5962-3829407MXX datasheet, PDF

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5962-3829407MXX: DescriptionStandard SRAM, 8KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28; Categorystorage storage; File Size368KB，68 Pages; ManufacturerEDI [Electronic devices inc.]

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5962-3829407MXX Overview

Standard SRAM, 8KX8, 70ns, CMOS, CDIP28, CERAMIC, DIP-28

5962-3829407MXX Parametric

Parameter Name	Attribute value
package instruction	CERAMIC, DIP-28
Reach Compliance Code	unknown
Maximum access time	70 ns
JESD-30 code	R-GDIP-T28
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	8
Number of functions	1
Number of terminals	28
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	8KX8
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL
Base Number Matches	1

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REVISIONS

LTR

DESCRIPTION

Added changes in accordance with NOR 5962-R085-93

Added device types 45, 46, and 47. Removed CAGE code 34168 for

case outline 8, and added cage code 34168 for case outline 9.

Editorial changes throughout.

Added device types 48-68. ICC1 changes for device types 18, 19,

46, and 47. Updated boilerplate. glg

Updated boilerplate paragraphs as part of a 5 year review. ksr

DATE (YR-MO-DA)

93-03-16

95-11-14

APPROVED

M. A. Frye

98-02-20

05-05-18

Raymond Monnin

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Kenneth Rice

CHECKED BY

Charles Reusing

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

http://www.dscc.dla.mil

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY All

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

90-10-29

MICROCIRCUIT, MEMORY,

DIGITAL, CMOS, 8K x 8 STATIC

RANDOM ACCESS MEMORY

(SRAM), MONOLITHIC SILICON

SIZE

CAGE CODE

REVISION LEVEL

AMSC N/A

SHEET

67268

1 OF

5962-38294

DSCC FORM 2233

APR 97

5962-E335-05

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://assist.daps.dla.mil/quicksearch/

http://assist.daps.dla.mil

or from

the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.

Unless otherwise specified, the issues of the documents are the issues of the documents cited in the solicitation.

AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)

ASTM Standard F1192-95

Standard Guide for the Measurement of Single Event Phenomena from

Heavy Ion Irradiation of Semiconductor Devices.

(Applications for copies of ASTM publications should be addressed to:

ASTM International, PO Box C700, 100 Barr

Harbor Drive, West Conshohocken, PA 19428-2959;

http://www.astm.org.)

ELECTRONICS INDUSTRIES ASSOCIATION (EIA)

JEDEC Standard EIA/JESD78

IC Latch-Up Test.

(Applications for copies should be addressed to the Electronics Industries Association, 2500 Wilson Boulevard, Arlington, VA

22201;

http://www.jedec.org.)

(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the

documents. These documents also may be available in or through libraries or other informational services.)

2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.

STANDARD

MICROCIRCUIT DRAWING

DEFENSE SUPPLY CENTER COLUMBUS

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-38294

SHEET

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