M36DR432B120ZA6C datasheet, PDF

M36DR432B120ZA6C: DescriptionSPECIALTY MEMORY CIRCUIT, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66; Categorystorage storage; File Size325KB，46 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M36DR432B120ZA6C Overview

SPECIALTY MEMORY CIRCUIT, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	0.80 MM PITCH, STACK, LFBGA-66
Contacts	66
Reach Compliance Code	not_compliant
Maximum access time	120 ns
Other features	THE DEVICE ALSO CONTAINS A 4 MBIT (256K X16) SRAM
JESD-30 code	R-PBGA-B66
JESD-609 code	e0
length	12 mm
memory density	33554432 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Mixed memory types	FLASH+SRAM
Number of functions	1
Number of terminals	66
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA66,8X12,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
power supply	1.8/2 V
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum slew rate	0.04 mA
Maximum supply voltage (Vsup)	2.2 V
Minimum supply voltage (Vsup)	1.65 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm

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