REVISIONS
LTR
A
DESCRIPTION
Add case outline Z. Correct the maximum iccsba value in table I. Update
boilerplate in according with MIL-PRF-38535 requirement. - phn
DATE (YR-MO-DA)
13-02-11
APPROVED
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
A
15
A
16
A
17
REV
SHEET
PREPARED BY
Phu H. Nguyen
A
1
A
2
A
3
A
4
A
5
A
6
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7
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8
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9
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10
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14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Phu H. Nguyen
APPROVED BY
10-01-12
DRAWING APPROVAL DATE
Thomas M. Hess
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, ASIC, CMOS GATE
ARRAY BASED ON SPACEWIRE REMOTE
TERMINAL CONTROLLER, MONOLITHIC
SILICON
SIZE
A
CAGE CODE
AMSC N/A
REVISION LEVEL
67268
1 OF
17
5962-10A03
A
DSCC FORM 2233
APR 97
SHEET
5962-E266-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
-
10A03
01
Q
X
B
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
AT7913E
Circuit function
SpaceWire Remote Terminal Controller
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
Terminals
349
349
352
Package style
Column Grid Array and interposer SCI
Column Grid Array
Quad flatpack with non conductive tie bar
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-10A03
SHEET
A
2
1.3 Absolute maximum ratings. 1/ 2/
Supply voltage range for core (V
CC1
) ....................................................
Supply voltage range for I/O’s (V
CC2
) ....................................................
Power dissipation (Pd) ..........................................................................
Storage temperature range...................................................................
Maximum junction temperature (T
J
) ......................................................
Thermal resistance junction to case (Rjc):
Case X ...........................................................................................
Case Y ...........................................................................................
Case Z ..........................................................................................
Operating free-air temperature range (T
A
) ............................................
1.4 Recommended operating conditions.
Supply voltage range for core (V
CC1
) ....................................................
Supply voltage range for I/O’s (V
CC2
) ....................................................
Ambient operating temperature (T
A
) ....................................................
Storage temperature .............................................................................
1.5 Radiation features.
Maximum total dose available (dose rate = 0.1 rads(Si)/s) ..................................... 100 krads(Si)
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
1.65 V to 1.95 V dc
3.0 V to 3.6 V dc
-55°C to 125°C
30°C, 20 to 65% RH, dust free, original packing
-0.3 V to 2.0 V dc
-0.3V to 4.0 V dc
2W
-65°C to 150°C
175°C
2°C/W
1 °C/W
2°C/W
-55°C to +125°C
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil
or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
________
1/
2/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
All voltage referenced to ground unless otherwise specified
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-10A03
SHEET
A
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block or logic diagram(s). The block or logic diagram(s) shall be as specified on figure 3.
3.2.4 Timing waveforms. The timing waveforms shall be as specified on figure 4.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of compliance
submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the
manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall
be provided with each lot of microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-10A03
SHEET
A
4
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
C
≤
+125°C
1.65 V
≤
V
CC1
≤
1.95 V
3.0 V
≤
V
CC2
≤
3.6 V
unless otherwise specified
CMOS
CMOS
V
IN
= GND, V
CC2
= 3.3 V
V
IN
= GND, V
CC2
= 3.3 V
V
IN
= GND, V
CC2
= 3.3 V
V
IN
= V
CC2
= 3.3 V
V
IN
= V
CC2
= 3.3 V
V
IN
= V
CC2
= 3.3 V
Outputs disabled
V
OUT
=GND
Outputs disabled
V
OUT
=VCC2
V
CC2
= 3.0 V
I
OL
= 2,4,8,12,16 mA
V
CC2
= 3.0 V
I
OH
= -2,-4,-8,-12,-16 mA
V
CC2
= 3.6 V
V
CC1
= 1.95 V
V
CC2
= 3.6 V, V
CC1
= 1.95 V
V
CC2
= 0 V
V
CC2
= 3.0 V
V
CC2
= 3.0 V
V
CC2
= 3.0 V
V
CC2
= 3.0 V
V
CC2
= 3.0 V
V
CC2
= 3.0 V
Test
Symbol
Group A
subgroups
Min
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
1,2,3
4
9,10,11
9,10,11
9,10,11
9,10,11
9,10,11
9,10,11
-1
2.0
-1
-5
Limits
Max
0.8
Unit
Low level input voltage
High level input voltage
Low level input current
Low level input current Pull-down
Low level input current Pull-up
High level input current
High level input current Pull-up
High level input current Pull-down
Output leakage low current
Output leakage high current
Low level output voltage
high level output voltage
Supply current for array when not
clocked
Operating supply current for array
Input/Output capacitance 1/
Propagation delay, SysClk rising to
MemCsN_0 falling 2/
Propagation delay, SysClk rising to
CanTx_0 rising 2/
Propagation delay, SysClk rising to
Gpio_22 rising 2/
Propagation delay, SysClk rising to
FifoD_1 rising 2/
Propagation delay, SpwClkSrc rising to
SpwDout_P_0 falling 2/
Propagation delay, SpwClkSrc rising to
SpwDout_N_0 rising 2/
V
IL
V
IH
I
IL
I
ILPD
I
ILPU
I
IH
I
IHPU
I
IHPD
I
OZL
I
OZH
V
OL
V
OH
I
CCSBA
I
CCOPA
C
IO
t
P0
t
P1
t
P2
t
P3
t
P4
t
P5
V
V
µA
µA
µA
-400
1
5
600
µA
µA
µA
µA
1
0.4
V
CC2
-0.4
5.3
52
7
18
29
25
16
14
14
µA
V
V
mA
mA
pF
ns
ns
ns
ns
ns
ns
1/
2/
This parameter is tested initially and after major process changes, otherwise guaranteed.
Unless otherwise specified the capacitance load shall be 50 pF in worst case. Input signals dynamic
characteristics: tr, tf < 10 ns Threshold voltages: V
OL
= V
OH
= V
CC
/2.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-10A03
SHEET
A
5
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