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BUF634
SBOS030B – SEPTEMBER 2000 – REVISED MARCH 2019
BUF634 250-mA High-Speed Buffer
A newer version of this device is now available: BUF634A
1 Features
1
3 Description
The BUF634 is a high speed, unity-gain open-loop
buffer recommended for a wide range of applications.
The BUF634 can be used inside the feedback loop of
op amps to increase output current, eliminate thermal
feedback, and improve capacitive load drive.
For low power applications, the BUF634 operates on
1.5-mA quiescent current with 250-mA output,
2000-V/µs slew rate, and 30-MHz bandwidth.
Bandwidth can be adjusted from 30 MHz to 180 MHz
by connecting a resistor between V– and the BW Pin.
Output circuitry is fully protected by internal current
limit and thermal shut-down, making the device
rugged and easy to use.
The BUF634 is available in a variety of packages to
suit mechanical and power dissipation requirements.
Types include 8-pin PDIP, SOIC-8 surface-mount, 5-
lead TO-220, and a 5-lead DDPAK-TO-263 surface-
mount plastic power package.
The upgraded device,
BUF634A
offers a wider
bandwidth (210 MHz) and a higher slew rate
(3750 V/µs) at 40% lower quiescent current. See the
Device Comparison Table
for a selection of unity-
gain, open-loop buffers from Texas Instruments.
Device Information
(1)
PART
NUMBER
PACKAGE
SOIC (8)
BUF634
PDIP (8)
TO-220 (5)
DDPAK/TO-263 (5)
BODY SIZE (NOM)
3.91 mm × 4.90 mm
6.35 mm × 9.81 mm
8.51 mm × 10.16 mm
8.42 mm × 10.16 mm
•
•
•
•
•
•
•
•
•
A newer version of this device is now available:
BUF634A
High output current: 250 mA
Slew rate: 2000 V/µs
Pin-selected bandwidth: 30 MHz to 180 MHz
Low quiescent current: 1.5 mA (30 MHz BW)
Wide supply range: ±2.25 to ±18 V
Internal current limit
Thermal shutdown protection
8-pin PDIP, SOIC-8, 5-lead TO-220, 5-lead
DDPAK-TO-263 surface-mount
2 Applications
•
•
•
•
•
•
•
•
•
Valve driver
Solenoid driver
Op amp current booster
Line driver
Headphone driver
Video driver
Motor driver
Test equipment
ATE pin driver
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Boost the Output Current of any Operational Amplifier
OPA2810
1 2
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
A newer version of this device is now available: BUF634A
BUF634
SBOS030B – SEPTEMBER 2000 – REVISED MARCH 2019
www.ti.com
Table of Contents
1
2
3
4
5
6
7
Features
..................................................................
Applications
...........................................................
Description
.............................................................
Revision History.....................................................
Device Comparison Table.....................................
Pin Configuration and Functions
.........................
Specifications.........................................................
7.1
7.2
7.3
7.4
7.5
7.6
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Typical Characteristics ..............................................
1
1
1
2
3
3
4
4
4
4
4
5
7
8.4 Device Functional Modes........................................
11
9
Application and Implementation
........................
12
9.1 Application Information............................................
12
9.2 Typical Application .................................................
14
10 Power Supply Recommendations
.....................
15
11 Layout...................................................................
15
11.1 Layout Guidelines .................................................
15
11.2 Layout Example ....................................................
17
12 Device and Documentation Support
.................
18
12.1
12.2
12.3
12.4
12.5
12.6
12.7
Device Support ....................................................
Documentation Support .......................................
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
18
18
18
18
19
19
19
8
Detailed Description
............................................
10
8.1 Overview .................................................................
10
8.2 Functional Block Diagram .......................................
10
8.3 Feature Description.................................................
11
13 Mechanical, Packaging, and Orderable
Information
...........................................................
19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (November 2015) to Revision B
•
•
•
Page
Added discussion of BUF634A upgrade device to
Features
and
Description
sections .........................................................
1
Changed amplifier to OPA2810 and deleted table from
Boost the Output Current of any Operational Amplifier
figure........
1
Added
Device Comparison Table
..........................................................................................................................................
3
Changes from Original (September 2000) to Revision A
•
Page
Added
ESD Ratings
table,
Feature Description
section,
Device Functional Modes, Application and Implementation
section,
Power Supply Recommendations
section,
Layout
section,
Device and Documentation Support
section, and
Mechanical, Packaging, and Orderable Information
section. ................................................................................................
1
2
Submit Documentation Feedback
Product Folder Links:
BUF634
Copyright © 2000–2019, Texas Instruments Incorporated
A newer version of this device is now available: BUF634A
BUF634
www.ti.com
SBOS030B – SEPTEMBER 2000 – REVISED MARCH 2019
5 Device Comparison Table
DEVICE
BUF634A
BUF634
LMH6321
V
S±
(V)
±18
±18
±18
I
Q
/CHANNEL
(mA)
1.5 – 8.5
1.5 – 15
11
BW (MHz)
35 – 210
30 – 180
110
SLEW RATE
(V/µs)
3750
2000
1800
VOLTAGE NOISE
(nV/√Hz)
3.4
4
2.8
AMPLIFIER DESCRIPTION
Unity-gain, open-loop buffer
Unity-gain, open-loop buffer
Unity-gain, open-loop buffer with
adjustable current limit
6 Pin Configuration and Functions
P and D Packages
8-Pin PDIP and SOIC
Top View
BW
NC
V
IN
V–
1
2
3
4
G=1
8
7
6
5
NC
V+
V
O
NC
1 2 3 4 5
G=1
KC Package
5-Pin TO-220
Top View
BW V–
V+
V
IN
V
O
KTT Package
5-Pin DDPAK/TO-263
Top View
G=1
1 2 3 4 5
BW V–
V+
V
IN
V
O
Pin Functions
PIN
NAME
BW
NC
V+
V
IN
V
O
V–
NO.
