The information given in this document are as a guideline only. We reserve the right to modify our products in any way we deem necessary. Any duplication is prohibited, unless approved in writing.
E13/B
Shell Plating
1
= Bright Tin / Nickel
2
= Nickel
Contact Plating
0
1
2
3
4
=
=
=
=
=
Flash Fold
0.4µm (15µ") Gold
0.76µm (30µ") Gold
Full Flash Gold
1.27µ” (50µ") Gold
Bottom Connector
1
2
3
4
5
6
7
8
9
K
D
E
F
G
M
N
P
Q
R
S
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
=
9 Pos. Male
9 Pos. Female
15 Pos. Male
15 Pos. Female
25 Pos. Male
25 Pos. Female
15 Pos. High Density Female
50 Pos. Female SCSI
26 Pos. High Density Female
15 Pos. High Density Male
37 Pos. Male
37 Pos. Female
44 Pos. High Density Male
44 Pos. High Density Female
62 Pos. High Density Male
62 Pos. High Density Female
78 Pos. High Density Male
78 Pos. High Density Female
9 Pos. Male + 9 Pos. Male
9 Pos. Female + 9 Pos. Female
For special request, please consult factory
Do not hesitate to contact us for further information
T WS headset hardware design
--- Basics
Author: Cao Lide
Date: 2021-11-28The above is a single-chip T WS Bluetooth headset solution , the main control chip is A TS3015. Other main components are:
3. W...
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Analog electronics
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