• Wide operating power supply range of 3.0V to 5.5V
• Available QML Q or V processes
• 14-lead flatpack
PINOUT
14-Pin Flatpack
Top View
A1
B1
Y1
A2
B2
Y2
V
SS
OUTPUT
B
H
X
L
Y
H
L
L
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
B4
A4
Y4
B3
A3
Y3
FUNCTION TABLE
INPUT
A
H
L
X
LOGIC DIAGRAM
LOGIC SYMBOL
A1
B1
A2
B2
A3
B3
A4
B4
(1)
(2)
(4)
(5)
(9)
(10)
(12)
(13)
(11)
&
(3)
(6)
(8)
Y1
Y2
Y3
Y4
A1
B1
A2
B2
A3
B3
A4
B4
Y4
Y3
Y1
Y2
Note:
1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and
IEC Publication 617-12.
DESCRIPTION
The UT54ACTS08E is a quadruple two-input AND gate. The
circuit performs the Boolean functions Y= A
⋅
B or
Y= A+B
in positive logic.
The devices are characterized over full military temperature
range of -55°C to +125°C.
1
RADIATION HARDNESS SPECIFICATIONS
1
PARAMETER
Total Dose
SEU Threshold
2
SEL Threshold
Neutron Fluence
LIMIT
1.0E6
80
120
1.0E14
UNITS
rads(Si)
MeV-cm
2
/mg
MeV-cm
2
/mg
n/cm
2
Notes:
1. Logic will not latchup during radiation exposure within the limits defined in the table.
2. Device storage elements are immune to SEU affects.
ABSOLUTE MAXIMUM RATINGS
1
SYMBOL
V
DD
V
I/O
T
STG
T
J
T
LS
Θ
JC
I
I
P
D
Note:
1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at these
or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
PARAMETER
Supply voltage
Voltage any pin
Storage Temperature range
Maximum junction temperature
Lead temperature (soldering 5 seconds)
Thermal resistance junction to case
DC input current
Maximum power dissipation
LIMIT
-0.3 to 7.0
-.3 to V
DD
+.3
-65 to +150
+175
+300
20
±10
1
UNITS
V
V
°C
°C
°C
°C/W
mA
W
RECOMMENDED OPERATING CONDITIONS
SYMBOL
V
DD
V
IN
T
C
PARAMETER
Supply voltage
Input voltage any pin
Temperature range
LIMIT
3.0 to 5.5
0 to V
DD
-55 to +125
UNITS
V
V
°C
2
DC ELECTRICAL CHARACTERISTICS FOR THE UT54ACTS08E
7
( V
DD
= 3.0V to 5.5V; V
SS
= 0V
6
; -55°C < T
C
< +125°C)
SYMBOL
V
IL
Description
Low-level input voltage
1
High-level input voltage
1
Input leakage current
Low-level output voltage
3
CONDITION
VDD
3.0V
5.5V
MIN
MAX
0.8
0.8
UNIT
V
V
IH
3.0V
5.5V
2.0
2.75
-1
1
0.4
0.4
2.4
3.15
-100
-200
6
8
-6
-8
1.8
10
1.6
100
200
V
µA
V
V
V
V
mA
I
IN
V
OL
V
IN
= V
DD
or V
SS
I
OL
= 6mA
I
OL
= 8mA
5.5V
3.0V
4.5V
3.0V
4.5V
3.0V
5.5V
V
OH
High-level output voltage
3
I
OH
= -6mA
I
OH
= -8mA
I
OS
Short-circuit output current
2 ,4
V
O
= V
DD
and V
SS
I
OL
Low level output current
10
V
IN
= V
DD
or V
SS
V
OL
= 0.4V
3.0V
5.5V
3.0V
5.5V
5.5V
5.5V
5.5V
mA
I
OH
High level output current
10
V
IN
= V
DD
or V
SS
V
OH
= V
DD
-0.4V
mA
P
total
I
DDQ
∆I
DDQ
Power dissipation
2, 8, ,9
Quiescent Supply Current
Quiescent Supply Current Delta
C
L
= 50pF
V
IN
= V
DD
or V
SS
For input under test
V
IN
= V
DD
- 2.1V
For all other inputs
V
IN
= V
DD
or V
SS
ƒ
= 1MHz
ƒ
= 1MHz
mW/
MHz
µA
mA
C
IN
C
OUT
Input capacitance
5
Output capacitance
5
0V
0V
15
15
pF
pF
Notes:
1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: V
IH
= V
IH
(min) + 20%, - 0%; V
IL
= V
IL
(max) + 0%, - 50%,
as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are guaranteed
to V
IH
(min) and V
IL
(max).
