Product Specification
108-60038
CHAMP .050(I) Board-to-Board Connector
Lead Free Version
1.
Scope:
1.1 Contents:
This specification covers the requirements for product performance, test methods and quality
assurance provisions of CHAMP .050 (I) Board-to-Board Connector.
The applicable product description and part numbers are as shown in Fig. 1:
2.
Applicable Documents
The following documents form a part of this specification to the extent specified herein. In
the event of conflict between the requirements this specification and the product drawing, the
product drawing shall take precedence. In the event of conflict between the requirements
this specification and referenced documents, this specification shall take precedence.
2.1
AMP Specifications:
A. 109-5000: Test Specification, General Requirements for Test Methods
B. 501-60009: Test Report (Dip Type)
2.2
Military Standard and Specifications:
MIL-STD-202
Test Methods for Electronic and Electrical Component Parts
DR
CHK
APP
C. WANG
S. YAO
I. ENOMOTO
NO
Tyco Electronics
AMP Shanghai Ltd
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REVISION RECORD
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CHAMP .050 (I) Board-to-Board connector
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3.
Requirements:
Product shall be of the design, construction and physical dimensions specified in the applicable
Product drawing.
3.1 Design and Construction:
3.2
Materials:
A. Contact:
Phosphor Bronze
1. 3 m minimum thick nickel underplate
0.2 µm, 0.5 µm and 0.76 µm minimum thick gold-plated on contact area
only.
1.0 µm minimum thick solder-plated on tine area only.
B. Housing and Tine Plate: Molded Thermoplastic
C. Accessories and Hardware:
Retention Leg:
Brass
1 µm minimum thick nickel underplate
2 µm minimum thick solder-plated
3.3 Ratings:
A.
B.
Voltage Rating:
Current Rating:
250 VAC
1A
-55°C~85°C
C. Temperature Rating:
3.4
Performance and Test Descriptions:
The product shall be designed to meet the electrical, mechanical and environmental performance
requirements specified in Fig. 1. All tests shall be performed in the room temperature unless
otherwise specified.
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3.5 Test Requirements and Procedures Summary
Pare.
3.5.1
Test Items
Confirmation of
Product
Requirements
Product shall be
conforming to the
requirements of a
applicable product
drawing,
35 m
max.(Initial)
max.(Final)
Procedures
Visually, dimensionally and
functionally inspected per
applicable inspections plan.
Electrical Requirements
3.5.2
Termination
Resistance
(Low Level)
R=20 m
Subject mated contacts assembled
in housing to closed circuit of 50
mA max. at open circuit voltage of
50 mV max. Fig.3.
AMP Spec. 109-5306
3.5.3
Insulation Resistance
1,000 M
100 M
MIN. (Initial)
Min. (Final)
Measure by applying test potential
between the adjacent contacts, and
between the contacts and ground in
the mated connector.
MIL-STD-202,
Method 302,Condition B
3.5.4
Dielectric Strength
Connector must withstand
test potential of 0.5 KVAC
for 1 minute. Current
leakage must be 0.5mA
max.
30°C
max. under loaded
specified current.
Measure by applying test potential
between the adjacent contacts, and
between the contacts and ground in
the mated connectors.
MIL-STD-202, Method 301
Measure temperature rising by
energized current.
Fig.3.
AMP Spec.109-5310
3.5.5
Temperature Rising
vs. Curent
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Para.
Test Items
Requirements
Physical Requirements
Procedures
3.5.6
Vibration Sinusoidal
Low Frequency
No electrical discontinuity
greater than 1 microsecond
(s) shall occur.
Subject mated connectors to 10-55-
10 Hz traversed in 1 minute at 1.52
mm amplitude 2 hours each of 3
mutually perpendicular planes.
MIL-STD-202, Method 201
Subject mated connectors to 50 G’s
halfsine shock pulses of 11
millisecond duration:3 shocks in
each direction applied along the 3
mutually perpendicular planes
totally 18shocks;MIL-STD-
202,Method 213,Condition A
Using autograph, measure the force
required to mate connector using
locking latch by operating at 100
mm a minute. Calculate the value
for a contact. AMP Spec. 109-5206
Using autograph, measure the force
required to unmate connector
without locking latch set in effect,
by operating at 100 mm a minute.
Calculate value for a contact. AMP
Spec. 109-5206
Mate and unmate connectors for
500 cycles at a maximum rate of 40
cycles minute. AMP Spec. 109-27
With the connector mounted on
PCB. immerse in melted soldering
tub so that the lower surface of PCB
get wetted in the temperature of
230°C±5°C PCB for 5 seconds.
3.5.7
Physical Shock
No electrical discontinuity
greater than 1 microsecond
(s) shall occur.
3.5.8
Connector Mating
Force
90 g max. per contact
3.5.9
Connector Unmating
Force
15 g min. per contact
3.5.10
Durability (Repeated
Mate/Unmating)
Solderability
The requirements per
Para.3.5.2 shall be met.
Solderable area shall have a
solder coverage of 95%
minimum.
3.5.11
Fig.1 (To be continued)
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Para.
3.5.12
Test items
Resistance to
Soldering Heat
(Dip Type)
Requirements
No physical damage shall
occur.
Procedures
Subject connector mounted on
printed circuit boards to solder bath
at 260±5°C for 5 seconds.
MIL-STD-202, Method 210 except
as indicated above
3.5.13
Thermal Shock
The requirements per Para.
3.5.2 shall be met.
Subject mated connectors to 5
cycles between –55 +0/-3 °C and
+85 +3/-0 °C. MIL-STD-202,
Method 107,Condition A
Subject mated connectors to 10
cycles of humidity-temperature
changes between 25°C and 65°C at
95% R.H.
Subject mated connectors to 5% salt
concentration for 48 hours;
3.5.14
Humidity-
Temperature Cycling
The requirements per
Paras.3.5.2, 3.5.3, and
3.5.4 shall be met.
The requirements per Para.
3.5.2 shall be met.
3.5.15
Salt Spay
MIL-STD-202, Method 101
Condition B.
3.5.16
Temperature Life
The requirements per Para.
3.5.2 shall be met.
Subject mated connectors to
temperature life;85°C±2°C, 250
hours
MIL-STD-202, Method 108
Condition B.
3.5.17
Sulfurous acid gas
The requirements per Para.
3.5.2 shall be met.
Subject mated connectors to
sulfurous acid gas of 10±3ppm
concentration in the room
temperature with 90% min. R.H. for
48 hours.
Fig.1 (End)
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Embedded System
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