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TS3A4751
SCDS227F – JULY 2006 – REVISED MARCH 2015
TS3A4751 0.9-Ω Low-voltage, single-supply, 4-channel spst analog switch
1 Features
1
3 Description
The TS3A4751 device is a bidirectional, 4-channel,
normally open (NO) single-pole single-throw (SPST)
analog switch that operates from a single 1.6-V to
3.6-V supply. This device has fast switching speeds,
handles rail-to-rail analog signals, and consumes very
low quiescent power.
The digital input is 1.8-V CMOS compatible when
using a 3-V supply.
The TS3A4751 device has four normally open (NO)
switches. The TS3A4751 is available in a 14-pin thin
shrink small-outline package (TSSOP) and in space-
saving 14-pin VQFN (RGY) and micro X2QFN (RUC)
packages.
Device Information
(1)
PART NUMBER
TS3A4751
PACKAGE
TSSOP (14)
VQFN (14)
X2QFN (14)
BODY SIZE (NOM)
5.00 mm × 4.40 mm
3.50 mm × 3.50 mm
2.00 mm × 2.00 mm
•
•
•
•
•
•
•
•
•
Low ON-State Resistance (R
ON
)
– 0.9
Ω
Max (3-V Supply)
– 1.5
Ω
Max (1.8-V Supply)
R
ON
Flatness: 0.4
Ω
Max (3-V)
R
ON
Channel Matching
– 0.05
Ω
Max (3-V Supply)
– 0.15
Ω
Max (1.8-V Supply)
1.6-V to 3.6-V Single-Supply Operation
1.8-V CMOS Logic Compatible (3-V Supply)
High Current-Handling Capacity (100 mA
Continuous)
Fast Switching: t
ON
= 5 ns, t
OFF
= 4 ns
Supports Both Digital and Analog Applications
ESD Protection Exceeds JESD-22
– ±4000-V Human Body Model (A114-A)
– 300-V Machine Model (A115-A)
– ±1000-V Charged-Device Model (C101)
2 Applications
•
•
•
•
•
•
•
•
•
Power Routing
Battery-Powered Systems
Audio and Video Signal Routing
Low-Voltage Data-Acquisition Systems
Communications Circuits
PCMCIA Cards
Cellular Phones
Modems
Hard Drives
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Schematic
SPST
NO1
IN1
SPST
NO2
IN2
SPST
NO3
IN3
SPST
NO4
IN4
COM4
COM3
COM2
COM1
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TS3A4751
SCDS227F – JULY 2006 – REVISED MARCH 2015
www.ti.com
Table of Contents
1
2
3
4
5
6
Features
..................................................................
Applications
...........................................................
Description
.............................................................
Revision History.....................................................
Pin Configuration and Functions
.........................
Specifications.........................................................
6.1
6.2
6.3
6.4
6.5
6.6
6.7
1
1
1
2
3
4
7.3 Feature Description.................................................
13
7.4 Device Functional Modes........................................
13
8
Application and Implementation
........................
14
8.1 Application Information............................................
14
8.2 Typical Application ..................................................
14
Absolute Maximum Ratings ......................................
4
ESD Ratings..............................................................
4
Recommended Operating Conditions.......................
5
Thermal Information ..................................................
5
Electrical Characteristics for 1.8-V Supply................
6
Electrical Characteristics for 3-V Supply ..................
7
Typical Characteristics ............................................
10
9 Power Supply Recommendations......................
16
10 Layout...................................................................
16
10.1 Layout Guidelines .................................................
16
10.2 Layout Example ....................................................
16
11 Device and Documentation Support
.................
17
11.1
11.2
11.3
11.4
11.5
Receiving Notification of Documentation Updates
Community Resources..........................................
Trademarks ...........................................................
Electrostatic Discharge Caution ............................
Glossary ................................................................
17
17
17
17
17
7
Detailed Description
............................................
13
7.1 Overview .................................................................
13
7.2 Functional Block Diagram .......................................
13
12 Mechanical, Packaging, and Orderable
Information
...........................................................
17
4 Revision History
Changes from Revision E (January 2015) to Revision F
•
Page
Changed Supply Voltage from: 3.3 V to: 3.6 V in the
Recommended Operating Conditions
...............................................
5
Changes from Revision D (July 2008) to Revision E
•
Page
Added
Pin Configuration and Functions
section,
ESD Ratings
table,
Feature Description
section,
Device Functional
Modes, Application and Implementation
section,
Power Supply Recommendations
section,
Layout
section,
Device
and Documentation Support
section, and
Mechanical, Packaging, and Orderable Information
section ..............................
