EEWORLDEEWORLDEEWORLD

Part Number

Search

3314-2203RB

Description
14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, ROHS COMPLIANT
CategoryThe connector    The connector   
File Size1MB,8 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Environmental Compliance
Download Datasheet Parametric View All

3314-2203RB Overview

14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, ROHS COMPLIANT

3314-2203RB Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Other features3M, LOW PROFILE, LATCHED, SHROUDED, POLARIZATION
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD (30) OVER NICKEL (100)
Contact completed and terminatedMATTE TIN (200) OVER NICKEL (100)
Contact point genderMALE
Contact materialCOPPER ALLOY
DIN complianceNO
Filter functionNO
IEC complianceNO
JESD-609 codee3
MIL complianceNO
Manufacturer's serial number3000
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded2
OptionsGENERAL PURPOSE
Terminal pitch2.54 mm
Termination typeSOLDER
Total number of contacts14
UL Flammability Code94V-0
Base Number Matches1
3M
Three-Wall Header
.100” × .100” Latch/Ejector, Straight and Right Angle
3000 Series
Military (with 3M’s 3518 or N3518 polarizing key)
and center bump polarization
Low profile
Optional ejector latches
Mounting holes for securing header to board
Three wall shroud provides design flexibility
Solder tail and wrap tail options
Optional polarizing posts available
Optional high temperature insulator suitable for “no
lead” soldering operations
High temperature option is suitable for reflow
soldering using “paste in hole” techniques
See Regulatory Information Appendix for chemical
compliance information
Date Modified: May 1, 2008
TS-0771-C
Sheet 1 of 5
Physical
Insulator:
Material: Glass Filled Polyester (PBT)
Glass Filled Polyester (PCT) - High Temp Option
Flammability: UL 94V-0
Color: Gray (PBT), Beige (PCT), Black (PCT)
Contact:
Material: Copper Alloy
Plating:
Underplating: 100 μ” [ 2.54 μm ] Nickel - Overall
Wiping Area: 30 μ” [ 0.76 μm ] Gold
Solder Tails: 200 μ” [ 5.08 μm ] Tin Lead or Matte Tin (See Ordering Information)
Marking:
3M Logo, Part Identification Number and Orientation Triangle
Electrical
Current Rating:
2 A (EIA 364-70)
Insulation Resistance:
>1 × 10
9
Ω
at 500 V
DC
Withstanding Voltage:
1000 V
RMS
at Sea Level
Environmental
Temperature Rating:
-55°C to +105°C
Process Rating:
260°C (High Temp. PCT insulator) single pass (per J-STD-020C)
Moisture Sensitivity Level:
1 (per J-STD-020C) High Temp. (PCT) versions only
UL File No.: E68080
3
Electronic Solutions Division
Interconnect Solutions
http://www.3M.com/interconnects/
3M is a trademark of 3M Company.
For technical, sales or ordering information call
800-225-5373
PBT gray insulator, maximum insulator temperature 191°C (solder
wave process only)
Altera SoC in-depth experience: the first batch of development boards has arrived, with pictures and facts
[font=微软雅黑][size=3]In-depth experience of Altera SoC: The first batch of development boards has arrived, with pictures and truth, are you excited? [/size][/font] [font=微软雅黑][size=3] [b][url=https://ww...
EEWORLD社区 FPGA/CPLD
[GD32L233C-START Evaluation] Development Environment Construction
[i=s]This post was last edited by paty on 2022-4-14 17:23[/i]There are two main development environments, Keil and IAR . Here we take Keil as an example.Step 1: Open Keil official website, URL: www.ke...
paty GD32 MCU
DS1302 data reading problem
The following is the sub-code of the read clock or RAM of DS1302. scl is clock. sda is data (I/0). en is the RST signal. [/align][align=left][font=Times New Roman][color=#000000]uchar read(uchar a2) /...
gy_eleven 51mcu
I hope it will be useful to you all
MSP430 development application examples...
金字塔7号 Microcontroller MCU
LSM6DS3 sensor problem, help!
Dear experts, please help me! I recently helped a customer purchase a batch of LSM6DS3TR chips (made in Thailand). After the customer installed them on the board, they found that the S3 chip failed to...
keith123 MEMS sensors
IC Design Process
IC design process (from USTC) 2. Implementation method; IC can be divided into two types from the production purpose: general-purpose IC (such as CPU, DRAM, interface chip, etc.) and ASIC (Application...
gjgd FPGA/CPLD

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 271  1472  2585  2174  595  6  30  53  44  12 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号