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UPD44325182F5-E50Y-EQ2-A

Description
QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 15 MM, LEAD FREE,PLASTIC, BGA-165
Categorystorage    storage   
File Size479KB,40 Pages
ManufacturerNEC Electronics
Environmental Compliance
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UPD44325182F5-E50Y-EQ2-A Overview

QDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 15 X 15 MM, LEAD FREE,PLASTIC, BGA-165

UPD44325182F5-E50Y-EQ2-A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
package instructionLBGA,
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time0.45 ns
JESD-30 codeS-PBGA-B165
JESD-609 codee1
length15 mm
memory density37748736 bit
Memory IC TypeQDR SRAM
memory width18
Number of functions1
Number of terminals165
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX18
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.51 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
Base Number Matches1
DATA SHEET
MOS INTEGRATED CIRCUIT
μ
PD44325082, 44325092, 44325182, 44325362
36M-BIT QDR
TM
II SRAM
2-WORD BURST OPERATION
Description
The
μ
PD44325082 is a 4,194,304-word by 8-bit, the
μ
PD44325092 is a 4,194,304-word by 9-bit, the
μ
PD44325182 is a
2,097,152-word by 18-bit and the
μ
PD44325362 is a 1,048,576-word by 36-bit synchronous quad data rate static RAM
fabricated with advanced CMOS technology using full CMOS six-transistor memory cell.
The
μ
PD44325082,
μ
PD44325092,
μ
PD44325182 and
μ
PD44325362 integrate unique synchronous peripheral
circuitry and a burst counter. All input registers controlled by an input clock pair (K and K#) are latched on the positive
edge of K and K#.
These products are suitable for application which require synchronous operation, high speed, low voltage, high density
and wide bit configuration.
These products are packaged in 165-pin PLASTIC BGA.
Features
1.8 ± 0.1 V power supply
165-pin PLASTIC BGA (13 x 15)
HSTL interface
PLL circuitry for wide output data valid window and future frequency scaling
Separate independent read and write data ports with concurrent transactions
100% bus utilization DDR READ and WRITE operation
Two-tick burst for low DDR transaction size
Two input clocks (K and K#) for precise DDR timing at clock rising edges only
Two output clocks (C and C#) for precise flight time and clock skew matching-clock
and data delivered together to receiving device
Internally self-timed write control
Clock-stop capability. Normal operation is restored in 1,024 cycles after clock is resumed.
User programmable impedance output
Fast clock cycle time : 4.0 ns (250 MHz), 5.0 ns (200 MHz)
Simple control logic for easy depth expansion
JTAG boundary scan
<R>
Operating ambient temperature: Commercial T
A
= 0 to +70°C
Industrial
T
A
= –40 to +85°C
(-E40, -E50)
(-E50Y)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. M16783EJ4V0DS00 (4th edition)
Date Published July 2008
Printed in Japan
2003,2008
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
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