2. Supplied as a design limit but not guaranteed or tested.
3. Per MIL-PRF-38535, for current density
≤5.0E5
amps/cm
2
, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765pF/
MHz.
4. Not more than one output may be shorted at a time for maximum duration of one second.
5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and V
SS
at
frequency of 1MHz and a signal amplitude of 50mV rms maximum.
6. Maximum allowable relative shift equals 50mV.
7. All specifications valid for radiation dose
≤
1E6 rads(Si) per MIL-STD-883 Method 1019 Condition B.
8. Power does not include power contribution of any TTL output sink current
9. Power dissipation specified per switching output.
10. This value is guaranteed based on characterization data, but not tested.
3
AC ELECTRICAL CHARACTERISTICS FOR THE UT54ACTS08E
2
(V
DD
= 3.0V to 5.5V; V
SS
= 0V
1
, -55°C < T
C
< +125°C)
SYMBOL
t
PLH
PARAMETER
Input to Yn
C
L
= 30pF
V
DD
3.0V & 3.6V
4.5V & 5.5V
C
L
= 50pF
3.0V & 3.6V
4.5V & 5.5V
t
PHL
Input to Yn
C
L
= 30pF
3.0V & 3.6V
4.5V & 5.5V
C
L
= 50pF
3.0V & 3.6V
4.5V & 5.5V
Notes:
1. Maximum allowable relative shift equals 50mV.
2. All specifications valid for radiation dose
≤
1E6 rads(Si) per MIL-STD-883 Method 1019 Condition B.
Due to space limitations, I cannot use an external crystal oscillator. I want to use the internal crystal oscillator of the MSP430. I want to ask, what is the highest frequency that can be set after s...
I have recently noticed that the atmosphere in the forum is really good. Everyone has explained the questions in such detail. One question is that when someone has a problem, they will upload an attac...
1. Using AT89C51 microcontroller as the core, design a small system that includes at least keyboard (interrupt), display ( LED and digital tube) and memory. Requirements:
1.Please draw a functional bl...
We are now in urgent need of programmers who can do Linux C/C++ embedded development in Wuhan, mainly for mobile phone interfaces. Therefore, we need people with experience in interface development. P...
After the board is started, it outputs some debug information such as "HW_Init, PWR_Init, PWR_Open, PWR_IOControl, PWR_Close", and then no more debug information. The information output is in the smdk...
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
Dual-mode inverters can operate both in conjunction with the grid and independently. These inverters can inject excess energy from renewable energy and storage devices into the grid, and withdraw p...[Details]
While
the solid-state battery
industry is still engaged in a long technological marathon for
the "ultimate solution" for
electric vehicles
, some companies have begun looking for mor...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
Is electromagnetic radiation from electric vehicles harmful to the human body? Recently, the issue of electromagnetic radiation from electric vehicles has garnered widespread attention. However, pu...[Details]
We are entering a new era where people are increasingly affordably equipped with more electronic gadgets. Electronics have become essential to our lives. For example, the average consumer now owns ...[Details]
summary
There are multiple approaches to making industrial systems more intelligent, including applying artificial intelligence (AI) technology at the edge and in the cloud to sensor...[Details]
As time goes by, people are increasingly concerned about their own and their families' health. However, existing monitoring devices for individual vital signs have struggled to gain market share du...[Details]
Definition of interactive projection system:
Interactive projection systems, also known as multimedia interactive projection, are available in floor, wall, and tabletop interactive projection....[Details]
With the rapid adoption of smart electric vehicles, automotive chips are evolving from auxiliary control units to the foundation of the entire vehicle's intelligence. Their applications extend from...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
Recently, Joyson Electronics has made positive progress in the core technology research and development of the robot's "brain and brain" and key components, and launched the industry's first integr...[Details]
Previously, Positive Motion Technology shared with you the firmware upgrade of motion controller, ZBasic program development, ZPLC program development, communication with touch screen and input/out...[Details]