8 PINS
1
2, 5, 8
7
3
6
4
5 PINS
1
—
5
2
4
3
I
–
I
I
O
I
Bandwidth adjust pin
No internal connection
Positive power supply
Input
Output
Negative power supply
I/O
DESCRIPTION
Copyright © 2000–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links:
BUF634
3
A newer version of this device is now available: BUF634A
BUF634
SBOS030B – SEPTEMBER 2000 – REVISED MARCH 2019
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Input voltage
Output short-circuit (to ground)
Operating temperature
Junction temperature
Lead temperature (soldering, 10 s)
Storage temperature, T
stg
(1)
–55
–40
(1)
MIN
MAX
±18
±V
S
Continuous
125
150
300
125
UNIT
V
°C
°C
°C
°C
Stresses beyond those listed under
Absolute Maximum Ratings
may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended
Operating Conditions.
Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
BUF634F in PDIP and SOIC Packages
V
(ESD)
V
(ESD)
V
(ESD)
(1)
(2)
Electrostatic discharge
Electrostatic discharge,
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2500
±1000
±2500
V
V
V
BUF634F in SOIC-8 Package Only
BUF634F in TO-220 and DDPAK Packages
UNIT
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
Vs = (V+) - (V-)
T
A
Supply voltage
Operating temperature
±2.25
(4.5)
-40
NOM
±15
(30)
+25
MAX
±18
(36)
+85
UNIT
V
°C
7.4 Thermal Information
BUF634
THERMAL METRIC
R
θJA
R
θJB
ψ
JT
ψ
JB
(1)
PDIP
8 PINS
46.5
34.8
23.8
12
23.6
n/a
SOIC
8 PINS
103.4
44.2
44.5
5.4
43.8
n/a
TO-220
5 PINS
32.1
25.6
18.3
8.5
17.7
0.7
DDPAK-TO-263
5 PINS
41.8
45
24.8
13.1
23.8
2.4
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-ambient thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
R
θJC(top)
Junction-to-case (top) thermal resistance
R
θJC(bot)
Junction-to-case (bottom) thermal resistance
(1)
For more information about traditional and new thermal metrics, see the
Semiconductor and IC Package Thermal Metrics
application
report.
4
Submit Documentation Feedback
Product Folder Links:
BUF634
Copyright © 2000–2019, Texas Instruments Incorporated
A newer version of this device is now available: BUF634A
BUF634
www.ti.com
SBOS030B – SEPTEMBER 2000 – REVISED MARCH 2019
7.5 Electrical Characteristics
at T
A
= +25°C
(1)
, V
S
= ±15 V, specifications are for both low quiescent-current mode and wide-bandwidth mode (unless
otherwise noted)
PARAMETER
INPUT
Offset Voltage
Offset Voltage vs Temperature
Offset Voltage vs Power Supply
Specified Temperature Range
V
S
= ±2.25 V
(2)
TEST CONDITIONS
MIN
TYP
MAX
UNIT
±30
±100
0.1
Low Quiescent
Current Mode
Wide Bandwidth
Mode
Low Quiescent
Current Mode
Wide Bandwidth
Mode
±0.5
±5
80 || 8
±100
mV
µV/°C
to ±18 V
1
±2
mV/V
Input Bias Current
V
IN
= 0V
µA
±20
Input Impedance
R
L
= 100
Ω
MΩ || pF
8 || 8
4
nV/√Hz
Noise Voltage
GAIN
f = 10 kHz
R
L
= 1 kΩ, V
O
= ±10 V
Gain
R
L
= 100
Ω,
V
O
= ±10 V
R
L
= 67
Ω,
V
O
= ±10 V
OUTPUT
Current Output, Continuous
Positive
Negative
Voltage Output
Positive
Negative
Positive
Negative
Short-Circuit Current
DYNAMIC RESPONSE
Low Quiescent
Current Mode
Wide Bandwidth
Mode
Low Quiescent
Current Mode
Low Quiescent
Current Mode
I
O
= 10 mA
I
O
= –10 mA
I
O
= 100 mA
I
O
= –100 mA
I
O
= 150 mA
I
O
= –150 mA
Low Quiescent Current Mode
Wide Bandwidth Mode
0.95
0.85
0.8
0.99
0.93
0.9
V/V
±250
(V+) –2.1
(V–) +2.1
(V+) –3
(V–) +4
(V+) –4
(V–) +5
(V+) –1.7
(V–) +1.8
(V+) –2.4
(V–) +3.5
(V+) –2.8
(V–) +4
±350
±400
±550
±550
mA
V
mA
30
180
MHz
20
160
2000
200
50
4%
0.4%
2.5
°
0.1
V/µs
ns
R
L
= 1 kΩ
Bandwidth, –3dB
R
L
= 100
Ω
Slew Rate
Settling Time
0.1%
1%
20 Vp-p, R
L
= 100
Ω
20-V Step, R
L
= 100
Ω
Low Quiescent
3.58 MHz, V
O
= 0.7 V, Current Mode
R
L
= 150
Ω
Wide Bandwidth
Mode
Low Quiescent
3.58 MHz, V
O
= 0.7 V, Current Mode
R
L
= 150
Ω
Wide Bandwidth
Mode
Differential Gain
Differential Phase
(1)
(2)
Tests are performed on high speed automatic test equipment, at approximately 25°C junction temperature. The power dissipation of this
product will cause some parameters to shift when warmed up. SeeTypical
Characteristics
for over-temperature performance.
Limited output swing available at low supply voltage. See Output voltage specifications.
Copyright © 2000–2019, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links:
BUF634
5
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