freqency

【Oscillator】

Oscillator (CH1,3,4)

OSC Timing Resistor

Symbol

VCC1

VCC2

CVREF

CVREGA

fpwm

fosc

MIN

2.2

2.05

0.047

0.47

0.8

Limit

TYP

0.1

1.0

1.5

MAX

5.5

0.47

4.7

100

1.8

120

Unit

μF

kHz

MHz

kΩ

REV. A

4/4

○Operation

Notes

１.)

Absolute maximum ratings

This product is produced with strict quality control. However, the IC may be destroyed if operated beyond its absolute

maximum ratings. If the device is destroyed by exceeding the recommended maximum ratings, the failure mode will be difficult

to determine. (E.g. short mode, open mode) Therefore, physical protection counter-measures (like fuse) should be implemented

when operating conditions beyond the absolute maximum ratings anticipated.

２.)

GND potential

Make sure GND is connected at lowest potential. All pins except NON5, must not have voltage below GND. Also, NON5 pin must

not have voltage below - 0.3V on start up.

３.)

Setting of heat

Make sure that power dissipation does not exceed maximum ratings.

４.)

Pin short and mistake fitting

Avoid placing the IC near hot part of the PCB. This may cause damage to IC. Also make sure that the output-to-output and output

to GND condition will not happen because this may damage the IC.

５.)

Actions in strong magnetic field

Exposing the IC within a strong magnetic field area may cause malfunction.

６.)

Mutual impedance

Use short and wide wiring tracks for the main supply and ground to keep the mutual impedance as small as possible. Use inductor

and capacitor network to keep the ripple voltage minimum.

７.)

Thermal shutdown circuit (TSD circuit)

The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only

to shut the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not

continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is assumed.

８.)

Rush current at the time of power supply injection.

An IC which has plural power supplies, or CMOS IC could have momentary rush current at the time of power supply injection.

Please take care about power supply coupling capacity and width of power Supply and GND pattern wiring.

９.)

IC Terminal Input

This IC is a monolithic IC that has a P- board and P+ isolation for the purpose of keeping distance between elements. A P-N junction

is formed between the P-layer and the N-layer of each element, and various types of parasitic elements are then formed.

For example, an application where a resistor and a transistor are connected to a terminal (shown in Fig.15):

○When

GND > (terminal A) at the resistor and GND > (terminal B) at the transistor (NPN), the P-N junction operates as

a parasitic diode.

○When

GND > (terminal B) at the transistor (NPN), a parasitic NPN transistor operates as a result of the NHayers of other

elements in the proximity of the aforementioned parasitic diode.

Parasitic elements are structurally inevitable in the IC due to electric potential relationships. The operation of parasitic elements

Induces the interference of circuit operations, causing malfunctions and possibly the destruction of the IC. Please be careful not to

use the IC in a way that would cause parasitic elements to operate. For example, by applying a voltage that is lower than the

GND (P-board) to the input terminal.

Resistor

（Terminal

A）

Transistor (NPN)

（Terminal

B）

GND

（TerminalＡ）

Parasitic element

GND

＋

Parasitic

element

Ｎ

＋

P-board

＋

P-board

Parasitic

GND

Fig - 3 Simplified structure of a Bipolar IC

REV. A

Notice

Notes

No copying or reproduction of this document, in part or in whole, is permitted without the

consent of ROHM Co.,Ltd.

The content specified herein is subject to change for improvement without notice.

The content specified herein is for the purpose of introducing ROHM's products (hereinafter

"Products"). If you wish to use any such Product, please be sure to refer to the specifications,

which can be obtained from ROHM upon request.

Examples of application circuits, circuit constants and any other information contained herein

illustrate the standard usage and operations of the Products. The peripheral conditions must

be taken into account when designing circuits for mass production.

Great care was taken in ensuring the accuracy of the information specified in this document.

However, should you incur any damage arising from any inaccuracy or misprint of such

information, ROHM shall bear no responsibility for such damage.

The technical information specified herein is intended only to show the typical functions of and

examples of application circuits for the Products. ROHM does not grant you, explicitly or

implicitly, any license to use or exercise intellectual property or other rights held by ROHM and

other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the

use of such technical information.

The Products specified in this document are intended to be used with general-use electronic

equipment or devices (such as audio visual equipment, office-automation equipment, commu-

nication devices, electronic appliances and amusement devices).

The Products specified in this document are not designed to be radiation tolerant.

While ROHM always makes efforts to enhance the quality and reliability of its Products, a

Product may fail or malfunction for a variety of reasons.

Please be sure to implement in your equipment using the Products safety measures to guard

against the possibility of physical injury, fire or any other damage caused in the event of the

failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM

shall bear no responsibility whatsoever for your use of any Product outside of the prescribed

scope or not in accordance with the instruction manual.

The Products are not designed or manufactured to be used with any equipment, device or

system which requires an extremely high level of reliability the failure or malfunction of which

may result in a direct threat to human life or create a risk of human injury (such as a medical

instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-

controller or other safety device). ROHM shall bear no responsibility in any way for use of any

of the Products for the above special purposes. If a Product is intended to be used for any

such special purpose, please contact a ROHM sales representative before purchasing.

If you intend to export or ship overseas any Product or technology specified herein that may

be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to

obtain a license or permit under the Law.

Thank you for your accessing to ROHM product informations.

More detail product informations and catalogs are available, please contact us.

ROHM Customer Support System

http://www.rohm.com/contact/

www.rohm.com

R1120A

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