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SEN02G64C4BH2MT-30R

Description
DDR DRAM Module, 256MX64, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-200
Categorystorage    storage   
File Size432KB,14 Pages
ManufacturerSwissbit
Environmental Compliance
Download Datasheet Parametric View All

SEN02G64C4BH2MT-30R Overview

DDR DRAM Module, 256MX64, 0.45ns, CMOS, ROHS COMPLIANT, DIMM-200

SEN02G64C4BH2MT-30R Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSwissbit
package instructionDIMM,
Reach Compliance Codecompliant
Is SamacsysN
access modeDUAL BANK PAGE BURST
Maximum access time0.45 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-XDMA-N200
length67.6 mm
memory density17179869184 bit
Memory IC TypeDDR DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals200
word count268435456 words
character code256000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height30.15 mm
self refreshYES
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formNO LEAD
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1
Data Sheet
Rev.1.4
24.11.2010
2GB DDR2
– SDRAM SO-DIMM
Features:
200 Pin SO-DIMM
SEN02G64C4BH2MT-25R
2GB PC2-6400 in FBGA Technology
RoHS compliant
Options:
Data Rate / Latency
DDR2 800 MHz CL6
DDR2 667 MHz CL5
DDR2 533 MHz CL4
Module Density
2048MB with 16 dies and 2 ranks
Standard Grade
Grade E
Grade W
(T
A
)
(T
C
)
(T
A
)
(T
C
)
(T
A
)
(T
C
)
0°C to 70°C
0°C to 85°C
0°C to 85°C
0°C to 95°C
-40°C to 85°C
-40°C to 95°C
Marking
-25
-30
-37
200-pin 64-bit Small Outline, Dual-In-Line Double
Data Rate Synchronous DRAM Module
Module organization: dual rank 256M x 64
VDD = 1.8V ±0.1V, V
DDQ
1.8V ±0.1V
1.8V I/O ( SSTL_18 compatible)
Auto Refresh (CBR) and Self Refresh 8k Refresh
every 64ms
Serial Presence Detect with EEPROM
Gold-contact pad
This module is fully pin and functional compatible to
the JEDEC PC2-6400 spec. and JEDEC- Standard
MO-224. (see
www.jedec.org)
The pcb and all components are manufactured
according to the RoHS compliance specification
[EU Directive 2002/95/EC Restriction of Hazardous
Substances (RoHS)]
DDR2 - SDRAM component MICRON
MT47H128M8CF-25 DIE-Revision H
128Mx8 DDR2 SDRAM in FBGA-60 package
Four bit prefetch architecture
DLL to align DQ and DQS transitions with CK
Eight internal device banks for concurrent operation
Programmable CAS latency (CL)
Posted CAS additive latency (AL)
WRITE latency = READ latency – 1 t
CK
Programmable burst length: 4 or 8
Adjustable data-output drive strength
On-die termination (ODT)
* The refresh rate has to be doubled when 85°C>T
C
>95°C
Environmental Requirements:
Operating temperature (ambient
)
Standard Grade
0°C to 70°C
Grade E
0°C to 85°C
Grade W
-40°C to 85°C
Operating Humidity
10% to 90% relative humidity, noncondensing
Operating Pressure
105 to 69 kPa (up to 10000 ft.)
Storage Temperature
-55°C to 100°C
Storage Humidity
5% to 95% relative humidity, noncondensing
Storage Pressure
1682 PSI (up to 5000 ft.) at 50°C
Figure:
mechanical dimensions
1
1
if no tolerances specified ± 0.15mm
Swissbit AG
Industriestrasse 4
CH-9552 Bronschhofen
Fon: +41 (0) 71 913 03 03
Fax: +41 (0) 71 913 03 15
www.swissbit.com
eMail: info@swissbit.com
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