1
2
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TS3A4751
Copyright © 2006–2015, Texas Instruments Incorporated
TS3A4751
www.ti.com
SCDS227F – JULY 2006 – REVISED MARCH 2015
5 Pin Configuration and Functions
PW PACKAGE
(TOP VIEW)
NO1
1
COM1
2
NO2
3
COM2
4
IN2
5
IN3
6
GND
7
RGY PACKAGE
(TOP VIEW)
14
13
12
VCC
IN1
IN4
11
NO4
10
9
8
COM4
COM3
NO3
RGY PACKAGE
(BOTTOM VIEW)
COM1
COM4
COM3
NO4
COM2
4
NO2
IN1
IN4
12
11
13
10
2
5
9
VCC
14
8
NO3
NO1
3
6
IN2
IN3
7
1
GND
NO1
1
Exposed
Center
Pad
2
5
3
4
6
7
GND
VCC
14
Exposed
Center
Pad
12
11
13
10
9
8
NO3
COM1
IN1
If the exposed center pad is used, it must be connected as a
secondary ground or left electrically open.
RUC PACKAGE
(TOP VIEW)
RUC PACKAGE
(BOTTOM VIEW)
COM2
COM1
COM4
COM3
NO4
NO3
COM2
4
NO1
NO2
12
IN4
11
10
1
9
2
8
IN1
VCC
13
14
7
6
GND
IN3
VCC
IN1
3
5
6
7
IN2
IN3
GND
14
13
12
11
10
1
2
5
9
3
NO1
COM1
4
NO2
COM2
IN2
COM4
COM3
NO4
NO3
IN4
8
COM4
COM3
IN4
NO2
NO4
IN2
IN3
Copyright © 2006–2015, Texas Instruments Incorporated
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3
TS3A4751
SCDS227F – JULY 2006 – REVISED MARCH 2015
www.ti.com
Pin Functions
PIN
NO.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
NAME
NO1
COM1
NO2
COM2
IN2
IN3
GND
NO3
COM3
COM4
NO4
IN4
IN1
V
CC
I/O
I/O
I/O
I/O
I/O
I
I
—
I/O
I/O
I/O
I/O
I
I
I
Normally open signal path
Common signal path
Normally open signal path
Common signal path
Logic control input
Logic control input
Ground
Normally open signal path
Common signal path
Common signal path
Normally open signal path
Logic control input
Logic control input
Positive supply voltage
DESCRIPTION
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
V
CC
V
NO
V
COM
V
IN
I
NO
I
COM
I
CC
I
GND
V
T
A
T
J
T
stg
(1)
(2)
Supply voltage referenced to GND
(2)
Analog and digital voltage
On-state switch current
Continuous current through V
CC
or GND
Peak current pulsed at 1 ms, 10% duty cycle
Operating temperature
Junction temperature
Storage temperature
–65
COM, V
I/O
–40
V
NO
, V
COM
= 0 to V
CC
–0.3
–0.3
–100
MAX
4
V
CC
+ 0.3
100
±100
±200
85
150
150
UNIT
V
V
mA
mA
mA
°C
°C
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating
Conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Signals on COM or NO exceeding V
CC
or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.
6.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
V
(ESD)
Electrostatic discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101
or ANSI/ESDA/JEDEC JS-002
(2)
Machine Model
(1)
(2)
±4000
±1000
±300
V
UNIT
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
4
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Copyright © 2006–2015, Texas Instruments Incorporated
TS3A4751
www.ti.com
SCDS227F – JULY 2006 – REVISED MARCH 2015
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
V
CC
V
NO
V
COM
V
IN
Supply Voltage
Analog and digital voltage range
1.65
0
MAX
3.6
V
CC
UNIT
V
V
6.4 Thermal Information
TS3A4751
THERMAL METRIC
(1)
R
θJA
R
θJC(top)
R
θJB
ψ
JT
ψ
JB
R
θJC(bot)
(1)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
PW
132.3
60.6
74.2
11.2
73.6
N/A
RGY
14 PINS
68.5
83.1
44.6
7.8
44.7
24.6
196.4
73.9
130.7
2.1
130.6
N/A
°C/W
RUC
UNIT
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
SPRA953.
Copyright © 2006–2015, Texas Instruments Incorporated
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